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Organosilicon foaming pouring sealant and preparation method thereof

A technology of silicone and potting glue

Pending Publication Date: 2021-12-14
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although people have done a lot of research on silicone potting adhesive foam materials, they have low density, low thermal conductivity, high flame retardancy, room temperature curing, and the advantages of addition and condensation curing adhesives. Chemical dehydrogenation There are few products with simple and easy-to-operate soaking methods

Method used

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  • Organosilicon foaming pouring sealant and preparation method thereof
  • Organosilicon foaming pouring sealant and preparation method thereof
  • Organosilicon foaming pouring sealant and preparation method thereof

Examples

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Embodiment 1-5

[0027] The components of the silicone foam potting compound of Examples 1-5 of the present invention are shown in Table 1 below.

[0028] Wherein, the viscosity of the vinyl polysiloxane described in Examples 1-5 at 25°C is 1000-5000cps, and the viscosity of the αω-terminated hydroxyl liquid silicone rubber at 25°C is 1000-5000cps;

[0029] The vinyl content of the vinyl polysiloxane in the A component and the B component is independently selected from 0.18%-0.38%;

[0030] The auxiliary agent is surface-modified hollow glass microspheres with an average particle diameter of 75 μm.

[0031] The inorganic flame retardant is at least one of aluminum hydroxide and zinc oxide.

[0032] The anti-sedimentation agent is surface-modified fumed silica with a particle diameter of 20-30nm.

[0033] The hydrogen-containing silicone oil is a high hydrogen-containing silicone oil with a hydrogen content of 1.5%.

[0034] The concentration of the platinum catalyst is 5000ppm.

[0035] Th...

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Abstract

The invention discloses an organosilicon foaming pouring sealant and a preparation method thereof, belonging to the technical field of pouring materials. The pouring sealant comprises a component A and a component B. The component A comprises the following components in parts by weight: 50-80 parts of vinyl polysiloxane, 1-5 parts of alpha,omega-hydroxyl-terminated liquid silicone rubber, 40-60 parts of an inorganic flame retardant, 1.0-10.0 parts of an auxiliary agent, 0.1-0.5 part of an anti-settling agent and 0.5-1.0 part of a platinum catalyst. The component B is prepared from the following components in parts by weight: 50 to 80 parts of alpha,omega-hydroxyl-terminated liquid silicone rubber, 3 to 5 parts of hydrogen-containing silicone oil, 40 to 60 parts of an inorganic flame retardant, 1.0 to 10.0 parts of an auxiliary agent, 0.5 to 1.0 part of carbon black, 0.5 to 1.0 part of an anti-settling agent and 0.01 to 0.02 part of a polymerization inhibitor. The organosilicon foaming pouring sealant has the advantages of being low in hardness, good in elasticity, low in heat conductivity, good in flame retardance, good in flowability, beneficial to potting, easy and convenient to store and long in quality guarantee period, and has wide application prospects.

Description

technical field [0001] The invention relates to a silicone foam potting glue and a preparation method thereof, belonging to the technical field of potting materials. Background technique [0002] In the potting compound industry, there are three main potting materials, namely epoxy potting compound, polyurethane potting compound and silicone potting compound. The main disadvantages of epoxy resin potting glue are that the repairability after potting is not good, and it cannot have good high and low temperature resistance at the same time, the heat generated during the curing process is large, and the impact damage resistance is poor. Polyurethane potting adhesive has certain toxicity, poor temperature resistance, exothermic heat during curing, certain stress, and poor weather resistance. Silicone potting adhesive is basically non-toxic, mostly elastomer material after curing, with low linear expansion coefficient, basically no stress damage to components, and can be repaire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/04C09J183/05C09J11/04
CPCC09J183/04C09J11/04C08L2201/02C08K2003/2227C08K2003/2296C08K2201/011C08L83/04C08K9/00C08K3/22C08K7/28C08K7/26C08K3/04
Inventor 谢冬柯明新
Owner 江苏矽时代材料科技有限公司