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High-toughness epoxy resin adhesive and preparation method thereof

A technology of epoxy resin glue and high toughness, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve problems such as easy cracking, achieve the effect of low cost, wide source of raw materials, and improved ability

Pending Publication Date: 2022-06-07
温州神祐新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the present invention: In order to overcome the defects of the prior art, the present invention provides a high-toughness epoxy resin glue and its preparation method, which solves the problem that the curing process of special parts is not easy to crack at the present stage

Method used

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  • High-toughness epoxy resin adhesive and preparation method thereof
  • High-toughness epoxy resin adhesive and preparation method thereof
  • High-toughness epoxy resin adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0020] Example 1: B glue methyltetrahydrophthalic anhydride, cashew phenol and catalyst selection mass ratio of 1: 0.6: 8 ‰ in the reactor mixed uniformly, heating and heating, temperature control at 150 ° C, reaction time of 12h, the catalyst is sulfonic acid compounds, specifically toluenesulfonic acid, to obtain cashew phenol modified methyltetrahydrophthalic anhydride compound and methyltetrahydrophthalic anhydride, by mixing with A glue, its performance test.

Embodiment 2

[0021] Example 2: methyltetrahydrophthalic anhydride, cashew phenol and catalyst selected mass ratio of 1: 0.8: 1% in the reactor mixed uniformly, heating and heating, temperature control at 150 ° C, reaction time of 12h, the catalyst is a sulfonic acid compound, specifically to toluenesulfonic acid, to obtain cashew phenol modified methyltetrahydrophthalic anhydride compound and methyltetrahydrophthalic anhydride, by mixing with A glue, its performance test.

Embodiment 3

[0022] Example 3: methyltetrahydrophthalic anhydride, cashew phenol and catalyst selection mass ratio of 1: 0.7: 8 ‰ in the reactor mixed uniformly, heating and heating, temperature control at 150 ° C, reaction time of 12h, the catalyst is a sulfonic acid compound, specifically to toluenesulfonic acid, to obtain cashew phenol modified methyltetrahydrophthalic anhydride compound and methyltetrahydrophthalic anhydride, by mixing with A glue, its performance test.

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Abstract

The invention discloses a high-toughness epoxy resin adhesive and a preparation method thereof, relates to the field of epoxy resin adhesives, and solves the problem that the toughness requirement of special parts cannot be met at the present stage. Comprising an adhesive A and an adhesive B. The adhesive B comprises the following raw materials: methyl tetrahydrophthalic anhydride, cardanol and a catalyst, and a part of methyl tetrahydrophthalic anhydride, cardanol and the catalyst are mixed and subjected to a polymerization reaction to obtain a cardanol modified methyl tetrahydrophthalic anhydride compound. Cardanol modified methyl tetrahydrophthalic anhydride serves as a reaction product of methyl tetrahydrophthalic anhydride and cardanol and can serve as a curing agent of epoxy resin glue, and a benzene ring structure of cardanol has the characteristics of aromatic compounds, improves high temperature resistance and has the characteristics of a long straight chain alkyl structure, namely good flexibility, self-drying performance and the like. The adhesive B has a soft structure, cracking caused by curing shrinkage and temperature rise change is overcome, and the toughening effect is achieved.

Description

Technical field [0001] The present invention relates to the field of epoxy resin adhesives, in particular a high-toughness epoxy resin adhesive and a preparation method thereof. Background [0002] Epoxy resin glue generally refers to the epoxy resin as the main body of the adhesive, epoxy resin glue is based on the epoxy resin to reprocess or modify its characteristics, so that its performance parameters meet specific requirements, usually epoxy resin glue also needs to have a curing agent to use, and need to be mixed evenly before it can be fully cured, the general epoxy resin glue is called A glue or main agent, curing agent is called B glue or auxiliary, with high heat resistance, high strength, flame retardancy, voltage resistance characteristics, widely used in electronic and electrical and other fields. However, epoxy resin adhesive is used in special parts of electrical appliances, especially parts with more bends, which are very easy to crack during curing shrinkage and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C08G59/42
CPCC09J163/00C08G59/4215
Inventor 陈伟博孙王荣叶松阳张磊
Owner 温州神祐新材料有限公司
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