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Indium composite microcrystal bump texture

A bump and microcrystalline technology is applied in the field of indium composite microcrystalline bump texture to achieve the effects of improving connection reliability, good heat dissipation performance and strong applicability

Pending Publication Date: 2021-10-22
FUJIAN CHUANZHENG COMM COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] According to the results of literature search and patent search, there is no relevant literature report on the indium composite microcrystalline bump texture containing more than 60% (wt%) indium and more than 70% (wt%) of indium and iron in China.

Method used

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  • Indium composite microcrystal bump texture
  • Indium composite microcrystal bump texture
  • Indium composite microcrystal bump texture

Examples

Experimental program
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Effect test

Embodiment 1

[0016] figure 1 It is a schematic structural diagram of the indium composite microcrystalline bump texture in Example 1 of the present invention, figure 2 is the scanning electron microscope image of the indium composite microcrystalline bump texture sample of Example 1 of the present invention, image 3 For embodiment 1 of the present invention figure 2 The energy spectrum corresponding to the indium composite microcrystalline bump texture sample in the figure, 1 is the bump crystallite, 2 is the composite material layer, and 3 is the part.

[0017] The indium composite microcrystalline bump texture of the present invention is characterized in that: on the surface of the part, a structure containing more than 60% (wt%) of indium and more than 8% (wt%) of iron and more than 70% (wt%) of indium and iron together is set on the surface of the part. ) composite material layer, on the surface of the composite material layer, there are many bump crystallites, the top of each bum...

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Abstract

The invention relates to an indium composite microcrystal salient point textur. According to the invention, a composite material layer containing more than 60% (Wt%) of indium and more than 70% (Wt%) of indium and iron is arranged on the surface of a part, and a plurality of salient point microcrystals are arranged on the surface of the composite material layer. The height of each salient point microcrystal is larger than 100 nm and smaller than 500 microns, the top of each salient point microcrystal with the diameter larger than 100 nm and smaller than 500 microns is spherical or approximately spherical, the indium content exceeds 60% (Wt%), the total indium and iron content exceeds 70% (Wt%), and the salient point microcrystals and the composite material layer are integrated. And the shape and the size of the salient point microcrystal can be changed.

Description

technical field [0001] The invention relates to an indium composite microcrystalline bump texture. Background technique [0002] Solid-state lasers use laser crystals as working substances, such as: yttrium aluminum garnet (YAG), etc. Laser crystals are one of the core devices, and thermal stress is usually generated during the working process, especially in pump lasers, resulting in serious point drift. It can cause laser crystal failure; during the long-term luminous process, the solid-state laser crystal generates very small vibrations (generally on the order of microns) due to "excited states in the atoms in the crystal", causing fretting fatigue and fretting wear; fretting The further expansion of fatigue and fretting wear will cause the failure of the laser crystal, cause the failure of the laser, and bring greater losses. At present, some domestically use special glue to connect the laser crystal with other parts, which has problems of glue aging and thermal stress; ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/02H01S3/042H01S3/06
CPCH01S3/025H01S3/042H01S3/0602
Inventor 林绍义林雪莲林逸彬
Owner FUJIAN CHUANZHENG COMM COLLEGE
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