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High-precision multilayer circuit board and 3D printing preparation method thereof

A multi-layer circuit, 3D printing technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc. Problems such as low metal processing accuracy, to avoid thermal effects, small overall size, and reduced extrusion continuity

Active Publication Date: 2022-07-12
ENOVATE3D (HANGZHOU) TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Some 3D printing processes based on inkjet (Inkjet) or aerosol jet (Aerosol Jet), due to the large line width (tens of microns to hundreds of microns), the thickness of the insulating layer is thick (the minimum thickness is about 35um), The size of the vertical interconnect structure is too large (on the order of hundreds of microns), which limits the application of this type of technology in circuit boards with high layers and high-density interconnection scenarios. circuit board
Some 3D printing processes based on fused deposition modeling (Fused deposition modeling, FDM) can only be used to prepare insulating layers of specific materials due to the limitations of wire and melting technology, and the printing surface quality of FDM methods is poor, and the wiring layer and vertical interconnection structure It needs to be completed by other non-printing methods, and the interconnection precision is low
Some 3D printing processes based on selected laser sintering (SLS), selected laser cladding (SLM), electron beam selective melting (EBSM), direct laser metal sintering (DMLS) and other 3D printing processes need to use high-energy energy sources after powder coating or spraying. Metal sintering or melting, metal processing precision is low, not suitable for the preparation of precision multilayer circuit boards

Method used

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  • High-precision multilayer circuit board and 3D printing preparation method thereof
  • High-precision multilayer circuit board and 3D printing preparation method thereof
  • High-precision multilayer circuit board and 3D printing preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138] refer to figure 1 , figure 2 , this embodiment provides a high-precision multi-layer circuit board 3D printing preparation method, including the steps:

[0139] S1, extruding a nanoscale metal slurry with shear thinning properties through an extrusion port to form a three-dimensional circuit layer on the upper surface of the substrate;

[0140] S2, extruding the nano-scale metal slurry with shear thinning properties through the extrusion port, so as to form metal pillars by stacking at the preset position of the current three-dimensional circuit layer;

[0141] S3. An insulating layer is formed on the upper surface of the current three-dimensional circuit layer, and the corresponding metal pillars are drawn out of the formed insulating layer in advance by drilling holes in the insulating layer and filling with nano-scale metal paste (specifically according to each three-dimensional circuit layer). The connection requirements of the circuit layers and the height of th...

Embodiment 2

[0249] The difference between this embodiment and the first embodiment is that the multilayer circuit board is prepared on the sacrificial material, and the specific improvement is as follows:

[0250] 1. Step 3 in the second link described in Example 1 is changed to: the 6-inch standard silicon wafer substrate in the loading area (the surface of the 6-inch standard silicon wafer substrate is attached with sacrificial materials) Automatic / manual loading, start the CAM software, open Vacuum adsorption, the sample stage adsorbs the substrate, and the equipment is mechanically returned to zero alignment;

[0251] 2. Step 11 in the third link described in the first embodiment is changed to: turn off the vacuum adsorption and unload the material, and debond the sacrificial material through the corresponding chemical reagent to obtain an independent multi-layer circuit board;

[0252] 3. The remaining process links and their steps are consistent with those in the first embodiment. ...

Embodiment 3

[0254] The difference between this embodiment and the first embodiment is that the slit coating method is adopted, and the specific improvement is as follows:

[0255] 1. Slot coating method: Step 4 in the third link in Example 1 is changed to: after printing, the sample stage is moved to the starting position of coating, and the coating required for the current layer generated under the first link in Example 1 is changed. The thickness is 100um, the gap between the slit coating head and the substrate is adjusted to 100um, the discharge volume of the slit coating head is set to 2250uL and the discharge speed is 15uL / s, and the average moving speed of the coating head relative to the substrate is set to 1mm / s , the initial stage is slightly faster (1.2mm / s for 5s), the final stage is slightly slower (0.7mm / s for 5s), and then the coating process is started to complete the current insulating layer coating;

[0256] 2. The remaining process links and their steps are consistent wi...

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Abstract

The invention relates to a high-precision multilayer circuit board and a 3D printing preparation method thereof. The method comprises the following steps: S1, forming a three-dimensional circuit layer on the upper surface of a substrate; s2, stacking at a preset position of the current three-dimensional circuit layer to form a metal stand column; s3, an insulating layer is formed on the upper surface of the current three-dimensional circuit layer, and the corresponding metal columns are led out of the formed insulating layer in advance by punching the insulating layer and filling the insulating layer with nanoscale metal slurry; s4, if the current insulating layer is the top layer, forming a bonding pad layer on the upper surface of the current insulating layer and executing the step S5, and if not, taking the current insulating layer as a new substrate, repeatedly executing the steps S1-S2 and executing the step S6; s5, connecting the corresponding metal columns or connecting the corresponding metal columns to the bonding pad layer in a pre-leading-out mode to complete preparation of the multilayer circuit board; and S6, connecting the corresponding metal columns to the current three-dimensional circuit layer or connecting the corresponding metal columns to the current three-dimensional circuit layer in a pre-leading-out mode, and returning to the step S3. According to the invention, the high-precision multilayer circuit board with high interconnection precision can be prepared.

Description

technical field [0001] The invention belongs to the technical field of circuit board preparation, and in particular relates to a high-precision multi-layer circuit board and a 3D printing preparation method thereof. Background technique [0002] Multilayer circuit boards, commonly used in IC carrier (IC carrier), package substrate (package substrate), printed circuit board (PCB), Low Temperature Co-fired Ceramic (LTCC) substrate, etc., are The basics of electronic applications and products. Active devices (such as: power MOS, transistors, IC chips, etc.) and various other passive components (such as filters, transformers, resistors, capacitors and inductors, etc.) need to be assembled or embedded into multi-layer circuits after a certain packaging process. in the board. These substrates in turn need to be assembled with the next level of packaging in order to form a packaged system. Therefore, the multi-layer circuit board plays an important role in the electrical connect...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/40H05K3/24H05K3/22H05K3/00H05K1/02H05K1/09B33Y10/00B33Y70/10B33Y80/00
CPCH05K3/24H05K3/10H05K3/28H05K3/46H05K3/4664H05K2203/0126H05K2203/013H05K2203/1476H05K3/4069H05K3/1241H05K3/4647H05K3/0035H05K2201/09518B33Y10/00B29C64/106B33Y80/00B33Y70/10B29C64/188H05K3/1275H05K1/0284H05K1/0298H05K1/0306H05K1/0313H05K1/097H05K3/4626C09D133/02C09D167/00C09D7/20C09D7/61C08K3/08
Inventor 蔡王灿李赛锋周南嘉
Owner ENOVATE3D (HANGZHOU) TECH DEV CO LTD