Wafer washing and spin-drying machine and washing and spin-drying method

Abstract

The invention belongs to the technical field of wafer processing equipment, and particularly relates to a wafer washing and spin-drying machine and a washing and spin-drying method. The invention provides a wafer washing and spin-drying machine which comprises at least one functional module and a structural assembly, the functional module comprises a cavity and a cavity door, the cavity and the cavity door are oppositely arranged, and a servo motor, a water spraying device, a heating device, a static electricity eliminator and an electromagnetic valve are arranged on the surface of the cavity; the modular design is adopted, each functional module has all functions, the structure is simple, design is reasonable, production is easy, each module is independently controlled and operates, the modules can be assembled according to the requirement of a user for the number of cavities, a single-cavity or multi-cavity structure is formed, the manufacturing difficulty and the input cost of equipment are reduced, and the production efficiency is improved. And the user has more selection space, so that the user can better meet the requirements of customers.

Description

technical field [0001] The invention belongs to the technical field of wafer processing equipment, and in particular relates to a wafer washing and drying machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. With the continuous development of the third-generation semiconductor manufacturing process, wafer cleaning technology is gradually improving. During the process of grinding, polishing, epitaxy, etc., wafers are inevitably affected by the environment, personnel, equipment, tools, etc. to introduce pollutants. Among them, pollutants can be roughly classified into particles, organic matter, metal pollutants, and oxide l...

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Problems solved by technology

prone to accidents

[0008] (5) The cleaning process of the existing wafer washing and drying equipment is usually a drying process. During the drying process, the drying mechanism is usually required to have a high speed, and the maximum needs to reach 2000 rpm. The high speed will affect the wafer box. The requirements for the dynamic balance of the bracket are very high, the requirements for the center of mass accuracy of the wafer box are also very high, and the requirements for the shape center of mass of the wafer are also very high. If one of the parts has a large eccentricity, the entire cleaning equipment will vibrate at high speed In severe cases, the equipment may not work properly; hot nitrogen gas needs to be introduced during the drying process, and the temperature requirement for hot nitrogen gas may reach 200-500°C. If the temperature is 500°C

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