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Heat-conducting pouring sealant and preparation method thereof

A heat-conducting potting and triglycidyl technology, applied in the field of resin, can solve the problems of reduced resin occupancy, reduced cohesion and bond strength, etc., and achieves the effect of saving addition, improving thermal conductivity and good fluidity

Pending Publication Date: 2021-07-23
湖南创瑾技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the filling amount of the thermally conductive filler increases, its flame retardant performance will become better, and its thermal conductivity will also increase, but the occupancy of the resin in the system will decrease, resulting in a decrease in its cohesion and bond strength, and an increase in viscosity. It also puts forward higher requirements for usage scenarios

Method used

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  • Heat-conducting pouring sealant and preparation method thereof
  • Heat-conducting pouring sealant and preparation method thereof
  • Heat-conducting pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A thermally conductive potting compound of the present invention, comprising A component and B component,

[0043] The composition of component A is 30wt% 1,3,5-triglycidyl isocyanurate (TGIC), 70wt% thermally conductive filler. The thermal conductive filler is 30-50 μm aluminum nitride: 10-20 μm zinc oxide: 200nm silicon carbide = 70%: 15%: 15%.

[0044] The composition of component B is 96wt% 3-mercaptopropionic acid-[2,4,6-trioxo-1,3,5-triazine-1,3,5(2H,4H,6H)-idene] Tris-2,1-ethylene glycol ester (CAS: 36196-44-8), 1wt% Additol VXW6208-60, 1wt% Dow Corning FS-80, 2wt% BYK306.

[0045] The preparation method of heat conduction potting glue of the present invention comprises the following steps:

[0046] (1) Preparation of component A: Mix 30-50 μm aluminum nitride: 10-20 μm zinc oxide: 200 nm silicon carbide at a mass ratio of 70%︰15%︰15% to obtain a thermally conductive filler. After mixing TGIC and heat-conducting filler through an airflow mixer, component A can...

Embodiment 2

[0050] A heat-conducting potting compound of the present invention includes A component and B component.

[0051] The composition of component A is 30wt% 1,3,5-triglycidyl isocyanurate (TGIC), 70wt% thermally conductive filler. The thermal conductive filler is 30-50μm aluminum nitride: 10-20μm zinc oxide: 200nm silicon carbide = 70%: 15%: 15%.

[0052] The composition of component B is 96wt% 1,3,5-tris(2-hydroxyethyl) isocyanurate (CAS No.: 839-90-7), 1wt% Additol VXW6208-60, 1wt% Dow Corning FS-80, 2wt% BYK306.

[0053] The preparation method of heat conduction potting glue of the present invention comprises the following steps:

[0054] (1) Prepare component A: Mix 30-50 μm aluminum nitride: 10-20 μm zinc oxide: 200 nm silicon carbide at a mass ratio of 70%: 15%: 15% to obtain a thermally conductive filler. After mixing TGIC and heat-conducting filler through an airflow mixer, component A can be obtained. The condition is that the charge volume coefficient is 0.6, and com...

Embodiment 4

[0081] According to the method of Example 1, different thermally conductive fillers were designed, and the influence of different thermally conductive fillers on the thermal conductivity of the flame-retardant potting compound was investigated.

[0082] Thermally conductive filler 1: 1-3μm zinc oxide

[0083] Thermally conductive filler 2: 30-50μm aluminum nitride

[0084] Thermally conductive filler 3: 10-20μm zinc oxide

[0085] Thermally conductive filler 4: 5-10μm magnesium oxide

[0086] Thermally conductive filler 5: 1-3μm silicon carbide

[0087] Thermally conductive filler 6: 30-50μm aluminum nitride: 10-20μm zinc oxide: 1-3μm silicon carbide=60%: 25%: 15%

[0088] Thermally conductive filler 7: 30-50μm aluminum nitride: 10-20μm zinc oxide: 200nm silicon carbide = 70%: 15%: 15%.

[0089] Thermally conductive filler 8: 30-50μm aluminum nitride: 10-20μm zinc oxide: 30nm silicon carbide = 55%: 25%: 20%.

[0090] The influence of the conductive filler on the performan...

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Abstract

The invention discloses a heat-conducting pouring sealant and a preparation method thereof, the heat-conducting pouring sealant comprises a component A and a component B. The component A comprises 10-30 wt% of 1, 3, 5-triglycidyl isocyanurate; and the component B comprises 95.5 wt%-99.97 wt% of a curing agent. The preparation method comprises the following steps: mixing the 1, 3, 5-triglycidyl isocyanurate and the heat-conducting filler through an airflow mixer to obtain the component A; stirring and mixing a curing agent, a dispersing agent, a defoaming agent and a flatting agent to obtain a component B; and extruding the component A and the component B through a heatable single-screw extrusion device to obtain the heat-conducting pouring sealant. According to the invention, the self-flame-retardant resin and the curing agent are used as matrix materials, so that the use amount of the flame-retardant filler can be reduced, thereby reserving an increasing space for the heat-conducting filler for a system, ensuring that the amount of the resin is not changed, increasing the filling amount of the heat-conducting filler and further improving the heat-conducting property.

Description

technical field [0001] The invention belongs to the field of resins, and relates to a heat-conducting potting glue and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration technology, electronic components and instruments are more and more widely used in the electronics industry. In order to ensure the stability and reliability of electronic devices, which have the properties of shock and vibration resistance, harsh environment resistance, electrical insulation and heat conduction, it is often necessary to protect electronic devices by potting. The thermal conductivity of typical potting materials is only 0.2w (m·k), and the thermal conductivity is poor. General potting materials have poor flame retardancy and will burn completely once ignited. Therefore, the study has important theoretical significance and application prospects for the thermal conductivity and flame retardancy of potting compounds. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/32C08G59/64C08G59/66
CPCC09J163/00C09J11/04C08G59/66C08G59/64C08G59/3245C08K2003/282C08K2003/222
Inventor 周佩先岳利俞国金
Owner 湖南创瑾技术研究院有限公司
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