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Formula and preparation method of grouting conductive slurry

A technology of conductive paste and hole filling, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of substandard, bubbles in silver paste, product quality, rework, etc., to achieve The effect of eliminating air bubbles, ensuring hole filling performance and adhesion, and strong adhesion performance

Pending Publication Date: 2022-06-03
NANO TOP ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of this application is to provide a formula of conductive paste for filling holes and its preparation method to solve the problem that when filling silver paste, there may be bubbles in the silver paste so that the line between the two copper wires will not be conducted. The problem of rework due to substandard quality

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  • Formula and preparation method of grouting conductive slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0024] According to mass percentage, weigh 0.2% boiled adhesion promoter, 0.6% anti-overflow auxiliary agent, 0.2% defoamer, 0.6% dispersant, 0.1% curing agent accelerator, 8% thinner, 80% silver powder and 9wt% of EPP710x and amino acid modified epoxy resin, the above raw materials are mixed in a mixer for 1 hour, and then subjected to high-speed shearing, grinding and dispersing in a mill to obtain a premix. Weigh the curing agent according to the formula, control the temperature in the range of -100C ~ 50C, and mix it with the premix for 30 minutes in a mixer to obtain a conductive paste; filter the obtained conductive paste through a 200-800 mesh screen to remove The impurities in the slurry or the unevenly dispersed larger particles, then the filtered conductive silver paste is placed in a vacuum defoaming machine, and after vacuuming, the conductive paste for filling holes is obtained, and its viscosity value is detected. The value is 10000-60000cp.

Embodiment example 2

[0026] According to mass percentage, weigh 0.2% boiled adhesion promoter, 0.6% anti-overflow auxiliary agent, 0.2% defoamer, 0.6% dispersant, 0.1% curing agent accelerator, 8% thinner, 80% silver powder and 9wt% of 170 and amino acid modified epoxy resin, the above raw materials are mixed in a mixer for 1 hour, and then subjected to high-speed shear grinding and dispersion in a mill to obtain a premix. Weigh the curing agent according to the formula, control the temperature in the range of -100C ~ 50C, and mix it with the premix for 30 minutes in a mixer to obtain a conductive paste; filter the obtained conductive paste through a 200-800 mesh screen to remove The impurities in the slurry or the unevenly dispersed larger particles, then the filtered conductive silver paste is placed in a vacuum defoaming machine, and after vacuuming, the conductive paste for filling holes is obtained, and its viscosity value is detected. The value is 10000-60000cp.

Embodiment example 3

[0028] According to mass percentage, weigh 0.2% boiled adhesion promoter, 0.6% anti-overflow auxiliary agent, 0.2% defoamer, 0.6% dispersant, 0.1% curing agent accelerator, 8% thinner, 80% silver powder and 9wt% Shell 828 and amino acid modified epoxy resin, the above raw materials are mixed in a mixer for 1 hour, and then subjected to high-speed shear grinding and dispersion in a mill to obtain a premix. Weigh the curing agent according to the formula, control the temperature in the range of -100C ~ 50C, and mix it with the premix for 30 minutes in a mixer to obtain a conductive paste; filter the obtained conductive paste through a 200-800 mesh screen to remove The impurities in the slurry or the unevenly dispersed larger particles, then the filtered conductive silver paste is placed in a vacuum defoaming machine, and after vacuuming, the conductive paste for filling holes is obtained, and its viscosity value is detected. The value is 10000-60000cp.

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Abstract

The invention discloses a grouting conductive slurry formula and a preparation method thereof. The formula comprises the following components in parts by weight: 60-90 parts of silver powder, 5-30 parts of liquid epoxy resin, 0.1-1 part of a water boiling adhesion promoter, 0.8-1.5 parts of a liquid curing agent, 0.1-0.2 part of a curing accelerator, 0.2-0.5 part of a liquid dispersing agent, 0.5-1 part of a toughening agent and 10-30 parts of an active epoxy diluent. The reactive diluent and the liquid curing agent are used in cooperation, shrinkage caused by solvent volatilization is eliminated, bubbles generated in the hole filling process are eliminated, the hole filling performance and adhesive strength of the slurry are guaranteed, the conductivity of the slurry is improved to a large extent, and the service life of the slurry is prolonged. Therefore, the situation that a circuit between the two copper wires cannot be conducted is avoided, and the yield is effectively guaranteed. The technical problem that when the silver paste is filled, bubbles possibly appear in the silver paste, so that a circuit between the two copper wires cannot be conducted, the product quality is not up to the standard, and reworking is caused is solved.

Description

technical field [0001] The present application relates to the field of conductive paste, and in particular, to a formulation of conductive paste for hole filling and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and production is mostly carried out by process and standardization to reduce costs. Printed circuit boards usually play a role in electronic equipment to provide the necessary components for each component in the circuit. The support is convenient for each component to be inserted and realize its electrical connection. It is widely used in electronic devices. However, components that are sensitive to electromagnetic induction are prone to receive electromagnetic interference. Electromagnetic interference is usually eliminated by means of silver paste through holes. [0003] However, when filling the silver paste, due to the problem of throu...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/16H01B13/00
CPCH01B1/22H01B1/16H01B13/00
Inventor 杨甜甜殷文钢刘元哲何鑫泉高怀宇刘均
Owner NANO TOP ELECTRONICS TECH