Snapback transient voltage suppressor
A transient voltage suppression, conductive type technology, applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of low clamping voltage, high frequency signal packet loss, etc., to achieve low breakdown voltage and trigger voltage, application Flexible, protective and responsive effects
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Embodiment 1
[0046] Embodiment 1: A snapback transient voltage suppressor prepared by the present invention, such as figure 1 As shown, it includes: a substrate; a buried layer formed on the upper surface of the substrate, the conductivity type of the buried layer is different from that of the substrate; an epitaxial layer formed on the upper surface of the buried layer, the conductivity of the epitaxial layer The type is different from the conductivity type of the substrate, that is, the conductivity type of the epitaxial layer is the same as that of the buried layer. If the substrate is an N-type substrate N sub, the epitaxial layer is a P-type epitaxial layer P-epi, and the buried layer is P-epi. type buried layer PBL; if the substrate is a P-type substrate P sub, the epitaxial layer is an N-type epitaxial layer N-epi, and the buried layer is an N-type buried layer NBL. In the epitaxial layer N-epi, the buried layer is an N-type buried layer NBL as an example; a plurality of predetermined...
Embodiment 2
[0070] This embodiment is similar to Embodiment 1, other structures are the same as Embodiment 1, and the manufacturing method is also the same. The difference between this embodiment and Embodiment 1 is that in this embodiment, the first preset area and the fifth preset area The third P-type well region PW3 is removed, and the functions realized by the device remain unchanged. The snapback transient voltage suppressor prepared in this embodiment is as follows: Figure 10As shown, it specifically includes: a substrate; a buried layer formed on the upper surface of the substrate, the conductivity type of the buried layer is different from that of the substrate; an epitaxial layer formed on the upper surface of the buried layer, the epitaxial layer The conductivity type is different from that of the substrate, that is, the conductivity type of the epitaxial layer is the same as that of the buried layer. If the substrate is an N-type substrate N sub, the epitaxial layer is a P-typ...
Embodiment 3
[0072] This embodiment is similar to Embodiment 1, other structures are the same as Embodiment 1, and the manufacturing method is also the same. The difference between this embodiment and Embodiment 1 is that in this embodiment, the first preset area and the fifth preset area The third P-type well region PW3 and the buried layer grown on the substrate are removed, and the functions realized by the device remain unchanged. The snapback transient voltage suppressor prepared in this embodiment is as follows: Figure 11 As shown, it specifically includes: a substrate; an epitaxial layer formed on the upper surface of the substrate, and the conductivity type of the epitaxial layer is different from that of the substrate. If the substrate is an N-type substrate N sub, the epitaxial layer is P-type epitaxial layer P-epi; if the substrate is P-type substrate P sub, the epitaxial layer is N-type epitaxial layer N-epi; multiple predetermined regions are formed in the epitaxial layer, and...
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Abstract
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