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Method for improving mechanical property of ceramic polymer composite material

A composite material and polymer technology, which is applied in the preparation of ceramic polymer composite materials, can solve the problems of low resin content, easy crack development, and unusable materials, so as to improve rigidity and strength, improve mechanical properties, and high service temperature Effect

Active Publication Date: 2021-07-23
广州青苗新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Increasing the proportion of ceramic powder can improve the thermal conductivity of the material, but at the same time it will seriously reduce the mechanical properties of the material, resulting in the unusability of the material
[0012] In order to further improve the thermal conductivity of ceramic composite materials, increasing the filler ratio is an ideal solution, but the high filler ratio reduces the fluidity of the resin, making it difficult to completely fill the gaps in the material, resulting in defects such as gaps and cracks, thereby deteriorating the mechanical properties of the material
At the same time, the low resin content also makes the polymer as a bonding material weak, causing cracks to develop easily and forming brittle fractures

Method used

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  • Method for improving mechanical property of ceramic polymer composite material
  • Method for improving mechanical property of ceramic polymer composite material
  • Method for improving mechanical property of ceramic polymer composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Sample Preparation:

[0034]Weigh 15g of PPS (polyphenylene sulfide, Xinhecheng 3450S), 60g of white corundum 320 mesh, and 25g of white corundum 600 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0035] 10 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 100 MPa, a mold core temperature of 300° C., and a pressing time of 20 min.

[0036] After cooling, the sample was taken out, labeled as M1, and tested for thermal conductivity and density.

Embodiment 2

[0038] Weigh 10g of PPS (polyphenylene sulfide, Xinhecheng 11200F), 60g of white corundum 320 mesh, and 30g of white corundum 600 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0039] 10 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 200 MPa, a temperature of 300° C., and a pressing time of 20 min.

[0040] After cooling, the sample was taken out, labeled as M2, and tested for thermal conductivity and density.

Embodiment 3

[0042] Weigh 10g of PPS (polyphenylene sulfide, Xinhecheng 11200F), 60g of white corundum 600 mesh, and 30g of white corundum 1200 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0043] 10 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 200 MPa, a temperature of 300° C., and a pressing time of 20 min.

[0044] After cooling, the sample was taken out, labeled M3, and tested for thermal conductivity and density.

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PUM

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Abstract

The invention provides a method for improving the mechanical property of a ceramic polymer composite material, and the method comprises the following steps: carrying out plasticizing molding on corundum-type alumina particles and PPS engineering resin to obtain a composite material blank, and carrying out heat treatment to obtain the ceramic polymer composite material. The invention provides a material heat treatment method which is used for carrying out heat treatment on a high-strength ceramic polymer composite material containing ultrahigh-proportion ceramic powder and aims at eliminating static friction force and static pressure stored in the material forming process. The material has the advantages of ceramic and high polymer materials, has the characteristics of good mechanical strength, high thermal conductivity, good high temperature resistance, excellent processability and the like, and is very suitable for being applied to power PCBs (Printed Circuit Boards).

Description

technical field [0001] The invention relates to the field of new materials, in particular to a method for preparing a ceramic polymer composite material. Background technique [0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art. [0003] Printed Circuit Board (PCB), as a basic and important part of the modern electronics industry, is widely used in almost all electronic devices. [0004] At present, printed circuit boards are mainly prepared by etching. The main principle is to use copper clad laminates as raw materials. By using oxidative etching solution, under the protection of photosensitive resin, the copper foil of unnecessary parts will be removed according to the requirements of circuit design drawings. Etched and removed to form the basic circuit. Multiple such circuits are superimposed, and the substrates of epoxy materials are laminated together to form a multi-layer board ...

Claims

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Application Information

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IPC IPC(8): C04B26/10
CPCC04B26/10C04B2201/20C04B2201/32C04B2201/50C04B14/303
Inventor 赵经纬刘培培
Owner 广州青苗新材料科技有限公司
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