Polyamide resin containing imide structure and preparation method of polyamide resin

A polyamide resin and imide-containing technology, which is applied in the field of polyamide resin containing imide structure and its preparation, can solve the problems of high water absorption of low water-absorbing nylon, barrier properties of polyamide resin, transparency, strength, medium Problems such as electrical degradation

Active Publication Date: 2021-08-24
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the low water absorption nylon reported by this method has the problem of high water absorption.
[0003] Moreover, in order to improve the water absorption rate of polyamide resin, some groups are introduced when molecular design of polyamide resin is carried out, which will lead to the decrease of barrier property, transparency, strength and dielectric property of polyamide resin.

Method used

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  • Polyamide resin containing imide structure and preparation method of polyamide resin
  • Polyamide resin containing imide structure and preparation method of polyamide resin
  • Polyamide resin containing imide structure and preparation method of polyamide resin

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preparation example Construction

[0056] The present invention also provides the preparation method of the polyamide resin containing imide structure described in above-mentioned technical scheme, comprises the following steps:

[0057] (1) Mix dianhydride, aminocarboxylic acid, first catalyst, solvent and dehydrating agent, carry out high temperature polycondensation reaction, obtain imide diacid, the chemical structural formula of described imide diacid is as shown in formula (II) ;

[0058]

[0059] In the formula (II), R is a fragment of an aromatic dianhydride and / or an alicyclic dianhydride, and G is a fragment of an aminocarboxylic acid;

[0060] (2) Condensing the imide diacid and the aliphatic diamine obtained in the step (1) in water to obtain a salt of the imide diacid and the aliphatic diamine;

[0061] (3) Mix the imide diacid obtained in the step (2) with the salt of the aliphatic diamine and the second catalyst, and perform a melt polycondensation reaction to obtain a polyamide resin contain...

Embodiment 1

[0101] (1) Feed pyromellitic dianhydride and aminocaproic acid at a material ratio of 1:2.1, stir well in DMF solvent at 80°C, add the first catalyst sodium acetate, dehydrating agent acetic anhydride, 160°C Reflux and keep warm for 6 hours, settle in a large amount of distilled water after the reaction, the product is a white powdery solid, filter with suction, and dry in vacuum to obtain imide diacid with a yield of 90%. Wherein, the mass of the first catalyst is 0.2% of the mass of the dianhydride.

[0102] (2) Add the imide diacid obtained in the step (1) into pure water at 80°C and stir evenly, then dissolve hexamethylenediamine in an appropriate amount of pure water at 80°C, and gradually add it dropwise until complete, at 80°C Stir for 1 hour under heat preservation, the solution is a uniform milky white suspension, and the salt formation is completed; wherein, the ratio of imide diacid to hexamethylenediamine is 1:1 by substance.

[0103] (3) mixing the imide diacid o...

Embodiment 2

[0107] (1) Feed pyromellitic dianhydride and aminotoluic acid at a material ratio of 1:2.1, stir evenly in a mixed solvent of DMAc and acetic acid at 80°C, add the first catalyst sodium acetate, dehydrating agent acetic anhydride , reflux at 160°C for 10 hours, after the reaction was completed, it was settled in a large amount of distilled water, and the product was a white powdery solid, which was filtered by suction and dried in vacuum to obtain imide diacid with a yield of 80%. Wherein, the mass of the first catalyst is 0.2% of the mass of the dianhydride.

[0108] (2) Add the imide diacid obtained in the step (1) into pure water at 80°C and stir evenly, then dissolve decanediamine in an appropriate amount of pure water at 80°C, and gradually add it dropwise until complete, at 95°C Stir for 2 hours under heat preservation, the solution is a uniform light yellow suspension, and the salt formation is completed; wherein, the ratio of imide diacid to decanediamine is 1:1 by sub...

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Abstract

The invention provides polyamide resin containing an imide structure and a preparation method of the polyamide resin, and belongs to the technical field of high polymer materials. According to the polyamide resin containing the imide structure, due to the introduction of the aromatic imide structure, the stacking density and rigidity of a molecular chain of the polyamide resin can be improved, the free volume of a polymer is reduced, and the resin is endowed with excellent strength and barrier property; due to the introduction of an alicyclic imide structure, the polyamide resin has excellent optical performance; by introducing a diversified imide structure into the polyamide resin, on one hand, the content of hydrophilic amide groups is reduced, so that the water absorption rate of the polyamide resin is reduced, and on the other hand, the polyamide resin has the characteristics of high barrier, high transparency, high strength, excellent dielectric property and the like.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyamide resin containing an imide structure and a preparation method thereof. Background technique [0002] Polyamide resin is a polycondensation polymer compound with -CONH- structure in the molecule. It is usually obtained by polycondensation of dibasic acid and diamine. It has good comprehensive properties, including heat resistance, wear resistance, and Chemical properties and self-lubricating properties, suitable for reinforcement modification with glass fiber and other fillers. However, due to the presence of high-density hydrophilic amide groups -NHCO- in polyamide resins, polyamide resins have a strong water absorption rate. At 23°C and a relative humidity of 50%, the equilibrium water absorption rate is about 2.5%. When the relative humidity is 100%, its equilibrium water absorption rate is as high as 5%. In order to reduce the water absorption rate of PA...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26C08G69/28
CPCC08G69/26C08G69/28
Inventor 张英伟杨军刘跃军王文志易勇王进葛冬冬
Owner HUNAN UNIV OF TECH
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