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Micro-etching liquid for observing copper deposition layer slice of circuit board and micro-etching observation method

A micro-etching liquid and circuit board technology, applied in the field of printed circuit board production, can solve the problems such as difficulty in controlling the corrosion degree of the copper sink layer, inability to judge the position of the separation of the copper layer, clear observation of copper crystallization and grain boundaries, etc. The evaluation results are accurate and reliable, the secondary electron image is clear, and the micro-etching reaction time is short.

Pending Publication Date: 2022-02-08
GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current printed circuit board copper layer is relatively thin, generally reaching the nanometer level, and the use of equipment such as OM microscopes can no longer meet the observation needs, so SEM scanning electron microscope observation is generally used to avoid misjudgment
However, the microetching liquid system used in the existing microetching methods contains strong corrosive acids such as concentrated nitric acid or concentrated sulfuric acid, which are highly corrosive, and it is difficult to control the corrosion degree of the copper deposition layer during the microetching process, resulting in the corrosion of the copper deposition layer. Severe corrosion, even with SEM scanning electron microscope, it is impossible to judge the separation position of copper layer, and it is impossible to clearly observe copper crystals and grain boundaries through secondary electrons, making it difficult to judge and evaluate the quality of circuit boards
In addition, the existing highly corrosive microetching solution has certain safety hazards during operation

Method used

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  • Micro-etching liquid for observing copper deposition layer slice of circuit board and micro-etching observation method
  • Micro-etching liquid for observing copper deposition layer slice of circuit board and micro-etching observation method
  • Micro-etching liquid for observing copper deposition layer slice of circuit board and micro-etching observation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] This embodiment provides a kind of micro-etching solution for observing the sliced ​​copper layer of a circuit board, and the micro-etching solution is composed of the following raw materials in parts by volume:

[0048] 1 part hydrogen peroxide;

[0049] 100 parts of ammonia water;

[0050] 100 parts of deionized water.

[0051] Wherein, the mass fraction of the hydrogen peroxide is 30% (analytical pure); the mass fraction of the ammonia water is 25% (analytical pure).

[0052] In this embodiment, the microetching solution is prepared by uniformly mixing the above-mentioned raw materials according to the proportion.

[0053] This embodiment also provides a microetching observation method for a section of a copper sinking layer of a circuit board, which uses the above-mentioned microetching solution for observing a section of a sinking copper layer of a circuit board, and specifically includes the following steps:

[0054] S1 makes sliced ​​samples, and cleans the prep...

Embodiment 2

[0061] This embodiment provides a micro-etching solution for observing the sliced ​​copper layer of a circuit board, which is basically the same as the micro-etching solution in Example 1. The difference is that the micro-etching solution is composed of the following raw materials in parts by volume:

[0062] 2 parts hydrogen peroxide;

[0063] 100 parts of ammonia water;

[0064] 150 parts of deionized water.

[0065] This embodiment also provides a method for observing the micro-etching of a section of a copper sinking layer of a circuit board, which uses the above-mentioned micro-etching solution for observing a section of a sinking copper layer of a circuit board, and its steps are basically the same as those of the micro-etching observation method in Example 1. That is, it specifically includes the following steps:

[0066] S1 makes sliced ​​samples, and cleans the prepared samples after polishing;

[0067] S2 Prepare microetching solution according to the ratio;

[0...

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Abstract

The invention relates to the technical field of printed circuit board production, in particular to a micro-etching solution for observing a circuit board electroless plating copper layer slice, which consists of the following raw materials in parts by volume: 0.5-2 parts of hydrogen peroxide; 50 to 100 parts of ammonia water; and 50 to 100 parts of deionized water, whereinthe micro-etching solution can avoid over-etching on a copper deposition layer, so that after a sample is corroded, copper lattice distribution and crystal boundaries of all copper layers can be clearly observed through a scanning electron microscope. The invention further discloses a circuit board electroless plating copper layer slice micro-etching observation method adopting the micro-etching liquid.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, and more specifically, relates to a microetching solution and a microetching observation method for section observation of a copper sink layer of a circuit board. Background technique [0002] Metallographic section analysis technology is one of the most common and important analysis methods in the field of printed circuit board manufacturing, and is usually used as the basis for judging the quality of circuit boards. The steps of metallographic slice analysis are mainly cleaning after sampling, sealing the sample with resin mosaic method, then grinding and polishing the sample, and microetching the sample with microetching solution, and finally observing the sample after microetching. Due to the irregular arrangement of atoms on the grain boundaries of pure metals and single-phase alloy crystals, high free energy, and different lattice orientations, the dissolution rates...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/34G01N1/32
CPCC23F1/34G01N1/32
Inventor 郑剑王戟王育华
Owner GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD