Patterned film preparation method without mask plate

A patterned thin film, no mask technology, applied in ion implantation plating, metal material coating process, coating, etc. Problems such as low utilization rate, to achieve the effect of small distance, short coating distance and high utilization rate

Inactive Publication Date: 2021-12-07
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These coating equipment are relatively expensive, and the distance between the coating source and the substrate to be coated is mostly relatively large, and the utilization rate of the evaporation source is relatively low; and the electroplating method will generate a large amount of waste liquid that pollutes the environment, and further environmental protection treatment is required
Therefore, the cost of traditional coating methods is relatively high
In addition, traditional coating and lithography processes are limited by size, especially lithography equipment, generally the maximum substrate size that can be accommodated is 6-8 inches, and it is also very difficult to operate for substrates smaller than 1cm. Therefore, the substrate of the patterned film using the traditional method will have size limitations
In addition, the preparation of patterned films by traditional methods requires relatively high flatness of the substrate.

Method used

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  • Patterned film preparation method without mask plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as figure 1 and figure 2 As shown, a method for preparing a patterned film by laser direct writing on a small-sized substrate comprises the following steps:

[0052] 1) Clean the substrate 1 to be plated. The substrate 1 to be plated is a quartz plate. The substrate 1 to be plated is sequentially immersed in acetone, ethanol, and DI water for ultrasonic cleaning for 5 minutes, and then rinsed with DI water. After cleaning, the substrate is dried.

[0053] 2) Fixing the base to be plated 1 and the coating material 2 . The coating material 2 is a copper sheet; the substrate to be plated 1 is placed below, and the coating material 2 is placed on the top and fixed with a clamp 3 .

[0054] 3) Pattern design and parameter setting. Copper sheets are processed by laser scanning set by software installed on a computer. Set a square pattern with a size of 2×2cm on the software, and process it with a laser with a scanning speed of 10mm / s and a power of 1.8W.

[0055] ...

Embodiment 2

[0057] Such as image 3 As shown, a method suitable for preparing a patterned film by laser direct writing on a large-scale substrate differs from Example 1 in that:

[0058] Step 1) Cleaning the substrate 1 to be plated. The substrate 1 to be plated is glass. The substrate 1 to be plated is directly rinsed with a DI water gun. After cleaning, the substrate 1 to be plated is blown dry with a nitrogen gun.

[0059] Step 2) The substrate to be plated 1 and the coating material 2 are fixed. The coating material 2 is copper foil; the base 1 to be plated is placed below, and the surroundings of the coating material 2 are bonded to the base 1 to be plated.

[0060] Step 4) Using the laser light source 4 to scan and irradiate the fixed substrate 1 to be coated and the coating material 2 . The diameter of the laser spot is set to 10 microns, the laser scanning distance is 1 mm, the laser bombards the coating material 2, and the copper clusters produced by the bombardment are sputter...

Embodiment 3

[0062] Such as Figure 4 As shown, the difference between this embodiment and embodiment 1 is:

[0063] Step 4) Laser direct writing. Set the laser program to triangle, pentagon and English letter "UJN", write the coating material 2 copper foil directly onto the substrate to be plated 1 quartz, such as Figure 4 SEM patterns of different patterns.

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Abstract

The invention discloses a patterned film preparation method without a mask plate. According to the patterned film preparation method without the mask plate, a pretreated substrate to be coated is coated with a coating material by laser direct writing to obtain a patterned film; when the substrate to be coated is located above the coating material, the substrate to be coated is placed on the coating material, laser irradiation is carried out according to a set pattern, laser penetrates through the substrate to be coated and irradiates the sheet-shaped/block-shaped coating material, and the irradiated coating material forms clusters of the material and is sputtered on the substrate to be coated; and when the substrate to be coated is located below the coating material, the coating material is placed on the substrate to be coated, laser irradiation is carried out according to a set pattern, the laser irradiates the coating material and penetrates through the coating material, and the coating material serves as a coating source to form clusters of the material and is sputtered to the substrate to be coated. The method does not use the mask plate, is simple and practical, is low in cost, and can simply realize patterned coating of substrates with various sizes and materials.

Description

technical field [0001] The invention relates to the technical field of patterned thin film material preparation, in particular to a method for preparing a maskless patterned thin film. Background technique [0002] Patterned thin films are widely used in traditional semiconductor optoelectronic device / electronic device manufacturing process, thin film battery manufacturing process, sensor device manufacturing process, emerging microfluidic chip and other biomedical material preparation process, and even handicraft pattern preparation in daily life. A patterned thin film preparation process is used in the process. [0003] In the existing technology, there are generally two methods for preparing a patterned film on a substrate: one is to prepare a film on the substrate first, and then prepare a mask, and make a film pattern by corrosion, etching, etc.; the other is to The pattern is first prepared on the substrate, and then the thin film is deposited, and the pattern is tran...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/28C23C14/04
CPCC23C14/28C23C14/048
Inventor 刘晓燕周伟家张婷房国鑫刘宏
Owner UNIV OF JINAN
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