Nickel plating deep hole agent and preparation method and electroplating method thereof

A deep-hole agent and nickel-plating technology, applied in the field of nickel-plating deep-hole agent and its preparation, can solve the problems of coating rust, product failure, poor consistency of inner cavity coating, etc., achieve fine crystallization, meet anti-corrosion requirements, and improve adsorption Effect

Pending Publication Date: 2022-03-22
佛山亚特表面技术材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a nickel plating deep hole agent and its preparation method and electroplating method, aiming t

Method used

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  • Nickel plating deep hole agent and preparation method and electroplating method thereof
  • Nickel plating deep hole agent and preparation method and electroplating method thereof

Examples

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Example Embodiment

[0056] Example 1

[0057] Preparation of nickel plated deep porosity:

[0058] Under stirring, an aqueous solution of allyl thiourea having a mass fraction of 10% is added to 1,3-propylsealane in a mass ratio of 1,3-propyl sulfide. In the lactone, then the aqueous solution regulating system pH of 7% by mass of 5% of sodium hydroxide is added, and after the reaction is reacted at 50 ° C, the obtained solid reaction product is washed twice, and the plated nickel is obtained. Hole agent (allyl thiobane sulfonate).

[0059] Nickel-plated liquid configuration:

[0060] Nickel sulfate, nickel chloride, boric acid, main light, softener, and homogenesis are thoroughly mixed with pure water to make the concentration of nickel sulfate in nickel plating solution of 200 g / L, and nickel chloride concentration is 50g / L. However, the concentration of boric acid is 50 g / L, the concentration of the main speculator is 0.4 g / L, the softener is 8 g / L, and the concentration of the hopper is ...

Example Embodiment

[0066] Example 2

[0067] Preparation of nickel plated deep porosity:

[0068] Under stirring, an aqueous solution of allyl thiourea having a mass fraction of 10% is added to 1,3-propylsealane in a mass ratio of 1,3-propyl sulfide. In the lactone, then the aqueous solution regulating system pH of 7% by mass of 5% of sodium hydroxide is added, and after the reaction is reacted at 50 ° C, the obtained solid reaction product is washed twice, and the plated nickel is obtained. Hole agent (allyl thiobane sulfonate).

[0069] Nickel-plated liquid configuration:

[0070] Nickel sulfate, nickel chloride, boric acid, main light, softener, and homopolymer are thoroughly mixed with pure water to enable nickel sulfate in nickel-plated liquid to 220 g / L, and nickel nickel is 55g / L. The concentration of boric acid is 55 g / L, the concentration of the main speculator is 0.5 g / L, the concentration of the soft agent is 10 g / L, and the concentration of the hopper is 2 mL / L is sufficientl...

Example Embodiment

[0076] Example 3

[0077] Preparation of nickel plated deep porosity:

[0078] In the stirring conditions, the aqueous solution of allyl thiourea is added 1,3-propylproxis is added to the mass ratio of 1,3-propyl sulfonyl ester of 2: 1. In the ester, then the aqueous solution regulating system pH of 5% aq. Sodium allyl thioulate sulfonate).

[0079] Nickel-plated liquid configuration:

[0080] Nickel sulfate, nickel chloride, boric acid, main light, softener, and homopolymer are thoroughly mixed with pure water to enable nickel sulfate in nickel-plated liquid to 210 g / L, and nickel chloride concentration is 53 g / L. However, the concentration of boric acid is 53 g / L, the concentration of the main speculator is 0.45 g / L, the concentration of the softener is 9 g / L, the concentration of the hopper is 1.5 ml / L is sufficiently mixed with pure water.

[0081] The plating method includes the steps of:

[0082] The deep hole of the nickel (blind hole hole is 50mm) is used in Na...

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Abstract

The invention discloses a nickel plating deep hole agent and a preparation method and an electroplating method thereof, and the preparation method comprises the following steps: adding an aqueous solution of allylthiourea into 1, 3-propane sultone; and then adding an aqueous solution of sodium hydroxide, and reacting to obtain the nickel-plated deep hole agent. The nickel plating deep hole agent prepared by the preparation method provided by the invention is a polysulfide compound containing unsaturated bonds, can improve the adsorption of a low-electric region to nickel, can enable the nickel plating lower-electric region to generate brightness, can enable a plating layer to crystallize finely, and realizes deep plating capacity, so that the corrosion resistance of the low-electric region is improved, and during a salt spray test, after 48 hours, there is no embroidery spots, and the service life of the nickel plating deep hole agent is prolonged. The product anti-corrosion requirement is met.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a nickel plating deep hole agent, a preparation method thereof and an electroplating method. Background technique [0002] In today's society, the independent production of large-scale equipment and reliable products is constantly improving, and some products have higher and higher requirements for the surface treatment of deep-hole parts. For example, in the battery industry, battery shells are important parts for alkaline battery manufacturers. For corrosion resistance and decoration, the inner and outer surfaces of battery steel shells often need to be plated with bright nickel; in the circuit board industry, electroplating blind holes or through holes is also a common method. However, the existing nickel plating process for deep-hole parts has a wide variety of additives, and the operation process is complicated. Moreover, the inner cavity coating of deep-hole products obtained ...

Claims

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Application Information

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IPC IPC(8): C25D3/12C25D7/04
CPCC25D3/12C25D7/04
Inventor 彭惠泰
Owner 佛山亚特表面技术材料有限公司
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