PC/ABS alloy material as well as preparation method and application thereof

A technology of alloy materials and ABS resin, which is applied in the field of PC/ABS alloy materials and its preparation, can solve the problems of performance degradation, inability to realize low dielectric, flame retardancy, and heat conduction of PC/ABS alloy materials, and achieve flame retardancy and Improved electrical conductivity, suitable for mass production applications, and excellent flame retardant properties

Pending Publication Date: 2022-05-13
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems to be solved by the present invention is that the performance of the PC / ABS alloy material decreases due to the flame retardant in the prior art, and it is impossible to realize the problems of low dielectric, flame retardancy and heat conduction of the PC / ABS alloy material at the same time. A PC / ABS alloy material is provided, which can meet the requirements of 5G equipment and equipment for low dielectric, flame retardancy and heat dissipation (high thermal conductivity) at high frequencies, and is especially suitable for 5G high-frequency communications and other application areas

Method used

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  • PC/ABS alloy material as well as preparation method and application thereof
  • PC/ABS alloy material as well as preparation method and application thereof
  • PC/ABS alloy material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Preparation of low dielectric flame retardant PC / ABS alloy material:

[0050] 66 parts (6.6kg) of dry-treated PC resin (300°C, 1.2kg melt flow rate 11.9g / 10min), 16.5 parts ( 1.65kg), maleic anhydride grafted ethylene-octene copolymer (grafting rate 1.3%) 5 parts (0.5kg), white oil 1 part (0.1kg), fully mixed at room temperature; 2 parts (0.2kg) of aluminum nitride (average particle size 10 μm) treated with 2% γ-aminopropyltriethoxysilane, 1,3-phenylene diphosphate tetrakis (2,6-di 10 parts (1kg) of methyl phenyl) ester, 0.5 part of polytetrafluoroethylene (0.05kg), 0.8 part of tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid] pentaerythritol ester (0.08kg), continue to mix evenly. Then, it was introduced into the main feeding port of LABTECH co-rotating twin-screw extruder (screw diameter 16mm, aspect ratio 40), and was melted and kneaded and extruded under the process conditions of 280°C, 250rpm, and feeding rate 4kg / h, cooled, Pelletizing to prepare l...

Embodiment 2

[0052] Preparation of low dielectric flame retardant PC / ABS alloy material:

[0053] 65.6 parts of dry treated PC resin (300°C, 1.2kg melt flow rate 11.9g / 10min), 16.4 parts of dry treated ABS resin (220°C, 10kg melt flow rate 15.8g / 10min), maleic anhydride 5 parts of branched ethylene-octene copolymer (grafting rate 1.3%), 1 part of white oil, fully mixed at room temperature; 2 parts of treated aluminum nitride (average particle size 10 μm), 10 parts of 1,3-phenylene diphosphate tetrakis (2,6-dimethylphenyl) ester, flake graphene (thickness 100 nm, plane dimension width 20 μm) 0.5 part, polytetrafluoroethylene 0.5 part, tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol 0.8 part, and continue to mix evenly. Then, it was introduced into the main feeding port of LABTECH co-rotating twin-screw extruder (screw diameter 16mm, aspect ratio 40), and was melted and kneaded and extruded under the process conditions of 280°C, 250rpm, and feeding rate 4kg / h, coo...

Embodiment 3

[0055] Preparation of low dielectric flame retardant PC / ABS alloy material:

[0056] 65.2 parts of dry treated PC resin (300°C, 1.2kg melt flow rate 11.9g / 10min), 16.3 parts of dry treated ABS resin (220°C, 10kg melt flow rate 15.8g / 10min), maleic anhydride 5 parts of branched ethylene-octene copolymer (grafting rate 1.3%), 1 part of white oil, fully mixed at room temperature; 2 parts of treated aluminum nitride (average particle size 10 μm), 10 parts of 1,3-phenylene diphosphate tetrakis (2,6-dimethylphenyl) ester, flake graphene (thickness 100 nm, plane dimension width 20 μm) 1 part, 0.5 part of polytetrafluoroethylene, 0.8 part of tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, and continue to mix evenly. Then, it was introduced into the main feeding port of LABTECH co-rotating twin-screw extruder (screw diameter 16mm, aspect ratio 40), and was melted and kneaded and extruded under the process conditions of 280°C, 250rpm, and feeding rate...

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Abstract

The invention relates to a PC (polycarbonate) / ABS (acrylonitrile butadiene styrene) alloy material which comprises PC resin, ABS resin, an interface compatilizer, a composite flame retardant, modified aluminum nitride and the like, and the composite flame retardant comprises a phosphate flame retardant, graphene and polytetrafluoroethylene. The invention also provides a preparation method and application of the PC / ABS alloy material. The efficient composite flame retardant disclosed by the invention not only has excellent flame retardant property, but also can form a high-thermal-conductivity network structure by simultaneously introducing the graphene and the modified aluminum nitride, so that the heat dissipation performance is improved. The dielectricity, flame retardance and conductivity of the low-dielectric flame-retardant PC / ABS alloy material disclosed by the invention are remarkably improved, and a better technical effect is achieved. Meanwhile, the preparation method is simple, easy to implement and suitable for large-scale production and application.

Description

technical field [0001] The invention belongs to the field of polymer materials, in particular to a PC / ABS alloy material and its preparation method and application. Background technique [0002] PC / ABS alloy, a mixture of polycarbonate (PC) and acrylonitrile-butadiene-styrene copolymer (ABS), is a thermoplastic blended from PC and ABS, combining the excellent properties of the two materials Features, such as the formability of ABS materials and the mechanical properties, impact strength, temperature resistance, and UV resistance of PCs, are widely used in communication equipment, automotive interior parts, business machines, home appliances, and lighting equipment. [0003] With the advent of the 5G era, more and more attention has been paid to the power loss of 5G electronic components and communication systems, the rapid dissipation of heat generated during the use of materials, and accidents such as leakage or contact fires. Flame-retardant and heat-conducting polymer co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08L27/18C08L51/06C08L91/06C08K13/06C08K9/06C08K3/28C08K3/04C08K5/523
CPCC08L69/00C08L2203/20C08L2201/02C08L2205/035C08L2205/08C08K2003/282C08K2201/016C08K2201/005C08L55/02C08L27/18C08L51/06C08L91/06C08K13/06C08K9/06C08K3/28C08K7/00C08K3/042C08K5/523
Inventor 于志省王洪学李应成
Owner CHINA PETROLEUM & CHEM CORP
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