Sapphire cutting fluid and preparation method thereof

Abstract

The invention belongs to the technical field of semiconductor hard and brittle material processing, and particularly relates to sapphire cutting fluid and a preparation method thereof. The cutting fluid is prepared from the following raw materials: a micromolecular organic solvent, water, an extreme pressure lubricant, a dispersing agent, a wetting defoaming agent, a wetting agent, an emulsifying agent, an anti-rust agent, a sterilizing agent and an alkaline buffering agent. According to the invention, the sapphire cutting fluid disclosed by the invention is mainly applied to the diamond wire cutting industry of sapphire with various sizes and morphologies, solves the problems of edge breakage and other poor edges which are easy to occur when the sapphire cutting fluid is used for cutting, and is not easy to cause the problem of short wires in the cutting process; and after cutting, the flatness performance of TTV, LTV, WARP, BOW and the like meets the requirements, and the sapphire cutting fluid has good recycling performance.

Description

technical field [0001] The invention belongs to the technical field of semiconductor hard and brittle materials processing, and in particular relates to a sapphire cutting fluid and a preparation method thereof. Background technique [0002] The sapphire ingot is made of 4N-5N high-purity alumina through a series of processes such as melting, crystal pulling, rod extraction, and corner cutting. Sapphire has high strength, high hardness, and good thermal stability; in addition, it also has good mechanical, optical, and thermal properties, and is widely used in scientific research, industry, and national defense. As people's research on the application of sapphire continues to deepen, the application range of sapphire will continue to increase, and the amount of sapphire will increase steadily. Specific growth points include: (1) With the support of the national energy conservation and emission reduction policy for LED general lighting, the demand for sapphire used in LED sub...

AI Technical Summary

Problems solved by technology

None of the above patents mentioned that in the cutting of large-size sapphires, problems such as edge chipping, broken wires, short life, and substandard flatness will become more prominent

[0004] The purpose of the present invention is to provide a sapphire cutting fluid capable of improving problems such as edge chipping, broken wires, short life, and substandard flatness in sapphire cutting, especially large-size sapphire cutting.

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