Solar cell lamination passivation structure and preparation method thereof
A solar cell and stacking technology, applied in the field of solar energy, can solve problems such as high production cost and danger, and achieve the effects of enhancing light reflection effect and improving interface chemical passivation effect.
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[0104] In the present invention, as a specific embodiment, the solar cell stack passivation structure includes a P-type silicon substrate, and the front of the P-type silicon substrate is sequentially provided with an emitter junction region and a first SiN substrate from inside to outside. x film, the Ag electrode goes through the first SiN x The emitter junction area is connected behind the film, and the back of the P-type silicon substrate is sequentially provided with a second SiO 2 Film, SiO x N y film and the second SiN x film, the Al back field sequentially passes through the second SiN x Film, SiO x N y film and the second SiO 2 The film is then in contact with the P-type silicon substrate.
[0105] The emitter junction region includes the N ++ Heavy diffusion area, N + light diffusion region and the first SiO 2 membrane.
[0106] Second SiO 2 The film thickness is 0-10 nm. SiO x N y The film is deposited by PECVD with a thickness of 1nm-100nm. The seco...
Embodiment 1
[0134] This embodiment provides a solar cell stack passivation structure, such as figure 2 with image 3 As shown, the solar cell passivation structure includes a P-type silicon substrate 1, and a first dielectric layer 2, a second dielectric layer 3 and a third dielectric layer are sequentially arranged on the back of the P-type silicon substrate 1 from inside to outside. 4. After passing through the third dielectric layer 4, the second dielectric layer 3 and the first dielectric layer 2 in sequence, connect the aluminum back field 5 of the P-type silicon substrate 1, from the inside to the front of the P-type silicon substrate 1. outside sequentially set the N ++ Heavy diffusion area 7, N + light diffusion region 8 , fourth dielectric layer 9 and fifth dielectric layer 6 . A solar cell stack passivation structure provided in this embodiment also includes a front-side Ag electrode 10, and the front-side Ag electrode 10 penetrates the fifth dielectric layer 6 and the fourt...
Embodiment 2
[0151] The solar cell stack passivation structure provided in this embodiment refers to Embodiment 1, the difference is that the first dielectric layer 2 is a silicon oxide film with a thickness of 2nm, and the second dielectric layer 3 is a silicon nitride oxide film, nitrogen A laminated film composed of a silicon carbide film and a silicon carbide film, the total thickness of the laminated film is 20nm, and the refractive index is 1.7. The third dielectric layer 4 is two layers of silicon nitride films with a thickness of 20nm and 40nm respectively. + The diffusion square resistance of the light diffusion area 8 is 150ohm / sq, N ++ The diffusion resistance of the heavy diffusion region 7 is 75ohm / sq, and the fourth dielectric layer 9 is SiO 2 film with a thickness of 2nm, and the fifth dielectric layer 6 is a silicon nitride film with a thickness of 75nm and a refractive index of 2.0.
[0152] The second dielectric layer 3 is a stacked film composed of a silicon nitride oxi...
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Abstract
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