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Etching solution and application thereof

A technology of etching solution and stabilizer, which is applied in the field of etching solution and its application in the etching of titanium-based metals, can solve the problems of affecting chip reliability, aluminum electrode damage, and undercut easily, so as to maintain the stability of etching rate, The effect of long service life and avoiding excessive decomposition

Pending Publication Date: 2022-04-12
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the wet etching solution currently used for titanium etching still has the following disadvantages: (1) the use stability of the etching solution; (2) the etching rate is too slow; (3) the damage of the aluminum electrode; (4) the formation of Incomplete and uneven etching caused by bubbles; (5) The seed titanium layer is prone to undercut (undercut)
[0009] The above problems will greatly affect the reliability of the chip

Method used

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  • Etching solution and application thereof
  • Etching solution and application thereof
  • Etching solution and application thereof

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Experimental program
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Effect test

preparation example Construction

[0054] The present invention does not specifically limit the preparation method of the etching solution, which can be prepared by mixing and other methods.

[0055] The second aspect of the present invention provides an application of the above-mentioned etching solution in the etching of titanium-based metals. The titanium-based metals in the present invention can be titanium metal or titanium-containing alloy materials, such as titanium-tungsten alloys and other titanium-based metal materials used for advanced packaging.

[0056] performance evaluation

[0057] Performance parameter test standard:

[0058] 1.H 2 o 2 Relative reduction, the code is K, unit %; K=(initial hydrogen peroxide content-hydrogen peroxide content at detection time point) / initial hydrogen peroxide content, expressed by K24, K48, K72, and K96 respectively for 24h, 48h, and 72h , The relative reduction of the hydrogen peroxide phase in the etching solution during 96h; the low K value is excellent, an...

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Abstract

The invention relates to the technical field of etching, in particular to etching liquid and application thereof. The etching liquid is prepared from the following raw materials: at least one oxidant, at least one stabilizer and deionized water. According to the etching liquid disclosed by the invention, under the combined action of the hydrogen peroxide and the stabilizer, the etching liquid disclosed by the invention has good stability and relatively long service life; the etching solution provided by the invention has the advantages of higher etching speed and better etching speed stability, and has a good etching effect on titanium series metals.

Description

technical field [0001] The invention relates to the technical field of etching, and more specifically, the invention relates to an etching solution and its application in etching titanium-based metals. Background technique [0002] Titanium or titanium-tungsten alloy, which is a titanium-based metal, is often used as a base layer of tin or tin alloy nickel structure copper pillars, tin or tin alloy nickel pillars, and copper wiring in advanced packaging processes. Advanced packaging is the process of making solder joints or bumps for the wafer after the integrated circuit chip is manufactured. The purpose is to build an interconnection medium for the next step interconnection of a single chip. The packaging factory generally rearranges the wiring or makes bumps for the interconnection of the chip through a graphical process. The first thing to do is to use a magnetron sputtering machine to sputter a layer of titanium and a layer of copper on the entire surface of the wafer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/38
CPCC09K13/00C23F1/38H01L21/32134C09K13/06
Inventor 高晓义胡杭剑
Owner SHANGHAI PHICHEM MATERIAL CO LTD
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