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Method for using silver ion accelerant as additive for improving palladium plating rate in chemical palladium plating solution

An accelerator, chemical plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of reducing plating efficiency, affecting the processing performance of the coating, and affecting the stability of the plating solution, to improve the deposition. effect of speed

Active Publication Date: 2021-06-22
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the plating temperature is increased, the decomposition rate of some components will be faster, the stability of the plating solution will be affected, the plating effect will be reduced, and the compactness of the plating layer will also be affected; in addition, hypophosphite or boron with strong reducing ability The compound will introduce elements such as P and B in the coating, which will affect the processing performance of the coating; in the case of low palladium ion concentration in the plating solution, it is crucial to adopt a suitable accelerator to improve the deposition rate, such as Chinese patent ( CN107002242A) discloses adding bisphenol A in the electroless palladium plating bath to improve rate, Chinese patent (CN107109653A) discloses that electroless palladium plating bath adds valeraldehyde, improves palladium layer deposition rate

Method used

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  • Method for using silver ion accelerant as additive for improving palladium plating rate in chemical palladium plating solution
  • Method for using silver ion accelerant as additive for improving palladium plating rate in chemical palladium plating solution
  • Method for using silver ion accelerant as additive for improving palladium plating rate in chemical palladium plating solution

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Experimental program
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Effect test

Embodiment 1

[0033] The composition of the electroless palladium plating solution is shown in Table 1, and the pH of the plating solution is adjusted to 6.5 with ammonia water. Firstly, a 10×10mm copper substrate is subjected to degreasing, micro-etching, pickling, and activation followed by nickel plating, and then electroless palladium plating is performed on the nickel substrate using the palladium plating solution of the present invention for 15 minutes at a plating temperature of 55°C. After the palladium plating is finished, wash with water, dry and measure the thickness of the palladium layer with an X-ray fluorescence coating thickness gauge to obtain a flat palladium layer with an average thickness of 0.15±0.01um. The obtained palladium layer was observed under a scanning electron microscope with a magnification of 5000 times, and the surface of the palladium film could be observed to be uniform and smooth.

Embodiment 2～4

[0035] The preparation method of this embodiment is the same as that of Example 1, and its formulation is shown in Table 1.

[0036] The formula (part) of table 1 embodiment 1~4

[0037]

[0038]

Embodiment 5～8

[0040] The preparation method of embodiment 5~8 is the same as embodiment 1, and its formula is shown in table 2.

[0041] The formula (part) of table 2 embodiment 5~8

[0042]

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Abstract

The invention provides a method for using a silver ion accelerant as an additive for improving a palladium plating rate in a chemical palladium plating solution. The concentration of the silver ion accelerant is 0.01-0.05 g / L. According to the method, the metal ion accelerant is added to a chemical palladium plating solution system, and therefore the palladium ion deposition speed can be increased; the same effect on a low-concentration palladium ion chemical palladium plating solution is achieved; the crystallinity and morphology of palladium in a coating are regulated and controlled through addition of the accelerant, and the compact coating can be obtained; and the deposition rate is greater than or equal to 0.10 [mu] m / 15min.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a method in which a silver ion promoter is used as an additive for improving the palladium plating rate in an electroless palladium plating solution. Background technique [0002] At present, gold plating is the first choice when high reliability surface treatment is required in dual-inline package circuits and various other hybrid circuits. In the ENIG process of printed circuit board (PCB) surface treatment technology, gold deposition is through nickel-gold displacement reaction, and the problem of "black plate" is prone to occur in this process. The Ni-P corrosion problem is solved by adding a palladium layer (ENEPIG process) between the nickel layer and the gold layer in the ENIG process. The addition of palladium layer can not only suppress the "black disk" phenomenon, but also act as a barrier layer on the nickel surface, reducing the formation of compounds (CuNi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 郝志峰黄静梦胡光辉谭桂珍吴博催子雅王斌许润峰
Owner GUANGDONG UNIV OF TECH