Supercharge Your Innovation With Domain-Expert AI Agents!

Graphene oxide enhanced photosensitive cover film composition

A technology for covering films and compositions, applied in the directions of optics, opto-mechanical equipment, and photosensitive materials for opto-mechanical equipment, etc., can solve the problems of decreased covering power, limited application, and limited improvement.

Pending Publication Date: 2021-06-08
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent can improve the flexibility of the protective film to a certain extent (the number of bending times of the protective film without cracks is more than 2 times, up to 14 times), but the improvement level is limited, and the carbon black is replaced by a perylene-based black colorant. Decreased hiding power will limit its application

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Graphene oxide enhanced photosensitive cover film composition
  • Graphene oxide enhanced photosensitive cover film composition
  • Graphene oxide enhanced photosensitive cover film composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A graphene oxide enhanced photosensitive cover film composition, which is formed by mixing and curing the following raw materials: 20g alkali-soluble photosensitive epoxy acrylic resin GE8988C (acid value 90mgKOH / g, solid content 60%), 5g alkali-soluble photosensitive epoxy acrylic resin Resin ZAR-1035 (acid value 100mgKOH / g, solid content 64%), 4g acrylate monomer (including 2.0g 9EOTMPTA, 2.0g BP(EO)10DA), 0.3g photopolymerization initiator (including 0.05g TR-PBG -304, 0.2g TPO, 0.05gDETX), 4g thermal curing agent (including 2.5g BNE-200 epoxy resin, 1.5g TTA21P epoxy resin), 0.01g boron trifluoride ethylamine latent curing accelerator, 0.2g carbon Black MA-7, 0.01g industrial grade graphene oxide, 2.0g light diffusing agent EP-2601, 0.6g other additives (including 0.3g dispersant BYK168, 0.1g leveling agent BYK 394, 0.1g defoamer BYK354, 0.1g adhesion promoter ADP-S478). When preparing the graphene oxide-enhanced photosensitive cover film composition, the above-men...

Embodiment 2

[0036] A graphene oxide enhanced photosensitive cover film composition, which is formed by mixing and curing the following raw materials: 20g alkali-soluble photosensitive epoxy acrylic resin GE8988C (acid value 90mg KOH / g, solid content 60%), 5g alkali-soluble photosensitive epoxy Acrylic resin ZAR-1035 (acid value 100mg KOH / g, solid content 64%), 4g acrylate monomer (of which 2.0g 9EOTMPTA, 2.0gBP(EO)10DA), 0.3g photopolymerization initiator (of which 0.05g TR- PBG-304, 0.2g TPO, 0.05gDETX), 4g thermal curing agent (including 2.5g BNE-200 epoxy resin, 1.5g TTA21P epoxy resin), 0.01g boron trifluoride ethylamine latent curing accelerator, 0.2g Carbon black MA-7, 0.05g industrial grade graphene oxide, 2.0g light diffusing agent EP-2601, 0.6g other additives (including 0.3g dispersant BYK168, 0.1g leveling agent BYK 394, 0.1g defoamer BYK354 , 0.1g adhesion promoter ADP-S478). When preparing the graphene oxide-enhanced photosensitive cover film composition, the above-mentioned...

Embodiment 3

[0038] A graphene oxide enhanced photosensitive cover film composition, which is formed by mixing and curing the following raw materials: 20g alkali-soluble photosensitive epoxy acrylic resin GE8988C (acid value 90mgKOH / g, solid content 60%), 5g alkali-soluble photosensitive epoxy acrylic resin Resin ZAR-1035 (acid value 100mgKOH / g, solid content 64%), 4g acrylate monomer (including 2.0g 9EOTMPTA, 2.0g BP(EO)10DA), 0.3g photopolymerization initiator (including 0.05g TR-PBG -304, 0.2g TPO, 0.05gDETX), 4g thermal curing agent (including 2.5g BNE-200 epoxy resin, 1.5g TTA21P epoxy resin), 0.01g boron trifluoride ethylamine latent curing accelerator, 0.2g carbon Black MA-7, 0.1g industrial grade graphene oxide, 2.0g light diffusing agent EP-2601, 0.6g other additives (including 0.3g dispersant BYK168, 0.1g leveling agent BYK 394, 0.1g defoamer BYK354, 0.1g adhesion promoter ADP-S478). When preparing the graphene oxide-enhanced photosensitive cover film composition, the above-ment...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Glass transition temperatureaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of printed circuit board protective films, and particularly discloses a graphene oxide enhanced photosensitive cover film composition. The invention relates to an alkali-soluble acrylic resin, which is at least prepared by mixing and curing the following raw materials in parts by weight: 100 parts of alkali-soluble resin, 10-40 parts of an acrylic monomer, 0.1-10 parts of a photopolymerization initiator, 10-60 parts of a thermal curing agent, 0.01-10 parts of graphene oxide and 0.1-10 parts of a coloring agent. Compared with the prior art, the composition has the advantages that the flexibility is obviously improved, the mechanical property is excellent, carbon black can be used as a coloring agent, and the resolution ratio is high.

Description

technical field [0001] The invention belongs to the technical field of protective films for printed circuit boards, and in particular relates to a graphene oxide enhanced photosensitive cover film composition. Background technique [0002] In recent years, the popularization and performance improvement of smartphones and tablet terminals are rapidly advancing. For information equipment terminals represented by them, consumers have high requirements for miniaturization and thinning. In order to respond to this demand, the internal circuit board of the product needs Develop towards high density and minimum space. Therefore, applications of flexible printed wiring boards that can be accommodated in a curved manner and that can increase the degree of freedom in circuit arrangement are expanding. [0003] In the manufacturing process of printed circuit boards, in order to protect the wiring (circuit) pattern on the substrate from the external environment, or to prevent solder fr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCG03F7/004G03F7/027H05K3/287
Inventor 徐文前童荣柏林晓英罗英武
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com