Monocrystalline silicon wafer cleaning machine and method for cleaning monocrystalline silicon wafer

Abstract

The invention provides a monocrystalline silicon wafer cleaning machine and a monocrystalline silicon wafer cleaning method.The cleaning machine comprises a cleaning basket containing groove, and a lower laser transmitter, a lower laser receiver and a plurality of lower spraying heads which are evenly arranged at intervals are arranged on the lower portion of the cleaning basket containing groove; an upper laser transmitter, an upper laser receiver and a plurality of upper spray heads which are uniformly arranged at intervals are arranged at the top of the machine body; a heating pipe surrounds the inner layer of the side wall of the upper-layer machine body, and a temperature sensor surrounds the inner side of the upper-layer machine body; the plurality of lower spray headers and the plurality of upper spray headers are communicated with an external water supply device, and each spray header is provided with an electromagnetic valve. According to the method, the control temperature and the spraying pressure output by the monocrystalline silicon wafer cleaning machine are controlled and optimized respectively, when the control temperature and the spraying pressure are optimal at the same time, spraying pressurization and heating are stopped, the monocrystalline silicon wafer is cleaned at the temperature and the spraying pressure, and the cleaning cleanliness and the flatness of the cleaned monocrystalline silicon wafer can be optimal.

Description

technical field [0001] The invention belongs to the technical field of single crystal silicon wafer cleaning devices, and particularly relates to a single crystal silicon wafer cleaning machine and a method for cleaning single crystal silicon wafers. Background technique [0002] Monocrystalline silicon wafers are prepared through a series of processes such as cutting, outer diameter grinding, spheronization, slicing, chamfering, grinding, etching, etching, cleaning and polishing. The process of partial cutting according to customer specifications, outer diameter grinding, spheronization, slicing, chamfering, and grinding are to perform preliminary roll grinding on the uneven surface of the outer diameter of the single crystal silicon rod, and then mark and locate the silicon wafer. Grinding of single crystal silicon rods with P-type or N-type silicon wafer cross-section, and then slicing, chamfering and grinding in sequence, when wire cutting is performed, polyethylene glyc...

AI Technical Summary

Problems solved by technology

[0005] However, the optimal adjustment of spray pressure and temperature adjustment in the entire technical solution lack specific optimization strategies, which cannot make the finished products of monocrystalline silicon wafers achieve optimal cleanliness and flatness.

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