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Three-dimensional network polymer for adhesive and preparation method thereof

A three-dimensional network and polymer technology, applied in the direction of adhesives, adhesive types, epoxy glue, etc., can solve the problems of low dimensional stability, affecting applications, high water absorption, etc., to reduce interaction and promote linking ability , the effect of improving stability

Active Publication Date: 2022-07-01
江苏环峰电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the adhesive has a certain improvement in peel strength, the improvement is limited, and its hygroscopicity is slightly high, indicating that its dimensional stability is low, which affects its application
[0005] Epoxy resin has high adhesion, but its poor heat resistance, high water absorption, brittle texture and other defects limit its application

Method used

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  • Three-dimensional network polymer for adhesive and preparation method thereof
  • Three-dimensional network polymer for adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1 provides a three-dimensional network polymer for adhesive, and the preparation raw materials include: Polyimide (PI) powder, epoxy compound, and auxiliary agent.

[0044] The Polyimide (PI) powder is prepared from the following raw materials: 2.46 g of aromatic compound, 18.6 g of first carboxylic acid anhydride, 14.64 g of amino compound, 9.84 g of second carboxylic acid anhydride, 300 g of first solvent, 300 g of second solvent, and dehydrating agent 200g.

[0045] The aromatic compound is 1,3,5-triaminobenzene.

[0046] The first carboxylic anhydride is 4,4'-biphenyl ether dianhydride.

[0047] The amino compound is 3,5-bis(trifluoromethyl)-1,2-phenylenediamine.

[0048] The second carboxylic anhydride is 3-hydroxyphthalic anhydride.

[0049] The first solvent is N-methyl-2-pyrrolidone (NMP).

[0050] The second solvent is lignin.

[0051] The epoxy compound is a bisphenol F type epoxy resin.

[0052] The bisphenol F type epoxy resin was purchased ...

Embodiment 2

[0063] Example 2 provides a three-dimensional network polymer for an adhesive, and the specific implementation is the same as that of Example 1, except that the aromatic compound is p-methylphenethylamine.

Embodiment 3

[0065] Example 3 provides a three-dimensional network polymer for an adhesive, and the specific implementation is the same as that of Example 1, except that the amino compound is m-phenylenediamine.

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Abstract

The invention relates to the field of adhesives, in particular to the field of IPC C09J179, and more particularly relates to a three-dimensional network polymer for an adhesive and a preparation method of the three-dimensional network polymer. The three-dimensional network polymer is prepared from Polyimide (PI) powder and an epoxy compound; the Polyimide (PI) powder is prepared from the following raw materials in parts by weight: 1 to 10 parts of an aromatic compound, 5 to 20 parts of first carboxylic acid anhydride, 2 to 18 parts of an amino compound, 1 to 15 parts of second carboxylic acid anhydride, 50 to 400 parts of a first solvent, 100 to 500 parts of a second solvent and 100 to 300 parts of a dehydrating agent, the mass ratio of the Polyimide (PI) powder to the epoxy compound is 1: (0.5 to 2). When the three-dimensional network polymer is used as an adhesive, the bonding strength of the adhesive can be improved while the high thermal stability of the Polyimide (PI) is maintained.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to the field of IPC C09J179, and more particularly, to a three-dimensional network polymer for adhesives and a preparation method thereof. Background technique [0002] Polyimide (PI) is a high-performance polymer. Its main chain contains a very stable aromatic heterocyclic structure, which makes it have a series of excellent properties, such as mechanical properties, heat resistance, chemical stability, Radiation resistance, etc., its excellent properties make it suitable for use in many fields, but its difficulties in processing, poor solubility, and high rigidity limit its application in adhesives. [0003] In the prior art, in the prior art, the patent application document with the application publication number CN102618206A discloses a Polyimide (PI) adhesive, which is made of 4,4′-diaminodiphenyl ether, 3,3′,4,4 '-benzophenone tetracarboxylic dianhydride and 4-phenylethynyl phthalic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C09J163/02C08G73/10
CPCC09J179/08C08G73/1007C08G73/1039C08G73/1042C08G73/1053C08L63/00Y02E60/10
Inventor 张振宇李雪峰
Owner 江苏环峰电工材料有限公司
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