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Ink direct-writing forming method for short carbon fiber reinforced silicon carbide ceramic composite material

A technology of chopped carbon fiber and silicon carbide ceramics, which is applied in the field of composite material molding, can solve the problems of difficulty in manufacturing complex-shaped parts, and achieves the effects of fast molding speed, broad application prospects, and improved bending strength.

Active Publication Date: 2021-11-19
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is quite difficult to manufacture parts with complex shapes by the above-mentioned conventional methods

Method used

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  • Ink direct-writing forming method for short carbon fiber reinforced silicon carbide ceramic composite material
  • Ink direct-writing forming method for short carbon fiber reinforced silicon carbide ceramic composite material
  • Ink direct-writing forming method for short carbon fiber reinforced silicon carbide ceramic composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A kind of chopped carbon fiber reinforced silicon carbide ceramic composite material ink direct writing molding method of the present invention, technological process is as follows figure 1 As shown, the specific molding steps are as follows:

[0036] (1) First, mix 40g of deionized water, 20g of glucose, and 0.51g of polyethylene glycol (PEG) to prepare a premix, then mix 78.4g of SiC ceramic powder, 18.38g of chopped carbon fiber (Csf), and methyl fiber 2 g of element (MC) was added therein and mixed, then put into a ball mill jar, and ball milled for 1 hour on a planetary ball mill at a speed of 400 r / min to obtain evenly dispersed, solid content of 46.67 vol%, fiber content of 15 vol%, and low viscosity Csf / SiC composite paste;

[0037] (2) Print the Csf / SiC composite slurry obtained in step (1) into a Csf / SiC composite material green body with an ink direct writing molding device, nozzle diameter: 0.6mm, printing speed: 2mm / s, height of each layer: 0.45 mm; the ...

Embodiment 2

[0042] Except for the following steps, other preparation steps are the same as in Example 1: in step (1), 35 g of deionized water, 17.5 g of carbon black, and 0.52 g of polyethyleneimine (PEI) are mixed to prepare a premixed liquid, and then the SiC ceramic 72.8g of powder, 21.44g of chopped carbon fiber (Csf) and 1.4g of methyl cellulose (MC) were added and mixed, then put into a ball mill jar, and ball milled on a planetary ball mill at a speed of 400r / min for 2h to obtain a uniform dispersion , Csf / SiC composite slurry with a solid content of 50vol% and a fiber content of 17.5vol%.

[0043] Compared with Example 1, the opening ratio of the Csf / SiC composite product obtained in this example is reduced to 0.8%, the bending strength is increased to 200MPa, and the bulk density is 2.80g·cm -3 , the fracture toughness is 6.2MPa·m 0.5 .

Embodiment 3

[0045] Except for the following steps, other preparation steps are the same as in Example 1: in step (1), 35 g of deionized water, 17.5 g of glucose, and 0.51 g of polyethylene glycol (PEG) are mixed to prepare a premixed liquid, and then the SiC ceramic powder 67.2g of carbon fiber, 24.5g of chopped carbon fiber (Csf), and 1.75g ​​of methyl cellulose (MC) were added and mixed, then put into a ball mill jar, and ball milled for 2 hours on a planetary ball mill at a speed of 400r / min to obtain a uniformly dispersed, Csf / SiC composite slurry with a solid content of 50vol% and a fiber content of 20vol%.

[0046] Compared with Examples 1 and 2, the opening ratio of the Csf / SiC composite parts obtained in this example is reduced to 0.5%, the bending strength is increased to 250MPa, and the bulk density is 2.85g·cm -3 , the fracture toughness is 7.6MPa·m 0.5 .

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Abstract

The invention discloses an ink direct-writing forming method for a short carbon fiber reinforced silicon carbide ceramic composite material, and belongs to the field of composite material molding. The molding method includes the steps: mixing silicon carbide (SiC) ceramic powder, short carbon fibers (Csf), a carbon source, deionized water, a dispersing agent and a binding agent, and carrying out ball milling, to obtain evenly-dispersed Csf / SiC composite slurry; then printing into a Csf / SiC composite material green body by using ink direct-writing forming equipment; then carrying out carbonization treatment to obtain a Csf / SiC secondary green body; and carrying out liquid phase siliconizing, carrying out densification treatment to finally obtain the Csf / SiC composite material. According to the forming method disclosed by the invention, ink direct-writing 3D printing forming preparation of the Csf / SiC composite material component is realized.

Description

technical field [0001] The invention relates to the technical field of composite material forming, in particular to an ink direct-writing forming method of chopped carbon fiber reinforced silicon carbide ceramic composite material. Background technique [0002] With the rapid development of high-end equipment fields such as aerospace and ships, higher requirements are put forward for thermal protection materials and structures. Therefore, in order to meet the above requirements, it is urgent to develop thermal protection materials and components with high strength and high temperature resistance to meet their performance requirements in harsh environments. SiC ceramic materials have the characteristics of stable chemical properties, high thermal conductivity, high strength, high hardness, etc., and play an indispensable role in modern industry. However, SiC ceramic materials are brittle and sensitive to defects, which seriously restrict the application of SiC ceramic materi...

Claims

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Application Information

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IPC IPC(8): C04B35/80C04B35/52C04B35/622
CPCC04B35/80C04B35/52C04B35/622C04B2235/5248C04B2235/6562C04B2235/6567C04B2235/661C04B2235/6026C04B2235/96C04B2235/6581C04B2235/77
Inventor 何汝杰王文清张路张可强张学勤周妮平
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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