Main gate electrode for double-sided battery imbricate assembly

Abstract

The invention discloses a main gate electrode for a double-sided battery imbricate assembly, and relates to the field of electrodes. The main gate electrode comprises the following components in percentage by weight: 20-30% of flake powder, 60-72% of ball powder, 2-6% of thermosetting acrylic resin and 0-2% of hydrogenated bisphenol F resin, the curing agent comprises 0.5 to 1 percent of silicone oil, 0.2 to 0.6 percent of dispersing agent and 0.1 to 0.7 percent of thixotropic agent; and 2-4% of an active solvent. According to the main gate electrode for the double-sided battery imbricate assembly, the cost of the assembly battery can be reduced, the fragmentation rate of the imbricate assembly is reduced. Meanwhile, minority carrier recombination does not exist in the main gate area of the battery, and the conversion efficiency of the battery is improved.

Description

technical field [0001] The invention belongs to the field of electrodes, and in particular relates to a main grid electrode for a double-sided battery shingled assembly. Background technique [0002] In the traditional shingled component process, after the battery electrode aluminum paste, back silver, main grid, and front silver are printed and sintered, the battery is cut, and the shingled conductive adhesive is pasted on the main grid electrode using the printing process. After drying and curing, the Battery bonding; this design has the following defects: 1. The shingled conductive adhesive is used on the main grid, which consumes a lot of silver. The single consumption of the main grid is 20-30mg. 2. The thickness of the battery is 160 dimensional density, and the thickness of the conductive agent superimposed on the main grid is 20-40 μm thick, resulting in a high fragmentation rate. 3. In the main grid area of ​​the battery printing, there will be minority carrier rec...

AI Technical Summary

Problems solved by technology

[0002] In the traditional shingled component process, after the battery electrode aluminum paste, back silver, main grid, and front silver are printed and sintered, the battery is cut, and the shingled conductive adhesive is pasted on the main grid electrode using the printing process. After drying and curing, the Battery bonding; this design has the following defects: 1. Shingled conductive adhesive is used on the main grid, which consumes a lot of silver. The single consumption of the main grid is 20-30mg.

2. The thickness of the battery is 160 dimensional density, and the thickness of the conductive agent superimposed on the main grid is 20-40 μm thick, resulting in a high fragmentation rate

3. In the main grid area of ​​the battery printing, there will be minority carrier recombination after sintering, resulting in a decrease in opening voltage

[0003] The patent with the application number CN202010489313.3 discloses a silver paste for the front busbar electrode of crystalline silicon solar cells, including spherical silver powder A, spherical silver powder B, flake silver powder, glass powder, additives and adhesives; The particle size distribution of the spherical silver powder A is: D10 is 0.5-1.5 μm, D50 is 1.0-2.5 μm, and D90 is 2.0-3.0 μm; the tap density of the spherical silver powder A is 4.5-7.5g / cm3; The particle size distribution of the spherical silver powder B is: D10 is 0.1-0.5 μm, D50 is 0.3-0.8 μm, and D90 is 1.0-3.5 μm; the tap density of the spherical silver powder B is 2.0-3.5g / cm3; the sheet The particle size distribution of the silver powder is as follows: D50 is 2.0-5.0 μm; the tap density of the flake silver powder is 2.0-3.5g / cm3; although the spherical silver powder A, spherical silver powder B and The combination of flaky silver powder and glass powder can improve the conductivity and peel strength of the product, but it still cannot solve the above technical problems