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High-reliability thermoelectric refrigeration sheet and packaging method thereof

A technology of thermoelectric cooling sheets and thermocouples, which is applied in the manufacture/processing of thermoelectric devices, parts of thermoelectric devices, and thermoelectric devices that only use the Peltier or Seebeck effect, etc. It can solve the problems of crack formation and affecting thermoelectric transport performance, etc.

Pending Publication Date: 2022-07-05
河南省科学院应用物理研究所有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The structure of the thermoelectric cooling sheet mainly includes the packaging substrate, P-type and N-type thermocouple pairs, and is connected by solder to form the device. However, the commonly used alloy solder will gradually become brittle with the increase of service time, and then form under the action of thermal stress. At the same time, frequent thermal shocks will also cause defects due to thermal mismatch between the package substrate and the solder, and between the thermoelectric material and the metallization layer, thereby affecting the thermoelectric transport performance

Method used

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  • High-reliability thermoelectric refrigeration sheet and packaging method thereof

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preparation example Construction

[0078] The invention provides a preparation method of a thermoelectric refrigeration sheet, comprising the following steps:

[0079] 1) preparing a nano metal needle cone structure on the surface of the copper structure layer of the copper clad substrate to obtain a copper clad substrate with nano metal needle cones on the surface;

[0080] A nickel metal barrier layer is deposited on the surface of the semiconductor material, and a nano-metal needle-taper structure is prepared on the nickel metal barrier layer to form the package connection surface A;

[0081] 2) compound porous graphene on the nano metal needle cone of the copper-clad substrate with the nano metal needle cone on the surface obtained in the above steps, to form the encapsulation connection surface B;

[0082] After the package connection surface A and the package connection surface B are butted together, a package connection layer is formed by hot pressing and packaging, and a thermoelectric cooling sheet is ...

Embodiment 1

[0109] see figure 1 , figure 1 It is a schematic diagram of the structure and packaging process of the thermoelectric refrigeration sheet prepared in the embodiment of the present invention.

[0110] Among them, 1 is the nano-nickel needle cone structure, 2 is the metal nickel layer, 3 is, 4 is, 5 is, 6 is the copper surface layer of the copper-clad ceramic substrate, 7 is the copper-clad ceramic substrate, 8 is the applied pressure, 9 for the hot plate.

[0111] like figure 1As shown, the encapsulation method of the thermoelectric refrigeration sheet of the present invention includes:

[0112] (1) The bonding surface of the thermoelectric element 3 is cleaned by a standard RCA process, then metal nickel 2 (Ni) is deposited on the substrate by a sputtering process with a thickness of 1 μm, and finally a nano-nickel needle-cone structure 1 is prepared on the nickel layer. Method Including: the raw materials used are nickel chloride hexahydrate (200g / L), boric acid (35g / L), ...

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Abstract

The invention provides a high-reliability thermoelectric refrigeration sheet. The high-reliability thermoelectric refrigeration sheet comprises a PN-type thermocouple pair, wherein a nickel layer is compounded on the surface of the PN-type thermocouple pair; the packaging connecting layer is compounded on the PN type thermocouple pair; the copper-clad substrate is compounded on the packaging connecting layer; and the packaging connection layer is made of a porous graphene-metal composite material. According to the invention, the crystal grains and the copper-clad ceramic substrate are connected through the packaging connection layer to form a conductive path. A porous graphene-metal composite structure is used for replacing a traditional alloy solder, on one hand, low-temperature metallurgical connection is achieved between nanometer cones due to the nanometer effect, on the other hand, the porous graphene can effectively enhance the strength of a connecting layer, meanwhile, the porous graphene serves as a flexible layer and can absorb thermal stress, and meanwhile, the porous graphene-metal composite structure can be used as a flexible layer. By changing the geometric structure of the porous graphene, regulation and control of the thermal expansion coefficient of the interface layer can be realized, so that effective thermal matching is realized, the thermal stress in a service environment is reduced, the reliability of a device is improved, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of semiconductor thermoelectric refrigeration, relates to a thermoelectric refrigeration sheet and a preparation method thereof, in particular to a high reliability thermoelectric refrigeration sheet and a packaging method thereof. Background technique [0002] Thermoelectric refrigerating sheet utilizes the Peltier effect of semiconductor materials. When direct current is passed through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple to achieve the purpose of cooling. The thermoelectric refrigeration system has no sliding parts and can be used in some occasions where space is limited, reliability is high, and there is no refrigerant pollution. It has broad application prospects in the fields of chip thermal management, high-frequency and high-speed optoelectronic devices, medical treatment, and industrial prec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/02H01L35/32H01L35/34H10N10/80H10N10/01H10N10/17
CPCH10N10/80H10N19/101H10N10/01H10N10/17
Inventor 宋晓辉张伟韩宇辉王其富吴顺丽王建业梁楠
Owner 河南省科学院应用物理研究所有限公司
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