Open type multi-field coupling test system

Abstract

The invention discloses an open type multi-field coupling test system which comprises a pressure sensor, a water cooling plate, a heat flow measuring electrode, a cold electrode, a hot electrode, a heat source and a heat insulation protection plate which are sequentially stacked in an open type frame, a bearing table, a stepping motor and a lead screw which are arranged above the open type frame, and a main machine, a cooling water circulation machine, a direct-current voltage-stabilized power supply and a digital source meter which are connected with the above parts. A to-be-measured material sample is placed between the cold electrode and the hot electrode, and thermocouples are arranged close to the upper and lower ends of the heat flow measuring electrode, the cold electrode and the hot electrode to measure the temperature. The test system integrates heat, electricity, force and other multi-field coupling loading functions and performance tests, can test the mechanical, electrical, thermal and other performance parameters of the functional materials and the intelligent materials under the multi-field coupling effect, not only can test the plane samples, but also can test the curved surface and other special-shaped samples, the parts, such as the cold electrode, the hot electrode, the heat source, etc., are flexible in design, the replacement is convenient, and meanwhile, other experiment technologies, such as infrared thermal imaging, digital mark point image measurement, etc., can be compatible.

Description

technical field [0001] The invention relates to material testing technology, in particular to a multi-field coupling testing system for measuring basic performance parameters such as material mechanics, electricity and heat under the coupling action of multi-physics fields. Background technique [0002] With the continuous development of material science and technology, functional materials and smart materials such as electrical conduction, thermal conductivity, piezoelectricity, photoelectricity, thermoelectricity, magnetoelectricity, and shape memory have been gradually applied in many fields such as electronic information, energy transportation, biomedicine, and aerospace. These materials often encounter complex working environments such as temperature changes, voltage loads, and external forces during their service. If the product design and application, directly use the material parameters in the existing database and engineering manuals or measure The obtained material...

AI Technical Summary

Problems solved by technology

However, these devices are large in size, complex in structure, and require high operation requirements. In order to reduce the interference of the test environment, most of the multi-field loading devices and test components are closed. Although it can improve the accuracy of the test, it is not conducive to the richness and variety of functional modules. Optimization, improvement and flexible assembly, as well as the use of other experimental techniques, limit the scope and limits of multi-field coupling testing to a certain extent

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