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Circuit board manufacturing method for comprehensively optimizing bare board surface treatment and element mounting

A circuit board manufacturing and surface treatment technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuit manufacturing, electrical components, etc. Effect

Pending Publication Date: 2021-09-24
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the implementation of the patented technology requires bare board manufacturers and board assemblers to adjust their existing business scopes, involving multiple changes in organization and benefit distribution, as well as a series of technical challenges in terms of time, space and The combination of sequence is difficult to be widely used in practice in the short term

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] In this embodiment, a circuit board with pure thermosetting ink printed on both sides and fully cured is taken as an example. The specific steps are as follows:

[0057] (1) Use a laser to remove the solder resist on the welding area to manufacture a solder resist area for solderability treatment.

[0058] After etching and stripping the film, for the manufacture of solder resist patterns of general precision and high precision circuit boards, the existing technology uses photosensitive solder resist materials, which require pre-baking, exposure, development, curing and other processes to obtain solder resist patterns. This step applies laser photoetching processing, which can directly vaporize and remove the solder resist material on the surface of the copper foil in the welding area, so it is not necessary to use a photosensitive pattern while butt welding

[0059] The solder resist does not require pre-baking, exposure, development and other processes. After the sold...

Embodiment 2

[0085] In this embodiment, a circuit board with PI laminated on both sides instead of solder resist ink is taken as an example. The specific steps are as follows:

[0086] (1) While using laser to remove the solder resist on the welding area to create a solder resist pattern, perform solderability treatment on the welding area.

[0087] Specifically, in this embodiment, an ultraviolet nanosecond laser machine U6 produced by Dezhong Technology Co., Ltd. is used to remove PI in the welding area to make a solder resist pattern, and the thickness of the PI layer is about 25 μm. Place the circuit board on the adsorption table of the laser equipment, import the engineering data data of laser processing, accurately align the circuit board with the processing data, and laser photoetch PI to form a solder resist pattern. After the top surface is processed, the circuit board is turned over, and the solder resist pattern on the bottom surface is completed in the same way.

[0088] The p...

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PUM

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Abstract

The invention provides a circuit board manufacturing method for comprehensively optimizing bare board surface treatment and element mounting, which comprises the following steps of: removing a solder resist on a welding area by using laser to manufacture a solder resist pattern for a circuit board in process of coating and curing the solder resist on the whole board; and carrying out weldability treatment on the welding area, adding a welding flux to the welding area according to a brazing requirement, heating to remelt the welding flux, placing a component on the circuit board, and heating to remelt the welding flux to form a welding point. The welding flux coated in the bare board manufacturing stage plays a role in protecting a welding area and also plays a role in brazing welding flux for connecting a component and a circuit board, one object has two purposes, the consumption in the manufacturing process is greatly reduced, and the cost is greatly reduced; the process of solder paste skip printing during circuit board assembly is omitted, the process is reduced, and the production efficiency is improved; the requirements of different components on different solder components and quantities can be met on the same circuit board, the environmental burden is small, the manufacturing process is cleaner, and the environment is more friendly.

Description

technical field [0001] The invention relates to a circuit board manufacturing process, in particular to a circuit board manufacturing method for comprehensively optimizing bare board surface treatment and component mounting. Background technique [0002] In today's world, electronic information products are ubiquitous. Among them, one of the most important components is the circuit board. The circuit board is not universal, it should be specially designed and manufactured according to the specific product. As the main carrier to realize the functions of electronic products, circuit boards generally go through three stages from concept to finished product: design, material preparation and assembly, which constitute the main line of electronic product development and production. In the design stage, it is necessary to plan the logical relationship between components and the design scheme for the physical realization of the circuit board from the perspective of creativity and...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/34
CPCH05K3/282H05K3/34
Inventor 胡宏宇宋金月方伟
Owner 德中(天津)技术发展股份有限公司