Method for improving heat conduction and heat dissipation through nano-deposition of graphene coating

Abstract

The invention discloses a method for improving heat conduction and heat dissipation through a nano-deposited graphene coating. Comprising the following steps: mixing and curing graphene, carbon nanotubes, nano silicon dioxide, nano aluminum oxide, a magnetoelectric ion complexing agent, an ion regulator, an ion cross-linking agent, an ion curing agent, a pH regulator, a nano dispersant, an ion solution stabilizer and deionized water at normal temperature and normal pressure to form a stable cured solution; performing nano-dispersion on the cured liquid for 3-28 hours to form a stable nano-dispersion liquid; curing the stable nano dispersion liquid at normal temperature and normal pressure to form stable graphene nano deposition liquid for later use; a graphene coating is nano-deposited on the surface of a heat dissipation device, uniform and stable graphene micro-fins in directional arrangement are formed on the surface of the device, the heat dissipation surface area is remarkably increased, and the maximum surface area can be increased by more than two times; meanwhile, the heat conductivity and the heat radiation coefficient of graphene are relatively higher, and the heat conduction and heat dissipation performance of the heat dissipation device is integrally improved.

Description

technical field [0001] The invention belongs to the technical field of heat conduction and heat dissipation, in particular to a method for improving heat conduction and heat dissipation by nano depositing graphene coating. Background technology [0002] The urgent demand of 5g Technology (base station and supporting terminal electronic devices) and new energy (mainly batteries, power supplies and charging piles) for intensification, miniaturization and precision controllability puts forward higher requirements for the whole energy exchange and heat conduction and heat dissipation, which are required to be increased by more than 5 times. Aerospace lightweight and miniaturized heat conduction and heat dissipation devices need more efficient and stable heat conduction and heat dissipation to ensure the stable operation of the whole unit. At present, in order to effectively improve the heat conduction and heat dissipation, there are mainly five ways: first, increasing the heat dissip...

AI Technical Summary

Problems solved by technology

At present, in order to effectively improve heat conduction and heat dissipation, there are mainly the following five ways: first, increasing the heat dissipation area will inevitably lead to increased volume and weight, resulting in increased energy consumption and reduced operational stability; second, material replacement, such as replacing copper with aluminum, The lifting is limited, the weight increases significantly, and the cost increases significantly; thirdly, the introduction of heat pipes can basically realize the rapid conduction of concentrated heat, but if the heat dissipation is not timely, the cold end and the hot end of the heat pipe will reach a thermal balance, and the heat pipe will fail

In addition, there are hidden dangers in the heat pipe package and damage and aging caused by other factors; fourth, the introduction of air cooling increases the volume and generates noise, and the stability of the fan operation adds additional unstable factors; fifth, the introduction of liquid cooling, high requirements Intensive liquid cooling technology is not yet mature, especially for packaging and preventing coolant leakage;

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