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Large-depth-diameter-ratio tiny hole inner hole deposition technology

A technology with fine pores and depth-to-diameter ratio, applied in electrolytic coatings, coatings, etc., can solve problems such as inability to plate into the coating, poor signal transmission, oxidation blackening, etc., to improve deep plating ability, meet coating requirements, and coating crystal fine effect

Pending Publication Date: 2021-08-06
遵义智通金属表面技术处理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the depth-to-diameter ratio is greater than 3, the inner wall and bottom of the hole cannot be plated with a coating (copper, silver, nickel, gold). In electronic products, the surface of the inner hole without a coating will gradually oxidize and blacken during use. , resulting in poor contact, open circuit, poor signal transmission or failure

Method used

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  • Large-depth-diameter-ratio tiny hole inner hole deposition technology
  • Large-depth-diameter-ratio tiny hole inner hole deposition technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A technique for depositing micropores and inner pores with a large depth-to-diameter ratio, comprising the following steps:

[0021] S1. Before electroplating, the prepared composite electroplating solution is subjected to low-current activated carbon adsorption and electrolytic removal of impurities;

[0022] S2. Stabilize the PH value of the composite electroplating solution between 4, the concentration of nano slurry is 150g / L, the main salt is nickel sulfamate 450g / L, and then electroplating is performed, and the electrolytic nickel plate is used as the anode after surface treatment, and the stainless steel plate After the surface treatment, it is used as the cathode, and the nanocrystalline coating is electroplated by a single pulse electrodeposition process, wherein the electrodeposition time is 3h, and the pulse current density is 7.0A / dm 2 , the duty cycle is 55%, the period is 1ms, the electrodeposition temperature is 55°C, the stirring speed is 400r / min, and t...

Embodiment 2

[0028] Embodiment 2: This embodiment is based on Embodiment 1, but the difference is that the pulse current density in S2 is changed, and the pulse current density range is 2-14A / dm 2 , the coating microhardness HV is as follows figure 1 shown;

[0029] Such as figure 1 As shown, as the pulse average current density increases, the microhardness first increases and then decreases, with a maximum of 425HV; when the average current density is low, the lower cathode overpotential limits the formation rate and growth rate of crystal nuclei; at the same time , the co-deposition process is slow, the amount of nanoparticles coated and embedded by the matrix metal is small, and the strengthening effect is relatively weak; these two reasons together lead to the formation of coarse grains and loose structures, making the microhardness lower . When the average current density increases, the strong electrostatic attraction and the force between the two-phase interface promote more nanop...

Embodiment 3

[0030] Embodiment 3: This embodiment is based on Embodiment 1, but the difference is that the duty cycle in S2 is changed, the duty cycle range is 0.2-1.0, and the coating microhardness HV is as follows figure 2 shown;

[0031] The relationship between the pulse duty cycle and the microhardness of the coating is as follows: figure 2 shown, with figure 1 It can be seen from the comparison that the changing trend presented is similar to that, and the microhardness increases first and then decreases with the increase of duty cycle. Analyzing the reasons, this change is mainly attributed to the fact that the change of duty cycle affects the crystallization process and the composite amount of nanoparticles in the composite coating, which in turn affects the strengthening effect of the particles and the compactness of the composite coating. The duty cycle is small, the conduction time is short, and the rest time is long. The ions consumed during the rest period can be effectivel...

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Abstract

The invention discloses a large-depth-diameter-ratio tiny hole inner hole deposition technology, belongs to the field of large-depth-diameter-ratio tiny hole inner hole deposition, and aims at rapidly exchanging an electroplating solution in a hole, increasing the current density and increasing the exhaust speed by utilizing solution stirring and strong cavitation effects in an ultrasonic field environment so as to improve the deep plating capacity of the electroplating solution; the refining capability of plating layer crystals is that a plating layer is completely covered in a blind hole with the depth-diameter ratio not greater than 5: 1 or a through hole with the depth-diameter ratio not greater than 10: 1, and the plating layer crystals are finer, so that the corrosion resistance of a plating layer is greatly improved, and the requirements of the plating layer in fine holes of high-end electronic products are met.

Description

technical field [0001] The invention relates to the field of micropore inner hole deposition with a large aspect ratio, in particular to a fine micropore inner hole deposition technology with a large aspect ratio. Background technique [0002] The electrochemical deposition method, commonly known as electroplating, is a method in which the conductive part to be plated is used as the cathode in a plating solution containing a metal plating compound, and through electrolysis, it is expected to obtain a firm bond, a uniform coating, and a fine surface on the surface of the part. The electrochemical processing method of metal film is also one of the most widely used surface treatment technologies at present. According to the way the power supply provides voltage and current, it can be divided into ordinary DC electroplating, AC-DC superimposed electroplating, pulse electroplating, etc., and pulse electroplating is further divided into single pulse electroplating and double pulse...

Claims

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Application Information

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IPC IPC(8): C25D5/18C25D5/20C25D3/12C25D15/00
CPCC25D5/18C25D5/20C25D3/12C25D15/00
Inventor 秦智礼
Owner 遵义智通金属表面技术处理有限公司