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A low dielectric constant shape memory polystyrene and its preparation method and application

A low dielectric constant, polystyrene technology, applied in the field of shape memory polymers, can solve the problems of unsatisfactory demand and effective regulation of dielectric properties, etc., and achieve the effect of being suitable for process scale-up production, convenient molding, and simple preparation

Active Publication Date: 2022-07-12
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The most basic requirement for polymer encapsulation resins used in smart electronic device systems such as artificial skin, micro-signal sensing systems for wearable devices, etc. is low dielectric constant to reduce the loss during signal transmission, but the existing shape memory polymerization The dielectric properties of materials have not been effectively regulated, which cannot meet the needs of smart electronic devices for low dielectric constant resins

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  • A low dielectric constant shape memory polystyrene and its preparation method and application
  • A low dielectric constant shape memory polystyrene and its preparation method and application
  • A low dielectric constant shape memory polystyrene and its preparation method and application

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preparation example Construction

[0030] The invention provides a preparation method of low dielectric constant shape memory polystyrene, comprising the following steps;

[0031] The acrylate, vinyl monomer and free radical initiator are mixed to carry out a free radical random copolymerization reaction to obtain the low dielectric constant shape memory polystyrene, and the polyvinyl crosslinking agent comprises divinylbenzene, tris Vinylbenzene or tetravinylbenzene, the vinyl monomers include styrene and 4-vinylbenzocyclobutene.

[0032] In the present invention, the material ratio of the acrylate to the vinyl monomer is preferably 4:6 to 2:8, more preferably: 85.714:200 to 133.33:200.

[0033] In the present invention, the acrylate is preferably methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate or isobutyl acrylate.

[0034] In the present invention, the material ratio of the 4VB to styrene is preferably 1:9 to 4:6, more preferably 1:4, 2:3 or 3:2.

[0035] In the present invention, the mo...

Embodiment 1

[0053] Under normal temperature and normal pressure, in a nitrogen protective atmosphere, in a 250mL there-necked flask equipped with electromagnetic stirring, add 18.747g (180mmol) styrene, 2.604g (20mmol) 4VB, 11.478g (133.33mmol) methyl acrylate, 0.26g (4 mmol vinyl) DVB and 0.657 g (4 mmol) AIBN were stirred at room temperature for 10 minutes to completely dissolve the above materials to obtain a homogeneous solution, then left standing for 20 minutes at room temperature to eliminate the bubbles generated by stirring, and poured into a clean In the petri dish, the temperature was kept in a blast drying oven at 120° C. for 50 hours to complete the curing, and the shape memory polystyrene material was obtained. This was cut into a 9 mm diameter disc for evaluation of dielectric properties.

[0054] figure 1 For the variation curve of the dielectric constant of the comparative example and Example 1 with the test frequency, it can be seen that the dielectric constant of the m...

Embodiment 2

[0056] Under normal temperature and normal pressure, in a nitrogen protective atmosphere, in a 250mL there-necked flask equipped with electromagnetic stirring, add 16.664g (160mmol) styrene, 5.208g (40mmol) 4VB, 8.582g (85.714mmol) ethyl acrylate, 0.52g (8mmol vinyl) DVB and 0.242g (1mmol) BPO were stirred at room temperature for 60min, so that the above materials were completely dissolved to obtain a homogeneous solution, then left standing at room temperature for 60min to eliminate the bubbles generated by stirring, and poured into a clean In the petri dish, the temperature was kept in a blast drying oven at 160° C. for 35 hours to complete the curing, and the shape memory polystyrene material was obtained. This was cut into a 9 mm diameter disc for evaluation of dielectric properties.

[0057] figure 2 For the variation curve of the dielectric constant of the comparative example and Example 2 with the test frequency, it can be seen that the dielectric constant of the mate...

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Abstract

The invention provides a low dielectric constant shape memory polystyrene, a preparation method and application thereof, and belongs to the technical field of shape memory polymers. In the present invention, acrylate, vinyl monomer and free radical initiator are mixed to carry out free radical random copolymerization reaction to obtain the low dielectric constant shape memory polystyrene, and the polyvinyl crosslinking agent comprises divinylbenzene , trivinylbenzene or tetravinylbenzene, the vinyl monomers include styrene and 4-vinylbenzocyclobutene. The present invention adopts 4VB containing benzocyclobutene as modifier. 4VB is similar in structure to styrene, the difference is that a potentially reactive functional group such as benzocyclobutene is added to the side chain. During random copolymerization, the ring-opening addition of the four-membered ring of benzocyclobutene forms a distorted spatial conformation (eight-membered ring structure), thereby increasing the freedom between linear molecular chain copolymers (formed by styrene and acrylate) volume, significantly reducing the dielectric constant.

Description

technical field [0001] The invention relates to the technical field of shape memory polymers, in particular to a low dielectric constant shape memory polystyrene and a preparation method and application thereof. Background technique [0002] Shape memory polymers have been widely researched and explored in recent years. The application of such smart materials can improve device performance, improve device efficiency and overcome some inherent shortcomings of traditional device mechanisms, such as complex assembly processes and large volume and weight. Operation is difficult to achieve, etc. [0003] There are many types of shape memory polymers, including polystyrene, epoxy resin, polyurethane, polyacrylate, polyacrylamide, polyimide, etc. Its application research fields cover aerospace, intelligent medical Equipment, machinery, electricity, etc. Most of the existing domestic researches on the modification of shape memory polymers are based on the modification of shape mem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F212/08C08F212/12C08F220/18C08F212/36C08F220/14C08L25/14
CPCC08F212/08C08L25/14C08L2201/12C08L2203/206C08F212/12C08F220/14C08F212/36C08F220/1802C08F220/1804C08F220/1803
Inventor 陶立明郭丽和张耀明赵普王廷梅王齐华
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI