AlGaN-based deep ultraviolet light emitting diode device structure and preparation method thereof
A technology for light-emitting diodes and device structures, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven injection and low carrier injection efficiency, reduce the polarization charge density, solve the Droop effect, and reduce the potential The effect of base height
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[0054] Example 1 Preparation of High Injection Efficiency Deep Ultraviolet LED Structure Using Sidewalls
[0055] This embodiment provides a method for preparing a high-injection-efficiency deep-ultraviolet LED structure utilizing the sidewall of a V-shaped etching pit, such as figure 1 shown, including:
[0056] S1: Put the (0001) plane sapphire substrate in the reaction chamber of MOCVD equipment (3×2”Aixtron CCS FP-MOCVD), and pass H 2 , the reaction chamber pressure was 40mbar, baked at 1100°C for 300s, cleaned the substrate and lowered the temperature to 930°C, fed ammonia gas and TMAl to grow the AlN nucleation layer of 10nm, then raised the temperature to 1250°C, and epitaxially grown AlN with a thickness of 1 micron ;
[0057] Then the temperature was lowered to 1160°C, and ammonia gas, TMAl and TMGa were introduced to grow 20 cycles of Al 0.6 Ga 0.4 AlGaN with an Al composition of 0.6 and a thickness of 300 nanometers (ie i-AlGaN) is grown after the N / AlN stress a...
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