Large-particle silver powder with supporting ridge structure as well as preparation method and application thereof

A technology of large particles and silver powder, applied in chemical instruments and methods, conductive materials dispersed in non-conductive inorganic materials, conductors, etc., can solve problems such as low bonding strength and poor electrical conductivity, and achieve increased bonding strength , Improve electrical conductivity, avoid the effect of uneven reaction

Active Publication Date: 2021-11-16
山东建邦胶体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large particle size and smooth surface, the contact surface between the silver powders in the slurry is small, so it has low bonding strength and poor electrical conductivity when applied to low-temperature slurry or conductive adhesive.

Method used

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  • Large-particle silver powder with supporting ridge structure as well as preparation method and application thereof
  • Large-particle silver powder with supporting ridge structure as well as preparation method and application thereof
  • Large-particle silver powder with supporting ridge structure as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Large particles having a branched silver rib structure 1 prepared in Example 1, a particle size of 6 microns #

[0062] 1) Dosing

[0063] Solution A: 500 g of silver nitrate were dissolved in 2,750 g of deionized water and dissolved with stirring, and 25 g of concentrated nitric acid to prepare a silver nitrate solution A. Wherein the concentration of silver nitrate solution is 1.0mol / L, the amount of concentrated nitric acid was 0.05 times mass of silver nitrate;

[0064] Solution B: 250 g of polyvinylpyrrolidone K30 was dissolved in a dispersant 3,300 g of deionized water and dissolved with stirring to prepare a solution B. ingredient powders Wherein the amount of the dispersant is 0.5 times the mass of the silver nitrate solution A; solution B is used in an amount of deionized water A solution of deionized water, 1.2 times the amount;

[0065] Solution C: 360 g of ascorbic acid dissolved in a 2750 g of deionized water and dissolved with stirring, ascorbic acid formula...

Embodiment 2

[0076] Example 2 Preparation of a particle size of 8 micron silver particles having a large supporting rib structure # 2

[0077] 1) Dosing

[0078] First Solution A: 750 g of silver nitrate were dissolved in 2,750 g of deionized water and dissolved with stirring, and 60 g of concentrated nitric acid to prepare a silver nitrate solution A. Wherein the concentration of silver nitrate solution is 1.5mol / L, the amount of concentrated nitric acid was 0.08 times mass of silver nitrate;

[0079] Second Solution A: 760 g of silver nitrate were dissolved in 2,750 g of deionized water and dissolved with stirring, and 60 g of concentrated nitric acid to prepare a silver nitrate solution A. Wherein the concentration of silver nitrate solution is 1.6mol / L, the amount of concentrated nitric acid is 0.079 times the mass of silver nitrate;

[0080] A first solution B: 300 grams of Dispersant polyvinylpyrrolidone K30 was dissolved in 3850 g of deionized water and dissolved with stirring to pr...

Embodiment 3

[0093] Example 3 Preparation of a particle size of 7 microns of silver particles having a large supporting rib structure # 3

[0094] 1) Dosing

[0095] Solution A: 750 g of silver nitrate were dissolved in 2,750 g of deionized water and dissolved with stirring, and 60 g of concentrated nitric acid to prepare a silver nitrate solution A. Wherein the concentration of silver nitrate solution is 1.5mol / L, the amount of concentrated nitric acid was 0.08 times mass of silver nitrate;

[0096] Solution B: 260 grams of Dispersant polyvinylpyrrolidone K30 was dissolved in 3300 g of deionized water and dissolved with stirring to prepare a solution B. ingredient powders Wherein the amount of the dispersant is 0.35 times the mass of the silver nitrate solution A; solution B is used in an amount of deionized water A solution of deionized water, 1.2 times the amount;

[0097] Solution C: 425 g of ascorbic acid dissolved in a 2750 g of deionized water and dissolved with stirring, ascorbic aci...

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Abstract

The invention discloses large-particle silver powder with a supporting ridge structure as well as a preparation method and application thereof. The large-particle silver powder is composed of single-crystal silver powder and a protruding branch prism structure on the surface of the single-crystal silver powder, the morphology of the large-particle silver powder is approximately spherical, and the particle size of the large-particle silver powder is 5-10 micrometers. According to the large-particle silver powder with the supporting ridge structure, the crystallinity is high, and the conductive performance of the large-particle silver powder is not affected while the bonding strength of low-temperature slurry and conductive adhesive is improved; the preparation method is simple in step, mild in reaction condition, short in production period, good in repeatability, energy-saving and environment-friendly, and suitable for industrial amplification and industrial application.

Description

Technical field [0001] The present application relates to large particles of silver powder and preparation method and use of the structure having a supporting rib, belonging to the field of preparation of metal powder material. Background technique [0002] Silver metal having excellent thermal conductivity properties, it is widely used in the field of electronic paste thick film conductive paste, high temperature electrically conductive adhesive, an electromagnetic shielding. Silver powder as a conductive filler, an important part of an electronic slurry, the slurry is a critical material properties determined, and therefore the most widely used and largest amount of one noble metal powder material. [0003] In order to meet the ever-changing electronic and microelectronic devices functional requirements for electronic paste and silver also made newer and higher performance requirements. As a material of the noble metal powder, usually silver controlled morphology, particle size...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00C30B29/02C30B29/66C30B7/14H01B1/16H01B1/22H01B5/16C09J9/02
CPCB22F9/24C30B29/02C30B29/66C30B7/14H01B1/16H01B1/22H01B5/16C09J9/02Y02E10/50
Inventor 王艳云陈波许文艳马跃跃陈朋韩世生彭鲁川
Owner 山东建邦胶体材料有限公司
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