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Photosensitive dry film and preparation method thereof

A technology of photosensitive dry film and photopolymerization initiator, which can be used in photosensitive materials and coatings for optomechanical equipment, and can solve the problems of poor film formation and poor viscosity.

Pending Publication Date: 2022-05-10
广东诚展科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current photosensitive dry film, on the one hand, has poor viscosity, and on the other hand, in the preparation process, the film-forming property is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A photosensitive dry film, comprising the following components in parts by weight:

[0022] 35 parts of modified acrylic resin, 30 parts of solvent, 1 part of photopolymerization initiator, 40 parts of alkali-soluble resin, described alkali-soluble resin is made of 5 parts of methacrylic acid, 10 parts of tetrahydrofurfuryl methacrylate, 10 parts Parts of isooctyl methacrylate suspension polymerization.

[0023] The photopolymerization initiator is benzoin ether.

[0024] The weight-average molecular weight of the alkali-soluble resin is 120,000, and the PDI is 2.0.

[0025] Also included is an additive that is 1 part of a tackifier.

[0026] The solid content of the modified acrylic resin is 45%, the viscosity is Z3, the acid value is 60 mgKOH / g, and the molecular weight is 100,000.

[0027] Dissolve the modified acrylic resin, photopolymerization initiator, and alkali-soluble resin additive in the solvent according to the set ratio, stir at 25°C for 4 hours, remove...

Embodiment 2

[0030] A photosensitive dry film, comprising the following components in parts by weight:

[0031] 40 parts of modified acrylic resins, 35 parts of solvents, 2 parts of photopolymerization initiators, 48 ​​parts of alkali-soluble resins, said alkali-soluble resins are composed of 7 parts of methacrylic acid, 15 parts of tetrahydrofurfuryl methacrylate, 20 parts of Parts of isooctyl methacrylate.

[0032] The photopolymerization initiator is a mixture of benzoin ether, benzophenone and derivatives thereof.

[0033] The weight average molecular weight of the alkali-soluble resin is 130000, and the PDI is 1.8.

[0034] Also included is an additive which is 2 parts plasticizer.

[0035] The solid content of the modified acrylic resin is 45%, the viscosity is Z4, the acid value is 60mgKOH / g, and the molecular weight is 106000.

[0036] Dissolve the modified acrylic resin, photopolymerization initiator, and alkali-soluble resin additive in the solvent according to the set ratio, ...

Embodiment 3

[0040] A photosensitive dry film, comprising the following components in parts by weight:

[0041] 45 parts of modified acrylic resins, 40 parts of solvents, 3 parts of photopolymerization initiators, 55 parts of alkali-soluble resins, said alkali-soluble resins are composed of 10 parts of methacrylic acid, 20 parts of tetrahydrofurfuryl methacrylate, 25 parts of Parts of isooctyl methacrylate.

[0042] The photopolymerization initiator is a mixture of benzoin ether, benzophenone and its derivatives, thioxanthone series compounds, anthraquinone and its derivatives.

[0043] The weight average molecular weight of the alkali-soluble resin is 140000, and the PDI is 1.5.

[0044] Also included is an additive which is 2 parts of antioxidant.

[0045] The solid content of the modified acrylic resin is 45%, the viscosity is Z4, the acid value is 60mgKOH / g, and the molecular weight is 108000.

[0046] Dissolve the modified acrylic resin, photopolymerization initiator, and alkali-so...

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Abstract

The invention relates to a photosensitive dry film and a preparation method thereof, the photosensitive dry film comprises the following components by weight: 35-45 parts of modified acrylic resin, 30-40 parts of a solvent, 1-3 parts of a photopolymerization initiator, and 40-55 parts of alkali-soluble resin, the alkali-soluble resin is composed of 5-10 parts of methacrylic acid, 10-20 parts of tetrahydrofurfuryl methacrylate, and 10-25 parts of 2-ethylhexyl methacrylate, the preparation method comprises the following steps: dissolving modified acrylic resin, a photopolymerization initiator and an alkali-soluble resin additive in a solvent according to a set proportion, stirring at 25 DEG C for 4 hours, and removing impurities by using a 500-mesh filter to obtain a photosensitive dry film solution; and coating a PET film with the stirred and filtered photosensitive dry film solution, and drying to obtain a photosensitive dry film finished product. The hot melt adhesive provided by the invention has relatively high adhesive force and strong corrosion resistance at the same time.

Description

technical field [0001] The invention relates to a photosensitive dry film, in particular to a photosensitive dry film and a preparation method thereof. Background technique [0002] Photosensitive dry film is a polymer functional photoimaging film, which has the characteristics of ultraviolet light sensitivity and lye solubility, and is used for the production of precision circuit board graphics. The manufacture of circuit boards is a cumbersome process that requires multiple processes and can only be completed by professional personnel. Among them, only the production of circuit graphics includes the following steps: first, cover (screen printing or film) a layer of resist chemical film on a clean copper-clad board, then expose it to ultraviolet light on film, and then develop it with sodium carbonate solution. Existing patterns, electroplating with electroplating solution, etching with ammonium persulfate and other etching solutions to remove unnecessary metal copper, and...

Claims

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Application Information

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IPC IPC(8): C08J7/04C08L67/02G03F7/004G03F7/09
CPCC08J7/0427G03F7/004G03F7/09C08J2367/02C08J2433/06C08J2433/00
Inventor 杨仁鸿杨忠平杨伟奕
Owner 广东诚展科技股份有限公司
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