Filling material for underwater acoustic equipment electronic component encapsulation and acoustic array cable and preparation method of filling material

Abstract

The invention relates to the technical field of underwater acoustic materials, in particular to an underwater acoustic equipment electronic component potting and acoustic array cable filling material with low permeability coefficient and low acoustic insertion loss and a preparation method of the underwater acoustic equipment electronic component potting and acoustic array cable filling material. 20%-41% of dimer acid diisocyanate (DDI); 1%-10% of a chain extender; 0%-0.05% of a catalyst; and 0%-0.1% of a defoaming agent. Compared with organic silicon pouring sealants widely used in the electronic industry, the novel filling material has the advantage that the permeability coefficient is only about 7% of that of the organic silicon pouring sealants widely used in the electronic industry. In addition, the underwater acoustic equipment electronic component encapsulating material with the low water permeability coefficient further has the self-healing characteristic, the service life of the material can be greatly prolonged, and the use safety of the material is improved. The mechanical strength of the material is low and is about 0.85 MPa, the material is easy to disassemble, and convenience is provided for repair and maintenance of electronic components.

Description

technical field [0001] The invention relates to the technical field of underwater acoustic materials, in particular to a filling material for electronic components of underwater acoustic equipment and acoustic array cables with low water permeability and low acoustic insertion loss and a preparation method thereof. Background technique [0002] The underwater sub-units in underwater acoustic equipment, such as underwater acoustic transducers and acoustic array cables, have been working underwater for a long time. , Preventing moisture intrusion and penetration is very important for improving the reliability of components and even the entire system. Different from general electronic components, the working environment of electronic components in underwater acoustic equipment is more humid, especially when such components work underwater for a long time, not only the intrusion and penetration of water vapor is faster, but also the guarantee of maintenance in case of failure oc...

AI Technical Summary

Problems solved by technology

[0003] However, the biggest defect of silicone potting compound is the high water permeability (6.3*10 -13 g·cm / cm2·s·Pa), which is about 13 times that of neoprene, a common underwater acoustic material. In addition, the filling material used in the acoustic array cable should allow sound waves to pass through as non-destructively as possible while blocking water penetration. Its water resistance and sound transmission performance have higher requirements

Therefore, silicone potting compound is not suitable for insulating potting of electronic components that need to work underwater for a long time in underwater acoustic equipment and filling of acoustic array cables

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