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Method for processing special copper sheet for copper-clad ceramic substrate

A technology of a copper-clad ceramic substrate and a processing method, which is applied in the directions of cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc., can solve the problems of easy powder falling off, uneven surface, and high temperature

Pending Publication Date: 2021-12-24
江苏富乐华半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The thermal oxidation is to oxidize the surface of the copper sheet through high-temperature oxygen in the tunnel-type oxidation furnace. This method has better uniformity of the copper surface, easy control of the oxygen content, and a relatively mature process, but is limited by the oxidation furnace. speed limit, the overall efficiency is not high, and the temperature in the furnace is high, the energy consumption is relatively large, so the cost is high;
[0006] 2. Chemical oxidation is to oxidize the surface of copper sheets through specific chemical reagents under certain reaction conditions. This method has high production efficiency, good thermal cycle performance and bending resistance, but there will be residual powdery particles on the copper surface after oxidation. The powder is easy to fall off, resulting in uneven surface after sintering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for processing copper sheets dedicated to copper-clad ceramic substrates, comprising the following steps:

[0040] S1: Soak the copper sheet in 10% hydrogen peroxide for 5 minutes to remove oil stains on the surface of the copper sheet. Put it into an acidic solvent tank, soak for 15 minutes, and remove the oxide layer formed on the surface of the copper sheet during the roughening process;

[0041] S2: Submerge the copper sheet horizontally in deionized water for 5 minutes and ultrasonically clean it. After cleaning, slowly lift the copper sheet out of the water to dehydrate the surface of the copper sheet. Drip water in the air for 2 seconds at 40°C and dry with hot air at 90°C;

[0042] S3: Immerse the dried copper sheet vertically in deionized water at 35°C for 3 minutes and ultrasonically clean it for 10 minutes at 25°C. After cleaning, slowly lift the copper sheet out of the water to dehydrate the surface of the copper sheet and drip water in the air at 4...

Embodiment 2

[0048] A method for processing copper sheets dedicated to copper-clad ceramic substrates, comprising the following steps:

[0049] S1: Soak the copper sheet in 15% hydrogen peroxide for 5 minutes to remove oil stains on the surface of the copper sheet. Put it into an acidic solvent tank, soak for 15 minutes, and remove the oxide layer formed on the surface of the copper sheet during the roughening process;

[0050] S2: Submerge the copper sheet horizontally in deionized water for 5 minutes and ultrasonically clean it. After cleaning, slowly lift the copper sheet out of the water to dehydrate the surface of the copper sheet. Drip water in the air for 2 seconds at 40°C and dry with hot air at 90°C;

[0051] S3: Immerse the dried copper sheet vertically in deionized water at 35°C for 3 minutes and ultrasonically clean it for 10 minutes at 25°C. After cleaning, slowly lift the copper sheet out of the water to dehydrate the surface of the copper sheet and drip water in the air at 4...

Embodiment 3

[0058] A method for processing copper sheets dedicated to copper-clad ceramic substrates, comprising the following steps:

[0059] S1: Cook the copper sheet in 20% hydrogen peroxide for 5 minutes to remove oil stains on the surface of the copper sheet, use a glue applicator to evenly apply the microetching glue on the surface of the copper sheet, light the light to cure the microetching glue, and remove the copper after 7 minutes Then put the copper sheet into the acid solvent tank and soak for 15 minutes to remove the oxide layer formed on the surface of the copper sheet during the roughening process;

[0060] S2: Submerge the copper sheet horizontally in deionized water for 5 minutes and ultrasonically clean it. After cleaning, slowly lift the copper sheet out of the water to dehydrate the surface of the copper sheet. Drip water in the air for 2 seconds at 40°C and dry with hot air at 90°C;

[0061] S3: Immerse the dried copper sheet vertically in deionized water at 35°C for...

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Abstract

The invention provides a method for processing a special copper sheet for a copper-clad ceramic substrate. The method comprises the following steps: carrying out acidic degreasing, then coating the surface of a copper sheet with a micro-etching adhesive, carrying out light curing, removing an adhesive block on the surface of the copper sheet after 5-10 minutes, and carrying out acid pickling; horizontally immersing the copper sheet into deionized water for ultrasonic cleaning and carrying out hot air drying; vertically immersing the dried copper sheet into deionized water for ultrasonic cleaning, and then carrying out megasonic cleaning and hot air drying; uniformly spraying alkaline oxidation liquid to the surface of the copper sheet by using a high-pressure atomization spraying machine, controlling the temperature and the film thickness, removing liquid on the surface of the copper sheet by cold air after an oxidation film of the copper sheet reaches a preset film thickness, and carrying out suction filtration to obtain a product. According to the method,the copper sheet is coarsened by the micro-etching adhesive, so that the surface of the copper sheet is coarsened uniformly; and ultrasonic cleaning in the horizontal direction and the vertical direction is adopted, and then megasonic cleaning is carried out, so that the cleaning effect is good, the subsequent oxidation reaction uniformity is high, and the final oxidation yield is high.

Description

technical field [0001] The invention relates to the technical field of copper sheets, in particular to a method for processing special copper sheets for copper-clad ceramic substrates. Background technique [0002] DCB refers to a special process method in which copper foil is directly bonded to one or both sides of the surface of an alumina or aluminum nitride ceramic substrate at high temperature. It is realized by forming copper-oxygen eutectic liquid under high temperature conditions. [0003] The common copper sheet treatment methods in this field are degreasing, roughening, pickling, ultrasonic cleaning and copper sheet oxidation after cutting the copper sheet. At present, the ultrasonic cleaning copper sheet process is horizontal line ultrasonic cleaning, and the horizontal line roller is used to a certain extent. It will weaken the effect of ultrasonic cleaning, which makes it difficult to guarantee the surface appearance and cleanliness of the copper sheet before o...

Claims

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Application Information

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IPC IPC(8): C23G1/10B08B3/12C23C22/63C23C22/78
CPCC23G1/103B08B3/12C23C22/63C23C22/78
Inventor 李炎贺贤汉陆玉龙蔡俊董明锋马敬伟
Owner 江苏富乐华半导体科技股份有限公司