Modified acrylic UV curing packaging adhesive and preparation method and application thereof

Abstract

The invention relates to the field of electronic and electrical materials, in particular to a modified acrylic acid UV curing packaging adhesive and a preparation method and application thereof. According to the liquid low-shrinkage single-component acrylic acid UV curing packaging adhesive, UV curing is achieved, and the curing speed is high; the thixotropic viscosity is suitable for filling large gaps, and the problem that the glue flows everywhere before being cured is solved; the high-speed automatic dispensing device is suitable for high-speed automatic dispensing, and the single dispensing head is 3500-4200 points / h, so that the time is saved, and the quality is improved; the adhesive has excellent adhesion to metal, glass, plastic and other base materials; the self-made modified resin is added, so that the cured colloid has certain toughness, and the sealing effect is greatly improved; and through matched use of the photoinitiator, the curing consistency is ensured, the curing shrinkage is low, and good temperature resistance is achieved.

Description

technical field [0001] The invention relates to the field of electronic and electrical materials, in particular to a modified acrylic UV-curable encapsulant and a preparation method and application thereof. Background technique [0002] At present, with the development of display technology, various optical products are constantly being introduced. Many of these displays use light guides to guide the light source. The light guide body is generally a solid original obtained by low pressure injection molding in the early stage; after the light provided by the light source enters the light guide body, it is guided by the light guide body and exits in a specific direction. Under the trend of product miniaturization, the use of slender light guides as light guides has become a trend of technological development. The shape is convenient for the user to control the light. [0003] For example, in the field of smart power meter technology, in order to facilitate the user to read ...

AI Technical Summary

Problems solved by technology

Generally, these LEDs will be soldered on the circuit board in a pin-type package, and for some circuit boards that cannot be wave-soldered with double-sided SMD, there are also products that use SMD LEDs instead of in-line LEDs, but SMD LEDs Lack of in-line LED light guides will cause astigmatism, light leakage, insufficient brightness, etc.

[0004] The existing light guide columns are assembled with a single light guide column. If there are many light source lamps on one PCB board, it takes a lot of time to assemble each light guide column, and the assembly efficiency is extremely low; , the existing light guide column assembly method is to insert the positioning column on the light guide column into the positioning hole opened on the PCB board, use a soldering iron to melt the part of the positioning column exposed to the positioning hole, and then assemble the light guide column to the PCB board, so that The assembly method is very inconvenient; moreover, the existing light guide column structure, when the light source lamp is located in the light guide column, the light guide column will reduce the light source uniformity of the light source lamp; in addition, when the existing light source lamp is located in the light guide column, The light guide column will reduce the light intensity of the light source lamp, causing the light emitted by the light source lamp to be not bright enough

In addition, the assembled product will have poor sealing performance due to tolerances, resulting in air leakage and water permeability. In light cases, the light guide performance will decrease, and in severe cases, the entire product will be scrapped.

At the same time, time-consuming assembly and high defect rate

Images