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Compound for packaging film, ink composition containing same and film packaging structure

A technique for ink composition and encapsulation film, which is applied in the fields of ink composition and film encapsulation structure containing it, and compound for encapsulation film, which can solve problems such as adverse effects of devices, decrease of flatness of inorganic film, increase of WVTR, etc., and achieve good durability Thermal performance, improved reliability, and extended service life

Inactive Publication Date: 2021-09-17
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the currently used inorganic films are evaporated by plasma generation methods such as sputtering (sputtering) or vapor deposition (CVD). When there are many impurities in the organic film, the residual gases will be released, causing The flatness of the inorganic film decreases, leading to an increase in WVTR, which adversely affects the protected device

Method used

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  • Compound for packaging film, ink composition containing same and film packaging structure
  • Compound for packaging film, ink composition containing same and film packaging structure
  • Compound for packaging film, ink composition containing same and film packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A method for preparing a thin film encapsulation structure, comprising the following steps:

[0048] Step S1: Treatment of organic layer materials

[0049] Among them, the compound for packaging film (chemical formula 001), acrylic acid monomer (2-((naphthalene-2-yloxy)methoxy)ethyl (meth)acrylic acid), photoinitiator (2-methyl-1 -(4-(methylthio)phenyl)-2-morpholinopropan-1-one);

[0050]

[0051] Weigh 25g of 001, 70g of 2-((naphthalene-2-yloxy)methoxy)ethyl (meth)acrylic acid and 5g of 2-methyl-1-(4-(methylthio)benzene Base)-2-morpholinopropan-1-one, mixed together, stirred under vacuum at 50°C for 80h, then filtered with a syringe filter, and detected with a particle counter, when the particle size was detected to be greater than 0.5μm When the number of particles is not more than 50, the organic layer material is obtained;

[0052] Step S2: Preparation of Inorganic Layer

[0053] Silicon nitride is selected as the inorganic layer material, and the inorganic l...

Embodiment 2

[0059] The preparation method of thin-film encapsulation structure differs from Example 1 in that 25g of compound for encapsulation film (chemical formula 002), 70g of acrylic acid monomer (10-phenoxydecyl (meth)acrylic acid), 5g of photoinitiator (2-Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butydan-1-one);

Embodiment 3

[0061]

[0062] The difference between the preparation method of the thin film encapsulation structure and that of Example 1 is that

[0063] Among them, 25g compound for packaging film (chemical formula 003), 70g acrylic acid monomer (2-((phenylthio)methoxy)ethyl (meth)acrylic acid), 5g photoinitiator (2-hydroxy-2-methyl base acetophenone);

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Abstract

The invention discloses a compound for a packaging film. The structural general formula of the compound for the packaging film is shown in the following chemical formula 1 in the specification. The compound for the packaging film can be used for manufacturing a compound or a mixture with one or more allyl groups which can be cured by other light and heat, and a composition with one or more compounds or a mixture which can generate free radicals and acids by receiving light or heat. After the composition is prepared into a film, the water vapor transmittance is below 9 * 10 <-2 > g / m < 2 > / day.

Description

technical field [0001] The invention relates to the technical field of packaging films, and more specifically relates to a compound for packaging films, an ink composition containing the compound and a film packaging structure. Background technique [0002] Organic Light Emitting Diode (OLED) is regarded as one of the most promising display technologies because of its various advantages such as self-brightness, fast response, wide viewing angle, ultra-thin, high definition and durability. In particular, OLEDs are particularly suitable for flexible displays and are widely accepted as the next generation of cathode ray tubes (CRTs) and flat panel displays (FPDs). Device encapsulation is the most demanding task when it comes to OLED technology, since OLEDs require a high degree of protection against moisture and oxygen penetration. Therefore, a high-performance gas diffusion barrier is a crucial factor for improving the reliability and service life of OLEDs. The conventional ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/18C09D11/101H01L51/52H01L51/54
CPCC07F7/1804C09D11/101H10K50/844H10K2102/00
Inventor 于哲姜晓晨秦翠英杜磊马晓宇王辉尹恩心
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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