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Preparation method for reducing hot shrinkage rate of Cu-Ni-Si alloy

A cu-ni-si, thermal shrinkage technology, applied in metal rolling, heat treatment equipment, manufacturing tools, etc., can solve the problems of high angle lead frame, high thermal shrinkage, low hardness, etc.

Pending Publication Date: 2021-08-13
TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The products produced by this production process mainly have the following shortcomings: the product strength is low, and most of the tensile strength is in the range of 608MPa-635MPa; the hardness is low, and most of the HV values ​​are in the range of 180-190; The thermal shrinkage rate of the above materials is higher than 0.011%, which cannot meet the material requirements of high-angle lead frames and image imaging electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) After the ingot is hot-rolled, the solution treatment temperature is 730°C, and the cooling intensity is 30°C / s; face milling: the thickness of the single-side milling face is 0.7mm; after this solid solution, the product is HV 136, and the conductivity is 22.3%IACS , grain size 0.008mm.

[0020] (2) Cold rolling (1) The processing rate is 82.8%, rolling to 2.5mm, using a bell-type annealing furnace for aging annealing, the set temperature is 530°C, and the holding time is 8h; after this aging annealing, the tensile strength of the product is 460MPa , Elongation 25.5%, HV 140, conductivity 50.5%IACS, grain size 0.005mm.

[0021] (3) Cold rolling (2) The processing rate is 76%, rolled to 0.6mm, and the air cushion annealing furnace is used to expand the annealing solution, the annealing temperature is 760°C, the annealing time is 45s, and the cooling intensity is 25°C / s; After solution annealing, the tensile strength of the product is 398MPa, the elongation is 32.5%...

Embodiment 2

[0026] (1) After the ingot is hot-rolled, the solution treatment temperature is 750°C, and the cooling intensity is 30°C / s; face milling: the thickness of one-sided milling face is 1.0mm; after this solid solution, the product has HV 115 and conductivity 19.7%IACS , grain size 0.010mm.

[0027] (2) Cold rolling (1) The processing rate is 85%, rolling to 2.0mm, using a bell-type heating furnace for heat treatment, the set temperature is 530°C, and the holding time is 7.5h; after this aging annealing, the tensile strength of the product 480MPa, elongation 27.3%, HV 138, conductivity 54.5%IACS, grain size 0.008mm.

[0028] (3) Cold rolling (2) The processing rate is 75%, rolled to 0.5mm, and annealed in an air cushion furnace for solution, the solution temperature is 760°C, the solution time is 45s, and the cooling intensity is 25°C / s; after this solution annealing Finally, the tensile strength of the product is 390MPa, the elongation is 33.5%, HV108, the electrical conductivity...

Embodiment 3

[0033] (1) After the ingot is hot-rolled, the solution treatment temperature is 700°C, and the cooling intensity is 25°C / s; face milling: the thickness of the milling face on one side is 0.7mm.

[0034] (2) Cold rolling (1) The processing rate is 85%. The bell-type annealing furnace is used for aging annealing. The set temperature is 550°C and the holding time is 6h.

[0035] (3) Cold rolling (2) The processing rate is 78%, and the air-cushion annealing furnace is used for expansion annealing and solid solution, the annealing temperature is 800°C, the annealing time is 40s, and the cooling intensity is 30°C / s.

[0036] (4) Cold rolling (3) The processing rate is 63.7%, and the bell furnace is used for aging annealing. The annealing temperature is 400°C and the heat preservation is 6-8h.

[0037] (5) Cold rolling (4) Processing rate is 43.8%.

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Abstract

The invention relates to new materials, belongs to the non-ferrous metal processing industry, and particularly relates to a preparation method for reducing the hot shrinkage rate of a Cu-Ni-Si alloy. According to the method, the hot shrinkage rate of the Cu-Ni-Si alloy is reduced so as to meet the requirements for materials applied to high-angle lead frames and image electronic components. The preparation method for reducing the hot shrinkage rate of the Cu-Ni-Si alloy comprises the process steps of semi-continuous ingot casting, ingot heating, hot rolling, first solution treatment, surface milling, first cold rolling, edge cutting, first aging annealing, cleaning, second cold rolling, second solution annealing, third cold rolling, third aging annealing, cleaning, fourth cold rolling, cleaning, withdrawal and straightening and slitting in sequence. According to the method, technical treatment is carried out on the basis of a traditional process, on the premise of ensuring the properties of high strength, high elasticity, medium conductivity, low stress relaxation and the like of the material, different solid solution plus aging heat treatment plus cold rolling plus finishing treatment processes are adopted, the density change in recovery and recrystallization is controlled, and the hot shrinkage rate of the product is reduced.

Description

technical field [0001] The invention relates to new materials and belongs to the non-ferrous metal processing industry, specifically a preparation method for reducing the heat shrinkage rate of Cu-Ni-Si alloy. Demand for materials for electronic components. Background technique [0002] Cu-Ni-Si alloys have high strength, high elasticity, medium electrical conductivity, excellent high temperature resistance and creep resistance, no sparks (arc extinguishing function) under impact, etc., and are the first choice for upgrading electrical connectors. It is used in electronic industries such as high-angle lead frame materials, image and video electronic components. Cu-Ni-Si alloy, as an electronic component material, will generate heat during the working process, and sometimes needs to work at a higher temperature, requiring the material to have high thermal stability, so as to ensure the stability and reliability of the electronic component. , which requires that the thermal ...

Claims

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Application Information

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IPC IPC(8): C22F1/08C21D9/52B21C37/02B21B1/22
CPCC22F1/08C21D9/52B21C37/02B21B1/22
Inventor 张文芹韩彩香王少华景洁王满丰赵伟鹏苏鹏冯泽强郑小英
Owner TAIYUAN JIN XI CHUNLEI COPPER CO LTD
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