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Reactive polyurethane hot melt adhesive for TWS earphone bonding and preparation method thereof

A polyurethane hot-melt adhesive, reactive technology, used in polyurea/polyurethane adhesives, adhesive types, adhesives, etc., can solve the problems of many production and assembly processes, complex structure of TWS earphones, and large number of parts.

Pending Publication Date: 2022-05-13
SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the mobile phone, tablet, smart wearable and earphone industries on the market, the adhesive pressure holding time for structural parts bonding is usually 2 hours. Glue urgently needs short pressure-holding products to achieve rapid positioning to improve production line production efficiency

Method used

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  • Reactive polyurethane hot melt adhesive for TWS earphone bonding and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 10 parts of polyoxypropylene diol with molecular weight of 1000, 10 parts of crystalline polyester polyol (polycaprolactone polyol with molecular weight of 1000), 10 parts of liquid polyester polyol (molecular weight of 1000), high glass transition temperature Add 20 parts of acrylic resin (molecular weight 8000, Tg at 65°C) into the reaction kettle, vacuum dehydrate at 140°C for 2-h until the water content is less than 200ppm, then cool down to 80°C; add toluene diisocyanate into the system while stirring under nitrogen protection 15 parts and 15 parts of modified perovskite wire, after the addition is completed, vacuumize the reaction, slowly raise the temperature to 105 ° C, keep for 2 hours, add 0.01 part of bismorpholino diethyl ether agent, γ-aminopropyl trimethyl ether under the protection of nitrogen 0.1 part of oxysilane, 0.01 part of antioxidant 245, and vacuum reaction for 0.5-h to obtain polyurethane adhesive;

[0034] Wherein the preparation method of the m...

Embodiment 2

[0036] 20 parts of polyoxypropylene-oxyethylene diol with molecular weight of 2000, 20 parts of crystalline polyester polyol (polycarbonate diol with molecular weight of 3000), 20 parts of liquid polyester polyol (molecular weight of 3000), high vitrification Transition temperature: Add 25 parts of acrylic resin (molecular weight: 20000, Tg at 75°C) into the reaction kettle, vacuum dehydrate at 145°C for 2.5 hours until the water content is less than 200ppm, then cool down to 85°C; add diphenyl into the system while stirring under nitrogen protection 20 parts of methyl methane diisocyanate and 20 parts of modified perovskite wire. After the addition, vacuumize the reaction, slowly raise the temperature to 110°C, keep it for 2.5 hours, add 0.5 parts of triethyldiamine, γ-mercaptopropyl 1 part of triethoxysilane, 0.5 part of antioxidant 1035, and vacuum reaction for 0.7h to obtain a polyurethane adhesive;

[0037] Wherein the preparation method of the modified perovskite wire is...

Embodiment 3

[0039]30 parts of polyoxypropylene-oxyethylene diol with molecular weight of 4000, 30 parts of crystalline polyester polyol (polycaprolactone polyol with molecular weight of 6000), 30 parts of liquid polyester polyol (molecular weight of 6000), high glass Transformation temperature Acrylic resin (molecular weight 80000, Tg at 85°C) 30 parts into the reaction kettle, vacuum dehydration at 150°C for 3 hours until the water content is less than 200ppm, then lower the temperature to 90°C; add toluene into the system while stirring under nitrogen protection 25 parts of isocyanate and 30 parts of modified perovskite wire, after the addition is completed, vacuumize the reaction, slowly raise the temperature to 115 ° C, keep for 3 hours, add 1 part of triethyldiamine, γ-isocyanate propyl triethoxy 3 parts of silane, 1 part of antioxidant 245, and vacuum reaction for 1 hour to obtain polyurethane adhesive;

[0040] Wherein the preparation method of the modified perovskite wire is as fo...

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Abstract

The invention relates to a reactive polyurethane hot melt adhesive for TWS earphone adhesion and a preparation method thereof, and the reactive polyurethane hot melt adhesive comprises the following components by weight: 10-30 parts of polyether polyol; 10 to 30 parts of crystalline polyester polyol; 10 to 30 parts of liquid polyester polyol; 20 to 30 parts of acrylic resin with high glass transition temperature; 15 to 25 parts of polyisocyanate; 15 to 30 parts of modified perovskite wires; 0.01 to 1 part of a catalyst; 0.1 to 3 parts of a silane coupling agent; and 0.01 to 1 part of an antioxidant. The prepared adhesive is suitable for bonding shells of TWS earphone equipment and has the characteristics of high curing speed, high initial adhesion strength, sweat resistance and the like, the waterproof grade can reach 5ATM, the pressure maintaining time in the TWS earphone assembly process can be shortened to 30 minutes, and the assembly efficiency of a TWS earphone production line is greatly improved.

Description

technical field [0001] The invention relates to an adhesive, in particular to a reactive polyurethane hot-melt adhesive used for bonding TWS earphones and a preparation method thereof. Background technique [0002] TWS is the abbreviation of True Wireless Stereo, that is, true wireless stereo. With the rapid development of Bluetooth technology and people's pursuit of light and efficient wearable products, TWS earphones have entered the field of vision of users and have been recognized and favored by more and more people. Compared with traditional wired earphones, TWS earphones get rid of the shackles of earphone wires, avoid troubles such as winding, disconnection, and stethoscope effect, and are more portable and beautiful. At present, in the mobile phone, tablet, smart wearable and earphone industries on the market, the adhesive pressure holding time for structural parts bonding is usually 2 hours. Glue urgently needs short pressure-holding products to achieve rapid posi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/08C09J11/04C08G18/42C08G18/44C08G18/48
CPCC09J175/04C09J11/08C09J11/04C08G18/4018C08G18/4825C08G18/4277C08G18/44C08G18/4833C08K2003/385C08L33/00C08K3/38C08K7/24
Inventor 韩继新李日辉李俊杰王飞赵勇刚
Owner SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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