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High-power sandwich type piezoelectric transducer cooling system and cooling method thereof

A piezoelectric transducer and cooling system technology, applied in cooling/ventilation/heating transformation, modification with gaseous coolant, electrical components, etc. Stability and service life, improving energy transmission efficiency and working time, and high heat dissipation efficiency

Pending Publication Date: 2021-10-01
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the heat generation problem of the sandwich piezoelectric transducer in the prior art, and propose a high-power sandwich piezoelectric transducer cooling system and cooling method thereof to improve its performance. Efficiency, to ensure that it can work stably for a long time and meet the requirements of practical engineering applications

Method used

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  • High-power sandwich type piezoelectric transducer cooling system and cooling method thereof
  • High-power sandwich type piezoelectric transducer cooling system and cooling method thereof
  • High-power sandwich type piezoelectric transducer cooling system and cooling method thereof

Examples

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Effect test

Embodiment 1

[0032] like Figure 1-6 As shown, this embodiment is a high-power sandwich piezoelectric transducer 12 cooling system, which is an efficient active heat dissipation system, including a sandwich piezoelectric transducer 12 and an electrode flange 7 . The sandwich piezoelectric transducer 12 includes a pre-tightening bolt 4 and a steel rear acoustic cover 5, a phosphor bronze sheet 6, a PZT-8 piezoelectric ceramic 8 and an aluminum front acoustic cover set outside the pre-tightening bolt 4. 9. Apply a high-frequency AC voltage to both ends of the power line of the sandwich piezoelectric transducer 12, and through the inverse piezoelectric effect of the PZT-8 piezoelectric ceramic 8, high-frequency mechanical vibration can be output on the front sound cover 9 to generate ultrasonic waves. There are four PZT-8 piezoelectric ceramics with 8 positions, including the first positively polarized piezoelectric piece 801, the first negatively polarized piezoelectric piece 802, the secon...

Embodiment 2

[0042] This embodiment provides a cooling method for a high-power sandwich piezoelectric transducer, comprising the following steps:

[0043] S1: After the sandwich piezoelectric transducer is connected to the ultrasonic power supply, the temperature measuring probe starts to measure the temperature in the hollow cavity in real time, and transmits the temperature information to the microcomputer motherboard;

[0044] S2: When the temperature is lower than 40°C, the air pump and the hydraulic pump are not turned on; when the measured temperature is higher than 40°C and lower than 60°C, the microcomputer motherboard will control the air pump to turn on; the cooling gas passes through the air pump, a cooling The conduit enters the inflow channel, then flows through the hollow cavity, then flows from the outflow channel through another cooling conduit to the corresponding heat dissipation conduit, and finally discharges to the coolant tank; when the measured temperature is higher t...

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Abstract

The invention provides a high-power sandwich type piezoelectric transducer cooling system and a cooling method thereof. The high-power sandwich type piezoelectric transducer cooling system comprises a sandwich type piezoelectric transducer, the sandwich type piezoelectric transducer comprises a pre-tightening force bolt, a rear sound cover, a phosphorus copper sheet, PZT-8 piezoelectric ceramic and a front sound cover, wherein the rear sound cover, the phosphorus copper sheet, the PZT-8 piezoelectric ceramic and the front sound cover are arranged outside the pre-tightening force bolt in a sleeving mode; the high-power sandwich type piezoelectric transducer cooling system further comprises an electrode plate flange; the electrode plate flange comprises a flange flat plate and a flange cylinder; the flange cylinder is arranged outside the pre-tightening force bolt in a sleeving mode; a first positive polarization piezoelectric plate, a first negative polarization piezoelectric plate, a second positive polarization piezoelectric plate and a second negative polarization piezoelectric plate are all arranged outside the flange cylinder in a sleeving mode; the flange flat plate is arranged between the first negative polarization piezoelectric plate and the second positive polarization piezoelectric plate; and an inflow passage and an outflow passage are arranged in the flange flat plate, and the flange flat plate is provided with a cooling inlet corresponding to the inflow passage and a cooling outlet corresponding to the outflow passage. According to the high-power sandwich type piezoelectric transducer cooling system and the cooling method thereof, by using the inflow passage, the outflow passage and a hollow cavity in the electrode plate flange to conduct heat dissipation, the heat dissipation efficiency is high.

Description

technical field [0001] The invention relates to the technical field of sandwich piezoelectric transducers, in particular to a high-power sandwich piezoelectric transducer cooling system and a cooling method thereof. Background technique [0002] Ultrasonic transducers are the core components of ultrasonic vibration systems. Among them, sandwich piezoelectric transducers are widely used in ultrasonic cleaning and ultrasonic welding due to their advantages such as high frequency, high power, simple structure, stable operation, and high electromechanical conversion efficiency. , ultrasonic atomization, ultrasonic cutting and non-destructive testing and other fields. In the application of power ultrasound, the end of the piezoelectric transducer works under an alternating electric field, and the input electric power of a single piezoelectric transducer can reach more than 100kW, and the dielectric loss due to polarization relaxation and leakage accounts for more than 40%. The i...

Claims

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Application Information

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IPC IPC(8): B06B1/06H05K7/20
CPCB06B1/0607H05K7/20272H05K7/20136H05K7/20209H05K7/20281
Inventor 饶忠于胡小平刘鑫戚安琪穆东方吕博邹洪
Owner HANGZHOU DIANZI UNIV