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A preparation method of leadless pre-molded semiconductor packaging bracket

A technology for packaging brackets and semiconductors, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc. It can solve the problems of difficult cost reduction, high cost, long order period, etc. Reliability, reduce production costs, improve production efficiency

Active Publication Date: 2021-10-19
东莞市春瑞电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the conventional PCB-type packaging bracket profiles are difficult to reduce the cost due to the cumbersome manufacturing process and the import dependence of metal substrate materials, and the heat dissipation and reliability are insufficient; while the steel sheet-supported peel-off type packaging bracket profiles basically rely on foreign imports. , the cost is high, and the order period is long; the package bracket profile with lead frame structure is the most commonly used, but each independent package bracket unit in the bracket profile needs to have connecting leads and frame support, the utilization rate of raw materials is low, and this kind of The process cannot produce a package bracket unit with complex structure, high precision, extremely small pitch and high integration. After the semiconductor package is cut, all the connecting leads are exposed to the lead metal head, which greatly reduces the airtightness and reliability of the semiconductor package device.

Method used

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  • A preparation method of leadless pre-molded semiconductor packaging bracket
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  • A preparation method of leadless pre-molded semiconductor packaging bracket

Examples

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Embodiment 1

[0035] A method for preparing a leadless pre-molded semiconductor packaging bracket. First, a metal substrate 1 is selected, and then exposure and development are performed on the metal substrate 1 through the prior art to form a metal circuit, wherein the exposure treatment is performed on both sides of the metal substrate 1 at the same time, reducing The difference between the layers of the circuit patterns on both sides can be developed separately, or both sides can be developed at the same time, and then the anti-etching metal coating is electroplated on the exposed metal lines. Similarly, the metal lines on both sides can be simultaneously or Plating treatment alone, such as figure 1 and figure 2 As shown, after the above work is completed, the following steps for making the packaging bracket are performed:

[0036] The first step is to cover the surface 11 of the metal substrate 1 with dry film 2 or ink for anti-etching treatment to form an anti-etching layer B, and at...

Embodiment 2

[0041] A method for preparing a leadless pre-molded semiconductor packaging bracket. Firstly, a metal substrate 1 is selected. The material of the metal substrate 1 can be made of metal materials such as copper, aluminum or iron. Copper is preferably used to facilitate semiconductor conduction and heat dissipation. The traditional PCB board is easier to process, and the thickness of the metal substrate 1 can be 0.1mm-0.25mm;

[0042] Such as image 3 As shown, the dry film 2 is pasted on the surface 11 and the surface 2 12, and the exposure and development process is carried out to form a metal circuit, wherein the surface 11 and the surface 2 12 are simultaneously exposed to reduce the difference between the layers of the circuit patterns on both sides. However, surface one 11 and surface two 12 can be developed separately, or developed simultaneously, and finally formed Figure 4In the state shown, the dry film 2 is a photosensitive dry film, and the circuit is printed on t...

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Abstract

The invention discloses a method for preparing a leadless pre-molded semiconductor package bracket. The leadless pre-molded semiconductor package bracket of the present invention includes several independent package bracket units and non-functional area pre-molded packages. The upper and lower sides of the package bracket unit The surface is formed with a metal coating that can be bonded and welded. The pre-molded body of the non-functional area is epoxy resin, and the packaging bracket unit is made by sticking a film, exposing and developing, electroplating, and film-removing etching; the non-functional area The pre-molded body is made by vacuum filling, baking, and grinding. The present invention adopts the method of sticking a carrier plate in the etching process as a carrier support. After the pre-molding of the non-functional area is completed, the carrier plate is removed. This way, after etching, each independent bracket unit can be re-formed as a whole, without the need for wire connection support, which not only improves the utilization rate of materials, but also solves the problem of airtightness of the package bracket, and improves the reliability of packaged devices.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, in particular to a method for preparing a leadless pre-molded semiconductor packaging bracket. Background technique [0002] The packaging bracket is the basic component for manufacturing integrated circuit semiconductor components. It provides a carrier for the chip of the integrated circuit, and realizes the connection between the chip and the electrical signal of the external circuit board by means of the bonding material, and at the same time provides a heat conduction channel for the chip to release heat. Traditional packaging brackets are usually used: lead frame type, steel sheet support peel-off type, and PCB board type. [0003] At present, the conventional PCB board-type packaging bracket profiles are difficult to reduce the cost due to the cumbersome manufacturing process and the import dependence of metal substrate materials, and the heat dissipation and reliability ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/14H01L21/48
CPCH01L21/4803H01L23/14H01L23/49541
Inventor 周志国钟峰
Owner 东莞市春瑞电子科技有限公司