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Laser pulse emission integrated circuit module, manufacturing method and system

A laser pulse, integrated circuit technology, applied in the field of power electronics, can solve the problems of reducing current, shortening detection distance, increasing loss, etc., to achieve the effects of reducing inductance, low cost, and power consumption

Pending Publication Date: 2021-11-30
SHANGHAI XIAOBEN TECH SERVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since di / dt=V / L, if you want to increase the speed of current change and shorten the rising or falling time of the optical pulse, you can only increase the supply voltage Vin, which leads to an increase in loss
[0007] In the mobile phone application scenario, when powered by a lithium battery (about 4V), taking L2=600pH as an example, when it is used to drive a VCSEL (vertical cavity surface emitting laser chip with a voltage drop of about 2V) at a level of 10 amperes, its The rising and falling edges are each about 3nS, if you want it to be 1nS, you can only reduce the current to about 3A to shorten the detection distance

Method used

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  • Laser pulse emission integrated circuit module, manufacturing method and system
  • Laser pulse emission integrated circuit module, manufacturing method and system
  • Laser pulse emission integrated circuit module, manufacturing method and system

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Embodiment Construction

[0158]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0159] figure 2 A schematic circuit diagram of a laser pulse emitting integrated circuit module according to an embodiment of the present invention is shown. The embodiment of the present invention aims to minimize L2, that is, reduce the loop inductance of D1, S1, and C1.

[0160] Due to the requirement of transmission power, the laser generating element D1, the driving switch S1 and the decoupling capacitor C1 need a certain size to support them. Then, even ...

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Abstract

The invention discloses a laser pulse emission integrated circuit module, a manufacturing method and a system. The laser pulse emission integrated circuit module comprises at least one laser generating element D1, at least one driving switch S1 and at least one decoupling capacitor C1; the laser generating element D1, the driving switch S1 and the decoupling capacitor C1 are connected pairwise to form an energy storage electric loop; when the circuit function of laser pulse emission is realized, the energy storage electric loop comprises n sub energy storage electric loops which are distributed at n adjacent sub-space positions of the integrated circuit module, and the n sub energy storage electric loops are arranged in the corresponding n sub-space positions in a manner of suppressing inductive coupling. The equivalent loop is formed by connecting the plurality of sub-loops in parallel, the equivalent loop is far smaller than that of a traditional scheme, the equivalent loop inductance which is 0.5-0.25 times or less can be easily obtained, and the rising edge and falling edge speed of laser pulses can be increased by two times or more than four times.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a laser pulse emitting integrated circuit module, a chip and a manufacturing method and system for shortening the rising edge and falling edge time of a light emitting device. Background technique [0002] Figure 1A A schematic circuit diagram of a light-emitting device in the prior art is shown, wherein D1 is a laser generating element, which is a light-emitting diode, such as a laser diode (the laser diode is used as an example in the follow-up); Vin is a DC power supply, in order to reduce the influence of the power supply lead , often place the capacitor Cin nearby; S1 is the drive switch, the main MOS device; Q1 is the switch drive device, which is the drive circuit of S1; Q2 is the operation control device, which is the control of S1; C1 is the decoupling capacitor; R1 is the power supply resistor Or equivalent resistance; L1 is the equivalent inductance of the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/042H01L25/16H01L23/31H01L23/367H01L21/50H02M1/08
CPCH01S5/0428H01L25/167H01L23/3107H01L23/367H01L21/50H02M1/08H01S5/02469H01S5/04256H01S5/022
Inventor 曾剑鸿
Owner SHANGHAI XIAOBEN TECH SERVICE CO LTD