High-power sandwich type piezoelectric transducer cooling system and cooling method thereof
A piezoelectric transducer and cooling system technology, applied in cooling/ventilation/heating transformation, modification with gaseous coolant, electrical components, etc. Stability and service life, improving energy transmission efficiency and working time, and high heat dissipation efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] like Figure 1-6 As shown, this embodiment is a high-power sandwich piezoelectric transducer 12 cooling system, which is an efficient active heat dissipation system, including a sandwich piezoelectric transducer 12 and an electrode flange 7 . The sandwich piezoelectric transducer 12 includes a pre-tightening bolt 4 and a steel rear acoustic cover 5, a phosphor bronze sheet 6, a PZT-8 piezoelectric ceramic 8 and an aluminum front acoustic cover set outside the pre-tightening bolt 4. 9. Apply a high-frequency AC voltage to both ends of the power line of the sandwich piezoelectric transducer 12, and through the inverse piezoelectric effect of the PZT-8 piezoelectric ceramic 8, high-frequency mechanical vibration can be output on the front sound cover 9 to generate ultrasonic waves. There are four PZT-8 piezoelectric ceramics with 8 positions, including the first positively polarized piezoelectric piece 801, the first negatively polarized piezoelectric piece 802, the secon...
Embodiment 2
[0042] This embodiment provides a cooling method for a high-power sandwich piezoelectric transducer, comprising the following steps:
[0043] S1: After the sandwich piezoelectric transducer is connected to the ultrasonic power supply, the temperature measuring probe starts to measure the temperature in the hollow cavity in real time, and transmits the temperature information to the microcomputer motherboard;
[0044] S2: When the temperature is lower than 40°C, the air pump and the hydraulic pump are not turned on; when the measured temperature is higher than 40°C and lower than 60°C, the microcomputer motherboard will control the air pump to turn on; the cooling gas passes through the air pump, a cooling The conduit enters the inflow channel, then flows through the hollow cavity, then flows from the outflow channel through another cooling conduit to the corresponding heat dissipation conduit, and finally discharges to the coolant tank; when the measured temperature is higher t...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


