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High-conductivity electronic circuit capable of being rapidly printed at low temperature and preparation method and application thereof

An electronic circuit and high-conductivity technology, which is applied in the field of high-conductivity electronic circuits and their preparation, can solve the problems of affecting the conductivity of nano-technology particles, damage to temperature-sensitive substrates, and being unable to withstand high-temperature sintering, so as to improve the adhesion effect. , Broadening the scope of application, the effect of high applicability

Pending Publication Date: 2021-11-26
山西聚微天成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the nano-metals prepared by the liquid phase method can reach the nanometer level, and the yield is relatively high.
However, since there is an organic coating agent on the surface of the nano metal particles, the coating agent is an organic polymer material, which will affect the conductivity of the nanotechnology particles. Therefore, in actual production, inorganic conductive inks such as nano-silver and nano-copper inks are printed into circuits Finally, it must be cured and sintered to have conductivity and sufficient adhesion
The traditional process uses a hot furnace or a hot plate (for copper ink, a vacuum or an inert gas environment is required), which requires a long processing time. If it is an R2R process, the production line will be very long, and it may cause damage to the temperature-sensitive substrate.
In particular, substrates such as PEN, PVC, and PI are mostly soft, light and thin, and cannot withstand high-temperature sintering. Therefore, the problem of high-temperature sintering treatment after printing nano-metal inks is more significant, which limits its application and development.

Method used

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  • High-conductivity electronic circuit capable of being rapidly printed at low temperature and preparation method and application thereof
  • High-conductivity electronic circuit capable of being rapidly printed at low temperature and preparation method and application thereof
  • High-conductivity electronic circuit capable of being rapidly printed at low temperature and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for rapidly printing high-conductivity electronic circuits at low temperatures, comprising the following steps:

[0026] (1) Inkjet print nano-silver conductive ink on the surface of the PCB board, print patterned electronic circuits, and use low-temperature heat curing to dry the surface of nano-silver conductive ink; the low-temperature heat-curing temperature is 100 ℃, and the low-temperature heat-curing time 30 minutes;

[0027] (2) Inkjet print the micro-sintering solution on the surface of the printed nano-silver electronic circuit, and use a low-temperature thermosetting method to dry the surface. The low-temperature thermosetting temperature is 60 ℃, and the low-temperature thermosetting time is 10 minutes; the micro-sintering solution is propylene glycol Mixtures of methyl ether acetate, diethylene glycol diethyl ether and dipropylene glycol dimethyl ether;

[0028] (3) A gallium-based liquid alloy is used to coat the surface of the printed and micro-...

Embodiment 2

[0033] A method for rapidly printing high-conductivity electronic circuits at low temperatures, comprising the following steps:

[0034] (1) Inkjet print nano-gold conductive ink on the surface of bare PET, print patterned electronic circuits, and use infrared sintering to dry the surface of nano-gold conductive ink; the power of infrared sintering is 10 W, and the infrared sintering time is 5 minutes ;

[0035] (2) Inkjet print the micro-sintering solution on the surface of the printed nano-gold electronic circuit, and use infrared sintering to dry the surface. The power of infrared sintering is 50 W, and the infrared sintering time is 3 minutes; the micro-sintering solution is ethylene glycol Mixture of diethyl ether acetate and diethylene glycol diethyl ether;

[0036] (3) Use a gallium-based liquid alloy to coat the surface of the printed and micro-sintered nano-gold electronic circuit to obtain a high-conductivity electronic circuit with a resistance of 0.3Ω. The galliu...

Embodiment 3

[0040] A method for rapidly printing high-conductivity electronic circuits at low temperatures, comprising the following steps:

[0041] (1) Inkjet print nano-copper conductive ink on the surface of PI, print patterned electronic circuits, and use low-temperature heat curing to dry the surface of nano-copper conductive ink; the low-temperature heat-curing temperature is 60°C, and the low-temperature heat-curing time is 10min;

[0042] (2) Inkjet print the micro-sintering solution on the surface of the printed nano-copper electronic circuit, and use a low-temperature thermosetting method to dry the surface. The low-temperature thermosetting temperature is 100 ℃, and the low-temperature thermosetting time is 5 minutes; Mixtures of ethylene glycol diethyl ether, dipropylene glycol dimethyl ether and ethylene glycol dimethyl ether;

[0043] (3) Use a gallium-based liquid alloy to coat the surface of the printed and micro-sintered nano-copper electronic circuit to obtain a high-co...

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Abstract

The invention provides a method for rapidly preparing a high-conductivity electronic circuit at a low temperature, which comprises the following steps of: printing an electronic circuit by using nano-metal conductive ink in an ink-jet printing manner, performing low-temperature thermocuring or infrared sintering surface drying, performing ink-jet printing on the surface of the nano-metal electronic circuit by using a micro-sintering solution, and performing surface drying; and finally, coating the surface of the micro-sintered nano-metal electronic circuit with liquid metal to obtain the high-conductivity electronic circuit. According to the method, a high-conductivity electronic circuit can be printed at low temperature, the application range of printing can be widened, and the application requirements of the civil fields such as wearable electronics, electronic skin and intelligent sensing can be met.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a high-conductivity electronic circuit that can be quickly printed at low temperature and a preparation method thereof. Background technique [0002] At present, electronic equipment is gradually developing in the direction of intelligence, flexibility, integration and thinness. Flexible printed electronics uses a printing process to prepare flexible devices, which has the characteristics of low cost, simple process, and intelligent design. The combination of conductive ink and printing technology can realize the green, additive and rapid preparation of basic circuits. Among them, conductive ink, printing technology and post-processing technology determine the performance of flexible printed circuits. As the core key material, conductive ink is the cornerstone of the faster and wider application of printed circuits in electronic products. [0003] At present, the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/10C09D11/52C09D11/36
CPCH05K3/125H05K3/107H05K3/10C09D11/52C09D11/36
Inventor 不公告发明人
Owner 山西聚微天成科技有限公司
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