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Preparation method of plasma modified hexagonal boron nitride/resin composite material

A technology of hexagonal boron nitride and plasma, which is applied in the field of preparation of plasma modified hexagonal boron nitride/resin high thermal conductivity composite materials, can solve the problem of difficult peeling of layers, difficult surface modification and poor performance of composite materials And other problems, to achieve the effect of improving the connection, low cost, and increasing the reaction rate

Active Publication Date: 2021-07-13
NANJING UNIV OF POSTS & TELECOMM
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, hBN also has excellent oxidation resistance and chemical corrosion resistance; but at the same time, because of the physical and chemical inertness of boron nitride, it is difficult to peel off the layers and it is difficult to modify the surface
As a result, the traditional preparation process makes the two phases between the filler and the matrix difficult to be compatible, so that the prepared composite material has poor performance
In recent years, people have tried to use chemical cross-linking agents to modify boron nitride, but the use of cross-linking agents makes the polymer doped with redundant materials, which has a certain impact on equipment and the environment, and most reactions require high temperature High pressure, long preparation cycle and other conditions

Method used

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  • Preparation method of plasma modified hexagonal boron nitride/resin composite material
  • Preparation method of plasma modified hexagonal boron nitride/resin composite material
  • Preparation method of plasma modified hexagonal boron nitride/resin composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Embodiment 1: Modified boron nitride / epoxy resin thermally conductive composite material.

[0021] Step 1, place the boron nitride powder in the quartz tube, pass in an inert gas of 9.6sccmAr, control the pressure inside the quartz tube to 280Pa, turn on the radio frequency source (set power 300W) to generate plasma, and heat the toluene at the bottom of the quartz tube. Free radicals deposit on the surface of boron nitride and form a coating film to prepare modified boron nitride (FBN).

[0022] Step 2, mix EP and curing agent T-31, heat and stir until the resin is completely dissolved, then add the above-mentioned FBN powder to it, and continue to maintain the temperature and stir. The temperature of heating and stirring was 40°C.

[0023] Step 3: Pre-cure the FBN resin mixture at 80°C for 30 minutes, then perform hot pressing at 220MPa and 80°C, and finally take out the pressed sheet and perform the final heat curing at 120°C for 1 hour to obtain a composite materia...

Embodiment 2

[0024] Example 2: Modified boron nitride / polyvinyl alcohol thermally conductive composite material.

[0025] Step 1, place the boron nitride powder in the quartz tube, pass in an inert gas of 9.6sccmAr, control the pressure inside the quartz tube to 280Pa, turn on the radio frequency source (set power 300W) to generate plasma, and heat the deionized water at the bottom of the quartz tube. Free radicals are grafted on the surface of boron nitride to prepare modified boron nitride (FBN).

[0026] Step 2: Mix the modified boron nitride powder with polyvinyl alcohol solution (mass fraction: 25wt%), then place the mixture in an oven, dry it at 80°C for 90 minutes, and take it out for hot pressing at 220MPa and 80°C.

[0027] Step 3, finally take out the pressed tablet (mass fraction 87.60wt%), use the German NETZSCH LFA467 thermal conductivity meter to measure the thermal diffusivity of the composite material, and its in-plane thermal diffusivity is 7.606 mm 2 / s, the vertical the...

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Abstract

The invention discloses a preparation method of a plasma modified hexagonal boron nitride / resin composite material. The composite material is characterized in that a boron nitride filler is used as a main body, resin is used as a matrix, and a high-thermal-conductivity composite material is prepared mainly through plasma treatment. Through plasma discharge treatment, a compound is dissociated into free radicals in a gas phase, and then the free radicals are deposited on the surface of boron nitride to form a coating film; two molecular chain segments of the coating film and the resin matrix are mutually infiltrated at a two-phase interface, so that good adhesion is formed, the conditions that a traditional filler and the resin matrix are relatively difficult to be compatible and are not uniformly dispersed are improved, and the heat conductivity of the composite material is further improved.

Description

technical field [0001] The invention relates to a preparation method of a plasma-modified hexagonal boron nitride / resin high thermal conductivity composite material, and belongs to the technical field of polymer chemistry and thermal management materials and their preparation. Background technique [0002] With the wide application of electronic products and electronic integration, the problem of heat dissipation of electronic components has become increasingly prominent. During use, poor thermal conductivity will cause the temperature of the working environment to rise sharply, which will affect the stability of electronic devices and even cause damage to the devices. Aluminum and copper are the most common heat-conducting materials in electronics, but they are too dense and heavy to serve as heat-dissipating enclosures for large LED lighting and mobile electronics. In addition, the thermal expansion coefficients of these metallic materials are not compatible with semicond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L29/04C08K9/10C08K3/38
CPCC08K9/10C08K3/38C08K2003/385C08L63/00C08L29/04
Inventor 余柯涵武文杰
Owner NANJING UNIV OF POSTS & TELECOMM
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