Sapphire cutting fluid and preparation method thereof

A cutting fluid and sapphire technology, applied in the petroleum industry, lubricating compositions, etc., can solve problems such as broken wires, substandard flatness, and short life

Pending Publication Date: 2021-06-18
广西珀源新材料有限公司
View PDF16 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

None of the above patents mentioned that in the cutting of large-size sapphires, problems such as edge chipping, broken wires, short life, and substandard flatness will become more prominent
[0004] The purpose of the present invention is to provide a sapphire cutting fluid capable of improving problems such as edge chipping, broken wires, short life, and substandard flatness in sapphire cutting, especially large-size sapphire cutting.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sapphire cutting fluid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Embodiment 1 of the present invention provides a kind of sapphire cutting fluid, the preparation raw material of described cutting fluid comprises, by weight, 44 parts of small molecular organic solvents, 20 parts of water, 5 parts of extreme pressure lubricants, 2 parts of dispersants , 3 parts of wetting defoamer, 10 parts of wetting agent, 16 parts of emulsifier, 0.5 part of rust inhibitor, 0.5 part of bactericide, 1 part of alkaline buffer;

[0091] The small molecule organic solvent is a small molecule alcohol solvent and a small molecule alcohol ether solvent; the weight ratio of the small molecule alcohol solvent to the small molecule alcohol ether solvent is 1.1:1; the small molecule alcohol solvent is Propylene glycol; The small molecule alcohol ether solvent is ethylene glycol monomethyl ether (CAS No.: 109-86-4);

[0092] Described water is distilled water;

[0093] The extreme pressure lubricant triethanolamine extreme pressure lubricant; the triethanolamin...

Embodiment 2

[0103] Embodiment 2 of the present invention provides a kind of sapphire cutting fluid, the preparation raw material of described cutting fluid comprises, by weight, 45 parts of small molecular organic solvents, 15 parts of water, 8 parts of extreme pressure lubricants, 2 parts of dispersants , 4 parts of wetting defoamer, 7 parts of wetting agent, 17 parts of emulsifier, 0.5 part of rust inhibitor, 0.5 part of bactericide, 1 part of alkaline buffer;

[0104] The small molecule organic solvent is a small molecule alcohol solvent and a small molecule alcohol ether solvent; the weight ratio of the small molecule alcohol solvent to the small molecule alcohol ether solvent is 0.8:1; the small molecule alcohol solvent is Diethylene glycol (CAS No.: 111-46-6); the small molecule alcohol ether solvent is ethylene glycol monoethyl ether (CAS No.: 110-80-5);

[0105] Described water is distilled water;

[0106] The extreme pressure lubricant is triethanolamine extreme pressure lubrica...

Embodiment 3

[0116] Embodiment 3 of the present invention provides a sapphire cutting fluid, and its specific implementation method is the same as that of Embodiment 1, except that there is no small molecule alcohol ether solvent.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention belongs to the technical field of semiconductor hard and brittle material processing, and particularly relates to sapphire cutting fluid and a preparation method thereof. The cutting fluid is prepared from the following raw materials: a micromolecular organic solvent, water, an extreme pressure lubricant, a dispersing agent, a wetting defoaming agent, a wetting agent, an emulsifying agent, an anti-rust agent, a sterilizing agent and an alkaline buffering agent. According to the invention, the sapphire cutting fluid disclosed by the invention is mainly applied to the diamond wire cutting industry of sapphire with various sizes and morphologies, solves the problems of edge breakage and other poor edges which are easy to occur when the sapphire cutting fluid is used for cutting, and is not easy to cause the problem of short wires in the cutting process; and after cutting, the flatness performance of TTV, LTV, WARP, BOW and the like meets the requirements, and the sapphire cutting fluid has good recycling performance.

Description

technical field [0001] The invention belongs to the technical field of semiconductor hard and brittle materials processing, and in particular relates to a sapphire cutting fluid and a preparation method thereof. Background technique [0002] The sapphire ingot is made of 4N-5N high-purity alumina through a series of processes such as melting, crystal pulling, rod extraction, and corner cutting. Sapphire has high strength, high hardness, and good thermal stability; in addition, it also has good mechanical, optical, and thermal properties, and is widely used in scientific research, industry, and national defense. As people's research on the application of sapphire continues to deepen, the application range of sapphire will continue to increase, and the amount of sapphire will increase steadily. Specific growth points include: (1) With the support of the national energy conservation and emission reduction policy for LED general lighting, the demand for sapphire used in LED sub...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02C10N30/06C10N30/12
CPCC10M173/02C10M2207/022C10M2207/046C10M2215/042C10M2201/085C10M2209/104C10M2209/103C10M2209/108C10M2209/109C10M2215/223C10M2219/104C10M2207/122C10M2227/061C10M2209/084
Inventor 吕德沈家华陈韬苏光临
Owner 广西珀源新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap