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Preparation process of copper alloy material for short-process lead frame

A short-process lead wire and preparation process technology, applied in the field of copper alloys, can solve problems such as inability to meet large-scale production efficiency and cost, and demanding work capacity requirements, and achieve good application value, increased strength, and excellent electrical properties.

Active Publication Date: 2021-11-26
CHINA WEAPON SCI ACADEMY NINGBO BRANCH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process needs to be treated with liquid nitrogen and subsequently controlled to raise the temperature to room temperature, which has strict requirements on the working capacity of the equipment and cannot meet the efficiency and cost requirements of large-scale production

Method used

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  • Preparation process of copper alloy material for short-process lead frame
  • Preparation process of copper alloy material for short-process lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The preparation process of the copper alloy material used for the short-flow lead frame of this embodiment includes the following steps in sequence:

[0026] (1) Vacuum induction melting: put high-purity oxygen-free copper (99.99wt.%), Cu-40Crwt.% master alloy, Cu-40Zrwt.% master alloy and pure Ag (99.99wt.%) into The crucible is smelted by vacuuming, and the degree of vacuum smelting is 3×(10 -4 ~10 -3 ) Pa, after the metal is completely melted, it is kept warm for 5 minutes, and the heat preservation temperature is 1150° C., and then it is cast into an ingot. The ingot composition of the copper alloy material in this embodiment is Cr: 0.7wt.%, Zr: 0.078wt.%, Ag : 0.1wt.%, impurity content ≤ 0.03wt.%, oxygen content ≤ 0.0008%, the balance is Cu;

[0027] (2) Hot forging treatment: the alloy ingot obtained in step (1) is placed in a holding furnace for homogenization treatment, the homogenization treatment temperature is 960 ° C, the homogenization treatment time is 4...

Embodiment 2

[0032] The preparation process of the copper alloy material used for the short-flow lead frame of this embodiment includes the following steps in sequence:

[0033] (1) Vacuum induction melting: put high-purity oxygen-free copper (99.99wt.%), Cu-40Crwt.% master alloy, Cu-40Zrwt.% master alloy and pure Ag (99.99wt.%) into The crucible is smelted by vacuuming, and the degree of vacuum smelting is 3×(10 -4 ~10 -3 ) Pa, after the metal is completely melted, it is kept warm for 5 minutes, and the heat preservation temperature is 1150° C., and then it is cast into an ingot. The ingot composition of the copper alloy material in this embodiment is Cr: 0.7wt.%, Zr: 0.078wt.%, Ag : 0.1wt.%, impurity content ≤ 0.03wt.%, oxygen content ≤ 0.0008%, the balance is Cu;

[0034] (2) Hot forging treatment: the alloy ingot obtained in step (1) is placed in a holding furnace for homogenization treatment, the homogenization treatment temperature is 960 ° C, the homogenization treatment time is 4...

Embodiment 3

[0039] The preparation process of the copper alloy material used for the short-flow lead frame of this embodiment includes the following steps in sequence:

[0040] (1) Vacuum induction melting: put high-purity oxygen-free copper (99.99wt.%), Cu-40Crwt.% master alloy, Cu-40Zrwt.% master alloy and pure Ag (99.99wt.%) into The crucible is smelted by vacuuming, and the degree of vacuum smelting is 3×(10 -4 ~10 -3 ) Pa, after the metal is completely melted, it is kept warm for 5 minutes, and the heat preservation temperature is 1150° C., and then it is cast into an ingot. The ingot composition of the copper alloy material in this embodiment is Cr: 0.7wt.%, Zr: 0.078wt.%, Ag : 0.1wt.%, impurity content ≤ 0.03wt.%, oxygen content ≤ 0.0008%, the balance is Cu;

[0041] (2) Hot forging treatment: the alloy ingot obtained in step (1) is placed in a holding furnace for homogenization treatment, the homogenization treatment temperature is 960 ° C, the homogenization treatment time is 4...

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Abstract

The invention relates to a preparation process of a copper alloy material for a short-process lead frame. The preparation process sequentially comprises the following steps: smelting and casting, hot forging, aging and cold deformation; and a cast ingot of the copper alloy material comprises the following components in percentage by weight: 0.7 wt% of Cr, 0.078 wt% of Zr, 0.1 wt% of Ag, less than or equal to 0.03 wt% of impurities and the balance of Cu. The process is simple and effective and is suitable for preparing the large high-strength and high-conductivity copper alloy material; the prepared copper alloy material is excellent in mechanical and electrical properties and uniform in tissue, has the crystal grain width of about 300-1,000 nm, and has excellent application value in the fields of rail transit such as lead frames and electronic communication and the like.

Description

technical field [0001] The invention belongs to the technical field of copper alloys, and in particular relates to a method for preparing high-strength and high-conductivity Cu-Cr-Zr-Ag alloy strips for short-flow lead frames. Background technique [0002] Copper alloy has good electrical and thermal conductivity and high mechanical properties, and plays a very important role in the electronic information industry. It is an indispensable basic material for the electronic information industry. Among them, copper alloy lead frame materials have developed rapidly. In recent years, integrated Circuits are developing in the direction of high density and high integration, which puts forward high, precise, sharp, short, small, light and thin requirements for integrated circuit frames and materials. The ideal lead frame material strength should be greater than 600MPa, and the electrical conductivity should be greater than 80% IACS. However, FeNi42 alloy, which has been widely used, ...

Claims

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Application Information

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IPC IPC(8): C22C1/03C22C9/00C22F1/08H01L23/495
CPCC22C1/03C22C9/00C22F1/08H01L23/49579
Inventor 龚留奎黄伟陈子明张延松冯宏伟刘晓彬黄实哈黄滢秋阮金琦邓立勋刘峰
Owner CHINA WEAPON SCI ACADEMY NINGBO BRANCH
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