Nano-copper-titanium alloy and preparation method thereof

Abstract

The invention relates to a nano-copper-titanium alloy and a preparation method thereof, belonging to the technical field of alloy preparation. The technical problem solved by the invention is to provide a preparation method of nano-copper-titanium alloy with better high temperature stability. The method comprises the following steps: a. putting copper and titanium into the same copper crucible of an electric arc melting furnace, and then airtightly removing oxygen in the electric arc melting furnace; b. adjusting current to melt both copper and titanium, and then stirring and melting for 40 Turn off the current for cooling after ~60s; c. Repeat step b at least once to obtain nano-copper-titanium alloy. The method of the invention can obtain the nano-copper-titanium alloy at one time, the steps are simple, the required equipment is simple, the operation is fast, the preparation cycle is short and the cost is low, and the preparation of the alloy can be realized within a few minutes. Moreover, the prepared nano-copper-titanium alloy has good high temperature stability, better plastic deformation ability at room temperature, and wider application range.

Description

technical field [0001] The invention relates to a nano-copper-titanium alloy and a preparation method thereof, belonging to the technical field of alloy preparation. Background technique [0002] Copper materials have been widely used in electronic components and industrial parts due to their high electrical and thermal conductivity, and are also important components for future military and aircraft manufacturing. Copper-titanium alloy is a representative copper material, which has good mechanical properties, and is also a potential substitute material for copper-beryllium alloy, with broad market application prospects. Copper-beryllium alloys have been used for most current-carrying components, but the high cost and long-term environmental and health hazards of beryllium require the development of materials with comparable performance. The preparation cost of copper-titanium alloy is much lower than that of copper-beryllium, and it is environmentally friendly. If the elect...

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Problems solved by technology

At present, most of the research focuses on adding a variety of trace elements to improve the comprehensive properties of copper-titanium alloys. The mechanical properties of the prepared multi-component copper-titanium alloys are higher than those of binary copper-titanium alloys, but the thermal conductivity of other elements is lower than that of copper-titanium alloys. Pure copper, but will increase electron scattering

Ternary or multi-component copper-titanium alloys not only need to adjust the optimal content of each element, but also adjust the final structure ratio to solve the contradiction between mechanical properties and electrical conductivity. The preparation process is complicated, and the obtained alloy materials often have high tensile strength. , and the elongation rate is low, and the comprehensive effect has not yet been outstanding

[0006] The Chinese invention patent with the application number 201910334755.8 discloses the preparation method of ultra-fine-grained copper-titanium alloy wire. It adopts the preparation method of powder metallurgy to obtain the copper-titanium alloy material containing nano-titanium. The alloy has good hardness, strength and Electrical conductivity, elongation is 5-8%, the method is relatively cumbersome, and the high temperature stability of the prepared alloy needs to be improved

[0007] The Chinese invention patent with the application number 201911368576.2 discloses a high-strength and high-conductivity copper-titanium alloy material and its preparation method. It still uses the powder metallurgy route preparation method, and achieves high conductivity of the formed copper-titanium alloy material by adding less titanium powder. rate, the growth of grains in the sintering process is controlled by a lower sintering temperature, so that the copper-titanium alloy material maintains a higher strength. Good, but high temperature performance could be improved

[0008] It can be seen that the copper-titanium alloys currently developed have fully met the mechanical property requirements at room temperature, but copper-titanium alloys with high temperature thermal stability are still lacking.

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