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Miniature LED backboard and production method thereof, and miniature LED panel

A miniature and backplane technology, which is applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., can solve problems such as inability to meet the performance requirements of micro LED backplanes or panels, achieve high dielectric coefficient, and improve current impact resistance Effect

Inactive Publication Date: 2021-07-23
刘向国 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the micro-LED display technology is booming. The backplane manufacturing process is usually the same as the TFT manufacturing process. The cathode and anode metal film formation process usually uses magnetron sputtering or evaporation process to form metal wiring materials such as Al and Cu. The insulating layer ( ILD (interlayer dielectric, ILD) usually uses chemical vapor deposition (PECVD) to form SiNx or SiO2 or SiNO, and then uses exposure, development, etching and other processes to form patterns and punch holes. Each film layer is repeatedly fabricated and stacked to form a micro LED backplane. With the continuous development of technology, the TFT backplane made by the above process will not be able to meet the performance requirements of the high current micro LED backplane or panel

Method used

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  • Miniature LED backboard and production method thereof, and miniature LED panel
  • Miniature LED backboard and production method thereof, and miniature LED panel
  • Miniature LED backboard and production method thereof, and miniature LED panel

Examples

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preparation example Construction

[0062] The prepreg also includes disperse dyes and impurities; the weight ratio of the resin to the reinforcing material is 3-7:7-3; the preparation method of the prepreg includes: soaking the electronic-grade glass fiber cloth in the resin liquid, then drying Dry to obtain a prepreg. The adulterant can be one of the following components or a combination of them: calcium carbonate, ethylene, inorganic mineral powder, organic wood powder, paper dust, grain flakes, talcum powder, calcium carbonate, barium sulfate, mica, carbon black, Carbon fiber, bromide, LDPE, EPR plus HDPE, rubber, etc. Disperse dyes are divided into low-temperature dyes and high-temperature dyes, and accelerators can be used to enhance the depth of color.

[0063]Prepreg A: After impregnating 10g of electronic-grade glass fiber cloth with epoxy resin, dry it to obtain 14.3g of prepreg A. The surface of the cloth should be smooth, free of oil, stains, foreign impurities or other defects, cracks and excessive...

Embodiment 1

[0068] like figure 2 As shown, the LED backplane includes a substrate 1, a buffer layer 6, a prepreg 3, a first circuit 4, and an insulating layer 5. The buffer layer 6, the prepreg 3, the first circuit 4, and the insulating layer 5 are sequentially stacked on the substrate 1. Mounting holes are provided on layer 5. LEDs are mounted on the mounting holes to form an LED panel. The buffer layer is used to increase the adhesion of the substrate 1, that is, to increase the adhesion between the substrate 1 and the prepreg 3, and improve the stability of the LED backplane produced.

Embodiment 2

[0070] A micro LED backplane, such as image 3 As shown, it includes a substrate 1, a bottom circuit 2, a prepreg 3, a first circuit 4 and an insulating layer 5. The bottom circuit 2, the prepreg 3, the first circuit 4 and the insulating layer 5 are sequentially stacked on the substrate 1. The first circuit 4 And the prepreg 3 is provided with a connecting hole, and the connecting hole is provided with a connecting wire 11 connecting the bottom circuit 2 and the first circuit 4 . That is, the upper and lower sides of the prepreg 3 are respectively provided with the first circuit 4 and the bottom circuit 2 to form a sandwich structure. The underlying circuit is a metal thin film, which can be formed by magnetron sputtering or evaporation process.

[0071] The prepreg 3 is thicker than the insulating layer formed by chemical vapor deposition, so it has a higher dielectric coefficient, thus improving the current shock resistance, and reducing the wiring capacitance between the b...

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Abstract

The invention discloses a miniature LED backboard and a production method thereof, and a miniature LED panel, and belongs to the technical field of display. The miniature LED backboard comprises a substrate, a prepreg, a first circuit and an insulating layer, the prepreg, the first circuit and the insulating layer are sequentially stacked on the substrate, and the insulating layer is provided with a mounting hole. Compared with an insulating layer formed by chemical vapor deposition, the prepreg is thicker and has a higher dielectric coefficient so that a current impact bearing capacity is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a micro LED backplane, a preparation method thereof and a micro LED panel. Background technique [0002] Micro LED (Mini LED and Micro LED) is a new generation of display technology, which has higher brightness, better luminous effect and lower power consumption than the existing OLED technology. At present, the micro-LED display technology is booming. The backplane manufacturing process is usually the same as the TFT manufacturing process. The cathode and anode metal film formation process usually uses magnetron sputtering or evaporation process to form metal wiring materials such as Al and Cu. The insulating layer ( ILD (interlayer dielectric, ILD) usually uses chemical vapor deposition (PECVD) to form SiNx or SiO2 or SiNO, and then uses exposure, development, etching and other processes to form patterns and punch holes. Each film layer is repeatedly fabricated and stacked to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L21/48H01L21/52G09F9/33
CPCH01L25/0753H01L21/48H01L21/52G09F9/33
Inventor 刘向国
Owner 刘向国