Lignin adhesive as well as preparation method and application thereof
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A technology of lignin glue and lignin, which is applied in the field of adhesives, can solve the problems of heating rate, inconsistent temperature, uneven curing, insufficient infiltration of substrates, etc., and achieve the effect of uniform curing
Pending Publication Date: 2022-07-22
HENAN AGRICULTURAL UNIVERSITY
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Problems solved by technology
The main components of the adhesive are mostly organic polymer resins. The process of completing the bonding (the process of curing the adhesive) needs to control parameters such as temperature, pressure, and time. The process is complicated, and the time and production costs are high.
[0003] In related technologies, the curing of adhesives mainly includes thermal curing, light curing, etc.; limited by the transmission speed of heat and light in the adhesive, and the uniformity of light and heat distribution, when the raw materials of the adhesive are not mixed uniformly It will be subject to mass transfer resistance, resulting in inconsistent heating rate and temperature of each part, which will eventually lead to the difficulty of controlling the overall curing reaction and unsatisfactory product performance, that is, the curing rate of the adhesive at different positions is different.
[0004] At the same time, the degree of infiltration of the existing adhesive to the substrate is not enough, so the bonding strength between the adhesive and the substrate after curing does not meet the requirements, or the service life does not meet the requirements
[0005] In summary, the existing adhesives have the problems of uneven curing and low bonding strength between the cured and the substrate.
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Embodiment 1
[0091] This embodiment prepares a kind of lignin adhesive, and the concrete steps are:
[0092] S1. Activated lignin:
[0093] S1a. 10g of phenol was heated to 125°C, 3.5g of alkali lignin (CAS: 8068-05-1) was added thereto, and after the alkali lignin was dissolved; 0.2g of sulfuric acid aqueous solution with a concentration of 70% was added dropwise to the obtained mixture ; Due to the introduction of the acid catalyst, the pH of the reaction system is between 1 and 2;
[0094] Control the temperature to 125℃, and carry out the activation reaction for 0.5h;
[0095] S1b. Add 10 g of absolute ethanol to the reaction product obtained in step S1a, and stir evenly;
[0096] S1c. filter the obtained mixture of step S1b, collect the filtrate, and adopt distillation to remove the ethanol in the obtained filtrate;
[0097] In step S1c, the temperature and pressure of the distillation method are not limited, as long as the ethanol can be removed; however, the temperature of the di...
Embodiment 2
[0106] In this example, a lignin adhesive is prepared, and the difference from Example 1 is:
[0107] In step S3, also includes plasticizer dioctyl phthalate (CAS: 117-84-0) and functional filler silica (purchased from Shanghai McLean Biochemical Technology Co., Ltd., product number S824304);
[0108] Wherein, the mass ratio of plasticizer, functional filler and product obtained in step S2 is 1:10:100.
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Abstract
The invention discloses a lignin adhesive as well as a preparation method and application thereof, and the lignin adhesive is prepared from the following raw materials: a sound-sensitive material and resin, the sound-sensitive material comprises at least one of curcumin, titanium dioxide, iron powder, hypericin, hypocrellin and chlorophyll; the resin is lignin modified phenolic resin. The lignin adhesive provided by the invention can be matched with a microwave curing method, so that the curing rate and uniformity of the lignin adhesive are effectively improved, and meanwhile, the bonding strength between the cured adhesive and a base material is improved. The invention also provides a preparation method and application of the lignin adhesive.
Description
technical field [0001] The invention relates to the technical field of adhesives, in particular to a lignin adhesive and a preparation method and application thereof. Background technique [0002] Adhesion (bonding, bonding, gluing, gluing) refers to the technology in which the surfaces of homogeneous or dissimilar objects are joined together with adhesives, which have the characteristics of continuous stress distribution, light weight, or sealing, and most process temperatures are low. . Bonding is usually carried out with the aid of adhesives. The main components of the adhesive are mostly organic polymer resins. The process of bonding (the curing process of the adhesive) needs to control parameters such as temperature, pressure, time, etc., the process is complicated, and the time and production cost are high. [0003] In the related art, the curing of the adhesive mainly includes thermal curing, light curing, etc.; limited by the conduction speed of heat and light in t...
Claims
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