Preparation method of oily sewage treatment dynamic membrane based on metal net-ceramic composite base membrane
A ceramic composite and sewage treatment technology, which is applied in the direction of osmosis/dialysis water/sewage treatment, separation methods, chemical instruments and methods, etc., can solve the problems of low porosity, uneven pore size, and blockage of suspended particles in ceramic membranes, and achieve extended Strong acid-base cleaning cycle, simple preparation process, and improved hydrophilicity
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Embodiment 1
[0029] A stainless steel sintered mesh with a pore size of 20 microns was used, and the stainless steel sintered mesh was ultrasonically cleaned with acetone, anhydrous ethanol and deionized water for 10 min, and then dried in dry nitrogen.
[0030] The alumina ceramic was installed on the magnetron sputtering target, the sputtering direction was directed to the central substrate stage, the included angle with the vertical axis was 30°, and the target-base distance was 100 mm. Place the stainless steel mesh on the sample stage of the sputtering chamber, close the door of the sputtering chamber, and pump the chamber to vacuum. Switch the argon gas to the ion source, turn on the Kaufman ion source, and perform ion cleaning on the sample surface for 300 s. Switch the passage of argon gas to the sputtering chamber, keep the working pressure in the sputtering chamber at 1Pa, set the sputtering power to 300W, and start the coating, and the coating time is 15min. A ceramic coating w...
Embodiment 2
[0034] A stainless steel sintered mesh with a pore size of 30 microns was used, and the stainless steel sintered mesh was ultrasonically cleaned with acetone, anhydrous ethanol and deionized water for 10 min, and then dried in dry nitrogen.
[0035] The alumina ceramic was installed on the magnetron sputtering target, the sputtering direction was directed to the central substrate stage, the included angle with the vertical axis was 30°, and the target-base distance was 100 mm. Place the stainless steel mesh on the sample stage of the sputtering chamber, close the door of the sputtering chamber, and pump the chamber to vacuum. Switch the argon gas to the ion source, turn on the Kaufman ion source, and perform ion cleaning on the sample surface for 300 s. Switch the passage of argon gas to the sputtering chamber, keep the working pressure in the sputtering chamber at 1Pa, set the sputtering power to 300W, and start the coating for 15min. A ceramic coating with a thickness of ab...
Embodiment 3
[0039] A copper mesh with a pore size of 20 microns was used, and the copper mesh was ultrasonically cleaned with acetone, absolute ethanol and deionized water for 10 min in turn, and then dried in dry nitrogen.
[0040] The alumina ceramic was installed on the magnetron sputtering target, the sputtering direction was directed to the central substrate stage, the included angle with the vertical axis was 30°, and the target-base distance was 100 mm. Place the copper mesh on the sample stage of the sputtering chamber, close the door of the sputtering chamber, and pump the chamber to vacuum. Switch the argon gas to the ion source, turn on the Kaufman ion source, and perform ion cleaning on the sample surface for 300 s. Switch the passage of argon gas to the sputtering chamber, keep the working air pressure in the sputtering chamber at 1Pa, set the sputtering power to 300W, and start the coating for 10min. A ceramic coating with a thickness of about 0.15 microns was obtained.
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