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Etching liquid for silver, and method for producing printed wiring board using same

A manufacturing method and etching solution technology, which are applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, and printed circuits, etc., can solve the problems of reduced circuit insulation reliability, reduced circuit yield, and silver residues. Low surface roughness, low cost effect

Pending Publication Date: 2021-08-13
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the etchant for silver disclosed in the above-mentioned Patent Documents 1 and 2 is used for circuit formation, there is a problem that silver remains as a residue, causing a decrease in the yield of circuit manufacturing and a decrease in the insulation reliability of the circuit.

Method used

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  • Etching liquid for silver, and method for producing printed wiring board using same
  • Etching liquid for silver, and method for producing printed wiring board using same
  • Etching liquid for silver, and method for producing printed wiring board using same

Examples

Experimental program
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Effect test

manufacture example 1

[0104] [Manufacture Example 1: Manufacture of Primer (B-1)]

[0105] In a nitrogen-substituted container equipped with a thermometer, a nitrogen introduction tube, and a stirrer, the polyester polyol (polyester polyol obtained by reacting 1,4-cyclohexanedimethanol, neopentyl glycol, and adipic acid) ) 100 parts by mass, 17.6 parts by mass of 2,2-dimethylolpropionic acid, 21.7 parts by mass of 1,4-cyclohexanedimethanol and 106.2 parts by mass of dicyclohexylmethane-4,4'-diisocyanate in 178 parts by mass of methyl ethyl ketone mass parts of a mixed solvent to obtain a solution of a urethane prepolymer having an isocyanate group at the end.

[0106] Next, 13.3 parts by mass of triethylamine was added to the above-mentioned urethane prepolymer solution to neutralize the carboxyl groups contained in the above-mentioned urethane prepolymer, and 380 parts by mass of water was further added and fully stirred to obtain Aqueous dispersion of urethane prepolymer.

[0107] To the aqueou...

Embodiment 1

[0131] Add 3 parts by mass of acetic acid and 20 parts by mass of 2-propanol (hereinafter referred to as "IPA") in 27 parts by mass of water, further add 50 parts by mass of 31 mass % hydrogen peroxide, mix uniformly, and prepare silver etching solution (1) .

Embodiment 2

[0133] 3 parts by mass of acetic acid and 20 parts by mass of ethanol were added to 27 parts by mass of water, and 50 parts by mass of 31% by mass hydrogen peroxide was further added and uniformly mixed to prepare an etchant (2) for silver.

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Abstract

The present invention provides an etching liquid for silver, which is an aqueous solution containing a carboxylic acid, hydrogen peroxide and an alcohol. In addition, provided is a method for producing a printed wiring board, the method having a step for forming a silver layer (M1) as a plating underlayer on an insulating base material (A) and then removing unwanted parts of the silver layer (M1) using the etching liquid for silver. By using the etching liquid for silver, it is possible to efficiently remove unwanted plating underlayer in the production of a printed wiring board in which silver is used in the plating underlayer, and obtain a printed wiring board having little side etching and undercutting in wiring parts of the printed wiring board.

Description

technical field [0001] The present invention relates to an etchant for silver and a method for producing a printed wiring board using the same. Background technique [0002] There are subtractive method, semi-additive method (SAP) and modified SAP (MSAP) as the wiring forming method of the printed wiring board, among them, SAP and MSAP are suitable for forming fine wiring. The wiring formation method of SAP and MSAP is common, and is the method of forming a resist on the non-wiring portion of the circuit pattern on the plating base layer (thin conductive layer or plating catalyst layer), The wiring part where the resist is formed is thickly coated by plating, and the resist is peeled off, and the plating base layer of the unnecessary non-wiring part is removed by etching. [0003] As the problems of the printed wiring board caused by the etching process of the plating base layer, it is known that the circuit insulation reliability decreases due to etching residues, and the ...

Claims

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Application Information

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IPC IPC(8): C23F1/30H05K3/06
CPCH05K3/06C23F1/30H05K3/067
Inventor 新林昭太村川昭深泽宪正白发润
Owner DIC CORP