Manufacturing process of ultra-miniature semiconductor cooler

Abstract

The invention relates to a manufacturing process of an ultra-miniature semiconductor cooler, which comprises the following steps: crystal grain preparation: cutting a crystal bar into a wafer, electroplating the wafer, cutting the electroplated wafer, cleaning the crystal grain, and coating the crystal grain with a UV (ultraviolet) film to obtain standby crystal grains; printing the hot-side ceramic plate, fixing the standby crystal grains on the hot-side ceramic plate, printing the cold-side ceramic plate, carrying out die assembly welding on the hot-side ceramic plate with the fixed crystal grains and the printed cold-side ceramic plate, and carrying out resistance and infrared testing, grinding, wire welding, glue sealing, electric leakage testing and code spraying to obtain the ultra-miniature semiconductor cooler. According to the process, a multi-wire cutting machine is adopted for cutting the wafer, the ultrasonic cleaning time is shortened, the problems of cavities and product deformation are reduced through a die assembly welding method, and the ultra-miniature semiconductor cooler prepared through the method has good cold and hot impact resistance, is not prone to deformation in the wafer electroplating process and is uniform in product heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of semiconductor refrigerators, and in particular relates to a manufacturing process of ultra-miniature semiconductor refrigerators. Background technique [0002] A semiconductor refrigerator (TEC) is composed of a ceramic plate with a deflector and bismuth telluride grains. The semiconductor refrigerator is a current energy conversion cooling method, also known as thermoelectric refrigeration, which can not only cool, but also heat. Control, can achieve high-precision control of temperature, refrigeration process does not require any refrigerant, no rotating parts, no noise, no vibration, widely used in weapons and equipment, medical experimental equipment, special testing equipment and daily life. [0003] The ultra-miniature semiconductor refrigerator is small in size, the minimum is 1*2mm, and the temperature control requirements of the product are high. At present, there is no document disclosing the pr...

AI Technical Summary

Problems solved by technology

[0003] The ultra-miniature semiconductor refrigerator is small in size, the minimum is 1*2mm, and the temperature control requirements of the product are high. At present, there is no document disclosing the production process of the ultra-miniature semiconductor refrigerator, and the ultra-miniature semiconductor refrigerator is cut into wafers and plated by crystal rods. It is easy to deform during the process, and it is easy to dislocate the product during the hot and cold mold clamping process, resulting in uneven heat dissipation of the product. Using the traditional semiconductor refrigerator welding process is easy to produce voids and product deformation, and the product has poor heat and cold shock resistance.